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JPS6228095A - Processing method by laser beam - Google Patents

Processing method by laser beam

Info

Publication number
JPS6228095A
JPS6228095A JP60167403A JP16740385A JPS6228095A JP S6228095 A JPS6228095 A JP S6228095A JP 60167403 A JP60167403 A JP 60167403A JP 16740385 A JP16740385 A JP 16740385A JP S6228095 A JPS6228095 A JP S6228095A
Authority
JP
Japan
Prior art keywords
laser beam
workpiece
nozzle
melt
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60167403A
Other languages
Japanese (ja)
Inventor
Seiichi Hayashi
清一 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komatsu Ltd
Original Assignee
Komatsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ltd filed Critical Komatsu Ltd
Priority to JP60167403A priority Critical patent/JPS6228095A/en
Publication of JPS6228095A publication Critical patent/JPS6228095A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To permit deep grooving even if a laser beam of low output is used and to prevent sticking of a melt by irradiating the laser beam plural times to the same spot of a work thereby processing the work. CONSTITUTION:A nozzle 11 is moved along the surface of the work 10 and the laser beam is emitted therefrom to process the groove 12. The laser beam of the low output is used and oxygen is used for an assist gas in this stage. The nozzle 11 is then moved in one direction for processing and is then moved in a backward direction at the same point. Such operation is repeated plural times to execute the irradiation. The deep groove is thus processed even if the laser beam of the low output is used and since the melt is oxidized by the oxygen and is blown off by the gas, the sticking of the melt to the work surface is obviated.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、レーザビームによって被加工物を加工する方
法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for processing a workpiece with a laser beam.

従来の技術 レーザビームを発射するノズルを被加工物に沿って移動
してレーザビームを被加工物の表面に照射してケガキ等
の溝加工を行な5加工方法が知られ、この様な加工方法
で深い溝を加工するには高出力のレーザビームを用いた
り、加工速度、つまりノズルの移動速度を遅くしたりし
ている。
Conventional technology Five processing methods are known in which a nozzle that emits a laser beam is moved along the workpiece and the laser beam is irradiated onto the surface of the workpiece to create grooves such as markings. To process deep grooves using this method, a high-power laser beam is used or the processing speed, that is, the nozzle movement speed, is slowed down.

発明が解決しようとする問題点 高出力のレーザビームを用いると第5図に示すよ5に溶
融物1が被加工物2の表面に付着して被加工物の品質を
悪くする。
Problems to be Solved by the Invention When a high-power laser beam is used, as shown in FIG. 5, the melt 1 adheres to the surface of the workpiece 2, degrading the quality of the workpiece.

特に、アシストガスとして不活性ガスを用いると、溶融
物が酸化されないので溶融物が被加工物表面に付着し、
かつ付着した溶融物は硬いので排除が面倒となる。
In particular, when an inert gas is used as the assist gas, the molten material is not oxidized, so the molten material adheres to the surface of the workpiece.
In addition, since the adhered molten material is hard, it is difficult to remove it.

問題点を解決するための手段及び作用 レーザビームを被加工物の同一箇所に複数回照射して加
工するようにすることで、低出力のレーザビームな用い
ても深い溝を加工したりできるようKしたものである。
Means and effects for solving the problem By irradiating the same part of the workpiece with the laser beam multiple times for processing, it is possible to process deep grooves even with a low-power laser beam. K.

実施例 被加工物10の表面ICiってレーザビームを発射する
ノズル11を移動することでレーザビームを照射して溝
12を加工する。
EXAMPLE A groove 12 is processed by irradiating a laser beam on the surface ICi of a workpiece 10 by moving a nozzle 11 that emits a laser beam.

この時、レーザビームを高出力とすると溶融物が被加工
物10の表面に吹き上るので低出力のレーザビームを用
いると共に、アシストガスとしては酸素を用いて溶融物
を配化させ、被加工物10表面への付着を防止する。な
お、レーザビームの出力制御装置を備えている場合には
溶融物の吹き上りがない程度の出力とする。
At this time, if the laser beam is set to high power, the melt will blow up onto the surface of the workpiece 10, so a low power laser beam is used, and oxygen is used as an assist gas to arrange the melt, and the workpiece is 10 Prevents adhesion to surfaces. In addition, if a laser beam output control device is provided, the output should be set to such an extent that the melt does not blow up.

そして、ノズル11を加工しようとする形状に一方向に
移動させ、この後に同一箇所にレーザビームを照射する
ように他方向に移動させ、再び一方向に移動させること
で、低出力のレーザビームを用いて希望する深さの溝1
2を加工する。つまり、同一箇所にレーザビームを複数
回照射すれば良い。
Then, the nozzle 11 is moved in one direction to the shape to be processed, then moved in the other direction so as to irradiate the same spot with the laser beam, and then moved in the same direction again to emit a low-power laser beam. Groove 1 of desired depth using
Process 2. In other words, it is sufficient to irradiate the same location with the laser beam multiple times.

この様にすることで低出力のレーザビームを用いて深い
溝加工ができる。
By doing this, deep groove processing can be performed using a low-power laser beam.

また、溶融物はアシストガスとしての酸素により酸化さ
れ、アシストガスの流れによって吹き飛ばされ被加工物
の表面には付着しない。
Further, the melt is oxidized by oxygen as the assist gas, and is blown away by the flow of the assist gas, so that it does not adhere to the surface of the workpiece.

また、加工する溝の深さをレーザビームを照射する回数
を制御することで任意で調整できる。
Furthermore, the depth of the groove to be processed can be adjusted as desired by controlling the number of times the laser beam is irradiated.

前述のノズル11としては例えば第2図に示すものが好
ましい。
As the above-mentioned nozzle 11, for example, the one shown in FIG. 2 is preferable.

つまり、Zn5e 、 CaAs等レーザビームが通過
する材料より成るウィンドウ20の下方にレンズ21を
設けてレーザビームを集束してノズル孔22より発射す
ると共に、アシストガス入口23を前記ノズル孔22及
びウィンドウ20とレンズ21との間の圧力室24とに
開口連通して、アシストガスがレンズ21の上面と下面
とに作用して高圧のアシストガスな用いてもレンズ21
が破損しないよ51Ct、である。
That is, a lens 21 is provided below the window 20 made of a material through which the laser beam passes, such as Zn5e or CaAs, and the laser beam is focused and emitted from the nozzle hole 22, and the assist gas inlet 23 is connected to the nozzle hole 22 and the window 20. The opening communicates with the pressure chamber 24 between the lens 21 and the lens 21, and the assist gas acts on the upper and lower surfaces of the lens 21.
It is 51Ct, which will not be damaged.

これに対して、アシストガスをノズル孔22のみに供給
するノズルであると、アシストガスの圧力がレンズ21
の下面にのみ作用するので、高圧のアシストガスな用い
るとレンズ21が破損することがある。
On the other hand, if the nozzle supplies assist gas only to the nozzle hole 22, the pressure of the assist gas will be lower than the lens 21.
Since it acts only on the lower surface of the lens 21, the lens 21 may be damaged if a high-pressure assist gas is used.

また、被加工物を切断する場合には第3図に示すように
、被加工物10の下面に4つの補助ノズル30を被加工
物10と所定の角度θを持って第4図に示すように配設
し、ノズル;1よリレーザビーム31とアシストガス3
2とを被加工物10の表面に照射すると共に、補助ノズ
ル30よりアシストガスと同種のガスを加工部、つまり
切断部33Vc噴出するようにすれば良い。
In addition, when cutting a workpiece, as shown in FIG. 3, four auxiliary nozzles 30 are placed on the bottom surface of the workpiece 10 at a predetermined angle θ with the workpiece 10, as shown in FIG. Nozzle; 1, relay laser beam 31 and assist gas 3
2 onto the surface of the workpiece 10, and at the same time, the same type of gas as the assist gas may be ejected from the auxiliary nozzle 30 to the processing section, that is, the cutting section 33Vc.

、 この様にすればレーザビームが被加工物の表面に照
射されて被加工物が溶は裏側へと流れ、その溶けて裏側
へ流れた被加工物はアシストガスの流れと補助ノズル3
0より噴出されるアシストガスと同種のガスによって固
まる前に吹き飛ばされて排出できるので、ステンレス鋼
などの溶けた被加工物の粘度が高くてアシストガスのみ
では吹き飛ばしできずにドロスが付着し易い材料を切断
する際にもドロスが付着しないよ5に、Lかも高速で切
断できる。
In this way, the laser beam is irradiated onto the surface of the workpiece, the workpiece melts and flows to the back side, and the melted workpiece flows to the backside through the assist gas flow and the auxiliary nozzle 3.
The assist gas and the same type of gas ejected from the zero can be used to blow off and discharge the material before it solidifies, so it can be used to melt materials such as stainless steel, which have a high viscosity and cannot be blown off with the assist gas alone and dross tends to adhere to them. There is no dross attached when cutting 5.L can also be cut at high speed.

なお、補助ノズルを用いずにパルス発振によってレーザ
ビームを照射してもドロスの付着を防止できるが、この
様にすると切断速度が遅くなってしま5゜ 発明の効果 低出力のレーザビームを用いても加工深さを深くできる
から、深い溝などを加工できると共に、被加工物の表面
に溶融物が付着することも防止できる。
Incidentally, dross adhesion can be prevented even if the laser beam is irradiated by pulse oscillation without using an auxiliary nozzle, but this method slows down the cutting speed. Since the machining depth can also be increased, it is possible to machine deep grooves and the like, and it is also possible to prevent melt from adhering to the surface of the workpiece.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)、Φ) 、 (C)は本発明の実施例を示
す説明図、第2図はノズルの断面0図、第3図、第4図
は他の実施例を示す正面図、底面図、第5図は従来の加
工方法による不具合説明図である。 10は被加工物。
FIGS. 1(a), Φ), and (C) are explanatory views showing embodiments of the present invention, FIG. 2 is a cross-sectional view of the nozzle, and FIGS. 3 and 4 are front views showing other embodiments. , a bottom view, and FIG. 5 are diagrams illustrating defects caused by the conventional processing method. 10 is the workpiece.

Claims (1)

【特許請求の範囲】[Claims] 被加工物10の同一箇所にレーザビームを複数回照射し
て加工することを特徴とするレーザビームによる加工方
法。
A laser beam processing method characterized by irradiating the same part of a workpiece 10 with a laser beam multiple times to process it.
JP60167403A 1985-07-31 1985-07-31 Processing method by laser beam Pending JPS6228095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60167403A JPS6228095A (en) 1985-07-31 1985-07-31 Processing method by laser beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60167403A JPS6228095A (en) 1985-07-31 1985-07-31 Processing method by laser beam

Publications (1)

Publication Number Publication Date
JPS6228095A true JPS6228095A (en) 1987-02-06

Family

ID=15849052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60167403A Pending JPS6228095A (en) 1985-07-31 1985-07-31 Processing method by laser beam

Country Status (1)

Country Link
JP (1) JPS6228095A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5867074A (en) * 1994-03-02 1999-02-02 Seiko Epson Corporation Surface acoustic wave resonator, surface acoustic wave resonator unit, surface mounting type surface acoustic wave resonator unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5867074A (en) * 1994-03-02 1999-02-02 Seiko Epson Corporation Surface acoustic wave resonator, surface acoustic wave resonator unit, surface mounting type surface acoustic wave resonator unit

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