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JPS6237935U - - Google Patents

Info

Publication number
JPS6237935U
JPS6237935U JP12922685U JP12922685U JPS6237935U JP S6237935 U JPS6237935 U JP S6237935U JP 12922685 U JP12922685 U JP 12922685U JP 12922685 U JP12922685 U JP 12922685U JP S6237935 U JPS6237935 U JP S6237935U
Authority
JP
Japan
Prior art keywords
light
roughened
resin
transmitting window
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12922685U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12922685U priority Critical patent/JPS6237935U/ja
Publication of JPS6237935U publication Critical patent/JPS6237935U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Light Receiving Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の第一の実施例を示す縦断面図
である。第2図は本考案の第二の実施例を示す縦
断面図である。 1…電気絶縁性基板、2…半導体ペレツト、3
…金属細線、4…キヤツプ、5…熱硬化性樹脂、
6…枠体。
FIG. 1 is a longitudinal sectional view showing a first embodiment of the present invention. FIG. 2 is a longitudinal sectional view showing a second embodiment of the present invention. 1... Electrical insulating substrate, 2... Semiconductor pellet, 3
...Thin metal wire, 4...Cap, 5...Thermosetting resin,
6...Frame body.

Claims (1)

【実用新案登録請求の範囲】 (1) 透光窓となるキヤツプの周縁部の樹脂封止
面が粗面化されていることを特徴とする透光窓を
有する半導体装置。 (2) 粗面化された樹脂封止部分をキヤツプ両面
に設け、上面の粗面部には樹脂を介して枠体が設
けられていることを特徴とする実用新案登録請求
の範囲第(1)項記載の透光窓を有する半導体装置
[Claims for Utility Model Registration] (1) A semiconductor device having a light-transmitting window, characterized in that the resin-sealed surface of the periphery of the cap, which serves as the light-transmitting window, is roughened. (2) Utility model registration claim No. (1) characterized in that roughened resin-sealed portions are provided on both sides of the cap, and a frame is provided on the roughened upper surface portion with resin interposed therebetween. A semiconductor device having a light-transmitting window as described in 1.
JP12922685U 1985-08-23 1985-08-23 Pending JPS6237935U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12922685U JPS6237935U (en) 1985-08-23 1985-08-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12922685U JPS6237935U (en) 1985-08-23 1985-08-23

Publications (1)

Publication Number Publication Date
JPS6237935U true JPS6237935U (en) 1987-03-06

Family

ID=31025614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12922685U Pending JPS6237935U (en) 1985-08-23 1985-08-23

Country Status (1)

Country Link
JP (1) JPS6237935U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019129224A (en) * 2018-01-24 2019-08-01 京セラ株式会社 Package and electronic apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019129224A (en) * 2018-01-24 2019-08-01 京セラ株式会社 Package and electronic apparatus

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