JPS624128A - Automatic separation and feed mechanism in semiconductor element manufacture - Google Patents

Abstract

PURPOSE:To make semiconductor elements separable without receiving any influence of their resin flash, by installing a projection, pushing a front end of the succeeding element more upward than a rear end of the forefront row element, in a stopping position of the succeeding semiconductor element following the semiconductor element at the forefront row. CONSTITUTION:At a feed rail 5, a projection 6 is installed in a stopping position of a succeeding semiconductor element 1b floowing a semiconductor element 1a at the forefront row, and a front stopper 3 goes up and a rear stopper 4 presses the semiconductor 1b to the feed rail 5 whereby a tip end of the semiconductor element 1b is pushed up, and any influence of a resin flash is avoided. And, the projection 6, the front stopper 3 and the rear stopper 4 are displaced in arrow A, B and C directions each and they are set to respective optional positions whereby a tip lifting valve of a semiconductor 1 is set to an optional value even to types different in length each, thus commonability is giveable to other types.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an automatic separation and supply mechanism in the manufacture of semiconductor devices.

[Conventional technology]

Conventionally, the separation and supply method when the semiconductor element 1 falls freely is to stop the semiconductor element 1α in the front row by a front stopper 3 as shown in FIG. The front stopper 3 is raised at the same time as the element 1b is held down and stopped. As a result, only the semiconductor elements 1 in the front row were separated and dropped, and by repeating the operations shown in FIGS. 3 and 4 alternately, the semiconductor elements 1 were separated and supplied intermittently and continuously.

[Problem that the invention seeks to solve]

According to the conventional method, resin burrs 2 generated during the mold sealing process of the semiconductor element 1 as shown in FIG. 2(5), a3) are removed by the separation mechanism on the supply rail 5 as shown in FIG. If they overlap, the rear stopper 4 presses the succeeding semiconductor element 1b, and the semiconductor element 1α in the front row is fixed by the resin burr 2, resulting in a drawback that separate supply cannot be performed.

In order to solve this problem, there is a method of avoiding the influence of the resin burr 2 on the semiconductor element 1b held down by the rear stopper 4 by providing a step 5α on the supply rail 5 as shown in FIG. In this system, as the variety of semiconductor elements 1 changes, the total length also changes, so the difference in level of the supply rail 50 cannot correspond to each length.

The conventional method of adapting to different types has the drawback that each time the length of the semiconductor element 1 changes, the supply rail 5, which has a step depending on the length, must be replaced, and it takes a lot of time to change the type.

The present invention solves the above problems and provides an automatic separation mechanism that separates semiconductor devices individually without being affected by resin particles.

[Means for solving problems]

In the present invention, a front stopper closes the conveyance path for semiconductor elements that are slid one after the other to temporarily stop the flow of semiconductor elements, and the rear stopper presses the succeeding semiconductor elements, leaving the semiconductor elements in the front row, to restrict their movement. Then, in an automatic separation and supply mechanism that repeatedly opens the front stopper and slides only the semiconductor chips in the front row, the semiconductor chips are separated into individual semiconductor chips. An automatic separation and supply mechanism for manufacturing semiconductor devices is provided with a protrusion that slides on the front side of a succeeding semiconductor device and pushes the front side of the device upwardly above the rear end of the front-row semiconductor device.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

As shown in FIG. 1, on the supply rail 5, a protrusion 6 is provided at the stop position of the semiconductor device 1b following the semiconductor device 1α in the front row, so that the front stopper 3 is raised and the rear stopper 4 is stopped when the semiconductor device 1b is stopped. By pressing it against the supply rail 5, the tip of the semiconductor element 1α is pushed up and the influence of the resin burr 2 is avoided. In addition, by displacing the protrusion 6, front stopper 3, and rear stopper 4 in the directions of arrows A, B, and C and setting them at arbitrary positions, the amount of lifting of the tip of the semiconductor element 1 can be adjusted arbitrarily even for products with different lengths. It is also possible to set it to the amount of , so that it can be used in common with other varieties.

〔Effect of the invention〕

The present invention provides a projection 6 provided in advance on the supply rail 5.
Therefore, when the semiconductor element 1b is pressed against the supply rail 5 by the rear stopper 4, the tip of the succeeding semiconductor element 1b is lifted, so that stable separation and supply can be performed without being affected by the resin burr 2. In addition, by arbitrarily selecting the setting positions of the protrusion 6 on the supply rail 5, the front stopper 3, and the rear stopper 4, it is possible to set the tip lifting amount of semiconductor devices 1 of other types with different lengths to any desired value. It also has the effect of being easily compatible with other types of products.

[Brief explanation of the drawing]

FIG. 1 is a front view showing an embodiment of the present invention, FIG. 2 (5) is a front view of a semiconductor element, CB) is a side view of the same, and FIG. FIG. 4 is a diagram showing the basic operation of separation and supply, FIG. 5 is a diagram showing the influence of resin paris, and FIG. 6 is a diagram showing a conventional solution. lcL, lb...Semiconductor element 2...Resin pad 3...Front stopper 4...Rear stopper 5.°
・Supply rail 6...Protrusion patent applicant Kyushu NEC Co., Ltd. (A) Figure 2 Figure 4

Claims (1)

[Claims] (1) A front stopper closes the conveyance path for semiconductor elements that are slid back and forth, and the flow of semiconductor elements is temporarily stopped, and the rear stopper presses the succeeding semiconductor elements, leaving the semiconductor elements in the front row, to restrict their movement. In an automatic separation and supply mechanism that separates semiconductor devices individually by repeatedly opening the front stopper and sliding only the semiconductor devices in the front row,
A protrusion is provided at the stop position of the succeeding semiconductor element following the semiconductor element in the front row, so that the front side of the succeeding semiconductor element rides on it due to sliding and pushes the front end of the semiconductor element upwardly above the rear end of the semiconductor element in the front row. Automatic separation and supply mechanism for semiconductor device manufacturing.