JPS6237352B2 - - Google Patents
Info
- Publication number
- JPS6237352B2 JPS6237352B2 JP61048877A JP4887786A JPS6237352B2 JP S6237352 B2 JPS6237352 B2 JP S6237352B2 JP 61048877 A JP61048877 A JP 61048877A JP 4887786 A JP4887786 A JP 4887786A JP S6237352 B2 JPS6237352 B2 JP S6237352B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit element
- base member
- mounting
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000003990 capacitor Substances 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000008393 encapsulating agent Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
- G04G17/04—Mounting of electronic components
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electric Clocks (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、電子時計の回路ブロツクの実装方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for mounting circuit blocks of an electronic timepiece.
従来、電子時計の回路実装は、回路素子を湿
気、衝撃等から保護絶縁するために、回路素子を
各々モールドして取付けるか、又は、一般にポツ
テイングと呼ばれる手段、即ち、回路のベース部
材凹部に回路素子を配し溶融樹脂を流し込み凝固
させ封止する手段で行つていた。 Conventionally, circuits for electronic watches have been mounted by molding and mounting the circuit elements individually in order to protect and insulate the circuit elements from moisture, shock, etc., or by a method generally called potting, that is, by placing the circuit in a recess in the base member of the circuit. This was accomplished by arranging the elements and pouring molten resin to solidify and seal.
第１図、第２図は従来からの実装方法を示した
ものである。 FIGS. 1 and 2 show a conventional mounting method.
第１図は、モールドによる実装方法を示す。１
はICチツプ、２はICリード板、３はモールド剤
である。即ち、ICチツプ１は、ICリード板２に
固着され、ワイヤーボンデイングした後モールド
される。抵抗片４、コンデンサーチツプ５も同様
にモールドし、各々のリード板６，７によつて回
路基板８上に固着される。第２図はポツテイング
による実装方法を示す。ICチツプ１、抵抗片
４、コンデンサーチツプ５等の回路素子は、回路
ベース部材である回路基板８上に凹部内に、各々
のリード板２，６，７によつて接続固着し、溶融
合成樹脂９を流し込み凝固させ封止したものであ
る。このモールドによる実装は、回路素子毎にモ
ールドするため、全体が大型化する欠点を持ち、
近来の時計の小型化とは逆行する。又、ポツテイ
ングによる実装は、溶融樹脂を扱うため作業が繁
雑である。樹脂量の管理が困難、外観が不均一で
ある。更には、溶融樹脂が凝固するま時間がかか
り取扱上甚だ不便であるというような欠点を有し
ていた。その上、溶融樹脂が、流れ出さないよう
にするのには、第２図に示した如くの流れ出し防
止用の壁８ａも必要となる欠点も有していた。 FIG. 1 shows a mounting method using a mold. 1
2 is an IC chip, 2 is an IC lead plate, and 3 is a molding agent. That is, the IC chip 1 is fixed to the IC lead plate 2, wire bonded, and then molded. The resistor piece 4 and capacitor chip 5 are similarly molded and fixed onto the circuit board 8 by respective lead plates 6 and 7. Figure 2 shows a mounting method using potting. Circuit elements such as an IC chip 1, a resistor piece 4, and a capacitor chip 5 are connected and fixed in a recess on a circuit board 8, which is a circuit base member, by means of respective lead plates 2, 6, and 7. 9 was poured, solidified, and sealed. This mold mounting has the disadvantage of increasing the overall size because each circuit element is molded.
This goes against the trend of smaller watches in recent years. Furthermore, mounting by potting is complicated because it involves handling molten resin. It is difficult to control the amount of resin, and the appearance is uneven. Furthermore, it has the disadvantage that it takes time for the molten resin to solidify, making it extremely inconvenient to handle. Moreover, in order to prevent the molten resin from flowing out, a wall 8a for preventing flow out as shown in FIG. 2 is also required.
本発明の目的は上述の欠点を解決し、モールド
作業を容易にするとともに、小型の回路ブロツク
を形成できる回路ブロツクの実装方法を提供する
ものである。 SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned drawbacks and to provide a method for mounting a circuit block, which facilitates the molding operation and allows the formation of small-sized circuit blocks.
以下、図面に従い本発明を詳細に説明する。 Hereinafter, the present invention will be explained in detail with reference to the drawings.
第３図、第４図は本発明による実装方法を示し
たものである。まず、第３図の如く、回路ベース
部材である回路基板８上に、ICチツプ１、抵抗
片４、コデンサーチツプ５等の回路素子を各々の
リード板２，６，７によつて回路基板８に接続固
着し、あらかじめ適当な形状に成形された封止部
材１０，１１，１２で前記回路素子を覆うよう回
路基板８の凹部に挿入する。この封止部材１０，
１１，１２は、熱変形温度が回路ケースの熱変形
温度よりも低く、回路素子の特性変化開始温度よ
りも低い材質により成形されている。次に、第３
図の状態のまま、調切な温度に加熱し封止部材１
０，１１，１２のみ熱変形、更には溶融させたも
のが第４図で示した状態である。即ち、固形封止
部材を溶かし、回路素子を直接回路ベース上に封
止したものである。 3 and 4 show a mounting method according to the present invention. First, as shown in FIG. 3, circuit elements such as an IC chip 1, a resistor piece 4, a coder chip 5, etc. are mounted on a circuit board 8, which is a circuit base member, by means of lead plates 2, 6, and 7. The sealing members 10, 11, and 12 are inserted into the recess of the circuit board 8 so as to be connected and fixed, and the circuit elements are covered with the sealing members 10, 11, and 12, which have been previously formed into a suitable shape. This sealing member 10,
11 and 12 are made of a material whose thermal deformation temperature is lower than that of the circuit case and lower than the characteristic change start temperature of the circuit element. Next, the third
Heat the sealing member 1 to an appropriate temperature in the state shown in the figure.
The state shown in FIG. 4 is that only 0, 11, and 12 are thermally deformed and further melted. That is, the solid sealing member is melted and the circuit elements are directly sealed onto the circuit base.
上述の通りの実装方法であつて、封止部材は任
意の形状に成形できる上、固形であるため取扱い
が容易であり、ベルト炉と組み合わせれば自動化
も可能である。回路素子は個々に封止できること
は言うまでもないが、回路素子全体を同時に封止
することもでき、この場合は、回路ブロツク全体
を小型化することができる利点もある。封止部材
は射出成形によれば簡単で、体積（重量）の管理
も容易で均一である。 In the mounting method described above, the sealing member can be molded into any shape, and since it is solid, it is easy to handle, and automation is possible when combined with a belt furnace. It goes without saying that the circuit elements can be sealed individually, but the entire circuit element can also be sealed at the same time, and in this case there is an advantage that the entire circuit block can be miniaturized. The sealing member is simple by injection molding, and the volume (weight) can be easily controlled and uniform.
以上の如く本発明によれば、封止部材が回路ベ
ース部材よりも熱変形温度の低い合成樹脂から形
成され、固形になつているため取扱いが容易であ
り、樹脂量の管理が容易である。 As described above, according to the present invention, the sealing member is formed from a synthetic resin having a lower heat deformation temperature than the circuit base member and is solid, so that it is easy to handle and the amount of resin can be easily controlled.
更に、回路素子上面と凹状封止剤の間の隙間を
設けたことにより、加熱時に封止剤に均一に熱が
行き渡ることになり、封止剤が回路素子に応力を
かけたり、回路素子の剥離をもたらすといつた問
題を生じることもなく、迅速で確実な封止が可能
なものである。 Furthermore, by providing a gap between the top surface of the circuit element and the concave encapsulant, heat is evenly distributed to the encapsulant during heating, which prevents the encapsulant from applying stress to the circuit element or causing damage to the circuit element. Quick and reliable sealing is possible without causing problems such as peeling.
第１図、第２図は従来の実装方法による回路ブ
ロツクの断面図、第３図、第４図は、本発明によ
る実装手段を示す回路ブツク断面図である。
１……ICチツプ、４……抵抗片、５……コン
デンサーチツプ、８……回路基板、１０，１１，
１２……封止部材。
1 and 2 are cross-sectional views of a circuit block using a conventional mounting method, and FIGS. 3 and 4 are cross-sectional views of a circuit book showing a mounting means according to the present invention. 1...IC chip, 4...Resistor piece, 5...Capacitor chip, 8...Circuit board, 10, 11,
12...Sealing member.
Claims (1)
路ベース部材に接続固定し、前記回路ベース部材
よりも熱変形温度が低い合成樹脂からなる封止剤
を凹状に形成して固形化するとともに、前記凹状
の部分を前記回路素子に被せたとき前記回路素子
との間に隙間があるよう形成し、前記封止剤を前
記回路素子にかぶせて前記回路ベース部材上に載
置し、その後加熱して熱変形後硬化させて前記回
路素子を封止することを特徴とする電子時計の回
路ブロツク実装方法。1. Circuit elements such as ICs, capacitors, and resistors are connected and fixed to a circuit base member, and a sealing agent made of a synthetic resin having a heat deformation temperature lower than that of the circuit base member is formed into a concave shape and solidified, and the concave shape is formed so that there is a gap between the circuit element and the circuit element, and the sealing agent is placed on the circuit base member by covering the circuit element, and then heated to heat the circuit element. A method for mounting a circuit block for an electronic watch, characterized in that the circuit element is sealed by curing after deformation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61048877A JPS61228377A (en) | 1986-03-06 | 1986-03-06 | Electronic clock circuit block implementation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61048877A JPS61228377A (en) | 1986-03-06 | 1986-03-06 | Electronic clock circuit block implementation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61228377A JPS61228377A (en) | 1986-10-11 |
| JPS6237352B2 true JPS6237352B2 (en) | 1987-08-12 |
Family
ID=12815510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61048877A Granted JPS61228377A (en) | 1986-03-06 | 1986-03-06 | Electronic clock circuit block implementation method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61228377A (en) |
-
1986
- 1986-03-06 JP JP61048877A patent/JPS61228377A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61228377A (en) | 1986-10-11 |
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