JPS6240892U

JPS6240892U -

Info

Publication number: JPS6240892U
Application number: JP13211585U
Authority: JP
Priority date: 1985-08-29
Filing date: 1985-08-29
Publication date: 1987-03-11

Description

[Brief explanation of the drawing]

第１図はこの考案の一実施例を示すもので電子
装置全体の斜視図、第２図は第１図のＡ―Ａ線断
面図、第３図は第１図のＢ―Ｂ線断面図、第４図
は第１図と同方向から見た従来技術を示す図、第
５図は第４図のＣ―Ｃ線断面図である。図において、１は回路モジユール、２は放熱板
、３はプリント配線板、４は回路部品、５は箱体
、６は送風路、７は冷媒、８は構造部材、９はダ
クト、１０は熱の流れ、１１は隔壁部材、１２は
切り込み、１３は放熱フインである。なお各図中
同一符号は同一または相当部分を示す。 Fig. 1 shows an embodiment of this invention, and is a perspective view of the entire electronic device, Fig. 2 is a sectional view taken along line AA in Fig. 1, and Fig. 3 is a sectional view taken along line BB in Fig. 1. , FIG. 4 is a diagram showing the prior art seen from the same direction as FIG. 1, and FIG. 5 is a sectional view taken along the line CC in FIG. 4. In the figure, 1 is a circuit module, 2 is a heat sink, 3 is a printed wiring board, 4 is a circuit component, 5 is a box, 6 is a ventilation path, 7 is a refrigerant, 8 is a structural member, 9 is a duct, and 10 is a heat 11 is a partition member, 12 is a notch, and 13 is a heat radiation fin. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims

[Scope of utility model registration request]

When the required number of circuit modules, in which circuit components are mounted on printed wiring boards via heat sinks, are housed in a box, and then loaded onto an aircraft and operated,
In an aircraft-mounted electronic device configured to radiate heat generated by the circuit components using gas as a refrigerant, the circuit module is located in a direction perpendicular to the direction in which the circuit module is inserted into the box body; A partition wall member having a substantially channel-shaped cross section is installed on the inner surface of the box facing inward with respect to the center, thereby forming a ventilation path with a rectangular gap, through which the refrigerant flows. Furthermore, notches are provided in the partition member and heat dissipation fins are provided at both ends of the circuit module, so that when the circuit module is inserted into the box body, the heat dissipation fins provided at both ends of the circuit module are inserted into the notches. A heat dissipation structure for an aircraft-mounted electronic device, characterized in that the heat dissipation structure is configured such that the heat dissipation structure penetrates through the section and is directly exposed to the refrigerant in the air passage.