JPS6233343Y2 - - Google Patents
Info
- Publication number
- JPS6233343Y2 JPS6233343Y2 JP9322082U JP9322082U JPS6233343Y2 JP S6233343 Y2 JPS6233343 Y2 JP S6233343Y2 JP 9322082 U JP9322082 U JP 9322082U JP 9322082 U JP9322082 U JP 9322082U JP S6233343 Y2 JPS6233343 Y2 JP S6233343Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- die stage
- die
- double
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9322082U JPS58195453U (ja) | 1982-06-22 | 1982-06-22 | リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9322082U JPS58195453U (ja) | 1982-06-22 | 1982-06-22 | リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58195453U JPS58195453U (ja) | 1983-12-26 |
| JPS6233343Y2 true JPS6233343Y2 (zh) | 1987-08-26 |
Family
ID=30223916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9322082U Granted JPS58195453U (ja) | 1982-06-22 | 1982-06-22 | リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58195453U (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0732223B2 (ja) * | 1985-01-11 | 1995-04-10 | 三菱電機株式会社 | 半導体装置 |
-
1982
- 1982-06-22 JP JP9322082U patent/JPS58195453U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58195453U (ja) | 1983-12-26 |
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