JPS62274679A - optical coupling device - Google Patents
optical coupling deviceInfo
- Publication number
- JPS62274679A JPS62274679A JP61118754A JP11875486A JPS62274679A JP S62274679 A JPS62274679 A JP S62274679A JP 61118754 A JP61118754 A JP 61118754A JP 11875486 A JP11875486 A JP 11875486A JP S62274679 A JPS62274679 A JP S62274679A
- Authority
- JP
- Japan
- Prior art keywords
- light
- optical coupling
- resin
- coupling device
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔産業上の利用分野〕
本発明は光結合素子、特に光伝達部をトランスファ成形
樹脂により形成した光結合素子に関するものである。Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to an optical coupling device, and particularly to an optical coupling device in which a light transmission portion is formed of transfer molding resin.
従来の光結合素子の断面図を第２図に示す。発光素子４
と受光素子６との光伝達部には成形材料としてフィラを
含有しない透明エポキシ樹脂７、あるいは結晶無機質又
は溶融無機質をフィラとして含有する透光性エポキシ樹
脂（図示せず）が用いられていた。A cross-sectional view of a conventional optical coupling device is shown in FIG. Light emitting element 4
A transparent epoxy resin 7 containing no filler as a molding material, or a translucent epoxy resin (not shown) containing a crystalline inorganic material or a molten inorganic material as a filler was used for the light transmission portion between the light receiving element 6 and the light receiving element 6.
しかしながら上述した材料のうち、フィンを含有しない
エポキシ樹脂では、フィラを含有する光不透過性外部樹
脂と透光性内部樹脂との間で熱膨張係数の差が極めて大
きいために熱的なストレスが加わり易い欠点がある。ま
た前記熱膨張係数の差を小さくする手段として結晶無機
質又は溶融無機質をフィラとして含有したエポキシ樹脂
ではフィラの形状および大きざが不規則であるために、
発光素子と受光素子間で光の減衰が大きく、伝達効率が
低いという欠点がある。However, among the above-mentioned materials, epoxy resins that do not contain fins suffer from thermal stress due to the extremely large difference in thermal expansion coefficient between the light-opaque outer resin containing fillers and the light-transparent inner resin. There are drawbacks that are easy to add to. Furthermore, in the case of epoxy resins containing crystalline inorganic materials or molten inorganic materials as fillers as a means of reducing the difference in thermal expansion coefficients, the shape and size of the fillers are irregular.
The disadvantage is that the light is attenuated greatly between the light emitting element and the light receiving element, and the transmission efficiency is low.
本発明の光結合素子はその光伝達部に％硬化剤としてフ
ェノールが添加でｎたエポキシ街脂を主成分とし、球状
の無機質をフィンとして含有した成形材料を使用してい
る。The optical coupling element of the present invention uses a molding material containing epoxy resin as a main component and spherical inorganic material as fins, to which phenol is added as a hardening agent, in its light transmission portion.
本発明を相対向して発光素子と受光素子とを配置させた
構造の光結合素子に適用した一実施例につき説明する。An embodiment in which the present invention is applied to an optical coupling device having a structure in which a light emitting element and a light receiving element are arranged facing each other will be described.
第１図は本発明の実施例である。FIG. 1 shows an embodiment of the invention.
発光素子４を取りつけたり一ド３と受光素子６を取り付
けたリード３′とをそれぞれの主発光面、受光面が互い
に対向するように配置する。発光素子４にはシリコーン
レジレなどよりなるコーティング剤５を塗布する。リー
ド３．３′及び発光素子４及び受光素子６の周辺及びそ
の空間部をフェノールレジンを硬化剤として、球状無機
質をフィラーしたエポキシ樹脂材料２にてトランスファ
ーモールドを行ない、封止する。それにより光伝達部を
確保する。さらに前述のエポキシ樹脂材料２の外周部を
光不透過性エポキシ樹脂材料１シててトランスファーモ
ールドを行なう。これによって光結合素子の外部の光を
遮断する。A lead 3 to which a light emitting element 4 is attached and a lead 3' to which a light receiving element 6 is attached are arranged so that their main light emitting surfaces and light receiving surfaces face each other. A coating agent 5 made of silicone resin or the like is applied to the light emitting element 4. The periphery of the leads 3, 3', the light emitting element 4, and the light receiving element 6 and the space thereof are sealed by transfer molding with an epoxy resin material 2 filled with spherical inorganic material using phenol resin as a hardening agent. This ensures a light transmission section. Furthermore, transfer molding is performed by applying a light-opaque epoxy resin material to the outer peripheral portion of the epoxy resin material 2 described above. This blocks light from outside the optical coupling element.
第３図は従来の無機質フィラー及び球状無機質フィラー
の平均粒径を変えた場合の光伝達効率を表わした図であ
る。図３にみるように光伝達効率はフィシ−を含有しな
いエポキシ樹脂に比較し、球状無機質フィラーを含有す
る樹脂で特に平均粒径５０μｍ以下では良好である。一
方、従来の無機質フィラーを含有する樹脂では粒径に依
存させず光伝達効率は非常に低い。FIG. 3 is a diagram showing the light transmission efficiency when the average particle diameter of a conventional inorganic filler and a spherical inorganic filler is changed. As shown in FIG. 3, the light transmission efficiency is better in resins containing spherical inorganic fillers, especially when the average particle size is 50 μm or less, compared to epoxy resins that do not contain fissile. On the other hand, with conventional resins containing inorganic fillers, the light transmission efficiency is very low regardless of particle size.
以上のように本発明においては光伝達部の樹脂材料のフ
ィシとして球状無機質を用いることにより、光の散乱を
小さくすることができるため、発光素子と受光素子間の
光の減衰を小さくすることができる。As described above, in the present invention, by using a spherical inorganic material as the fissure of the resin material of the light transmission part, it is possible to reduce the scattering of light, and therefore it is possible to reduce the attenuation of light between the light emitting element and the light receiving element. can.
また球状無機質は凸レンズと同様の集光効果を有するた
め、先の伝達効率を向上させることができる。
−また本発明による光結合素子
の光伝達部にはフェノールレジンを硬化剤としたエポキ
シ樹脂が用いられているため、耐湿性にも優れた光結合
素子を提供することができる。Furthermore, since the spherical inorganic material has a light condensing effect similar to that of a convex lens, it is possible to improve the transmission efficiency.
- Furthermore, since the light transmission portion of the optical coupling device according to the present invention uses an epoxy resin using phenol resin as a curing agent, it is possible to provide an optical coupling device with excellent moisture resistance.
第１図は本発明の球状フィシを含有する樹脂を内部樹脂
として用いて二重モールドされた光結合素子の断面図、
第２図は従来用いられてきたフィンを含有しない樹脂を
内部樹脂として用いて二重モールドされた光結合素子の
断面図である。第３図は本発明の効果を表わす図である
。
１・・・・・・光不透過性外部樹脂、２・・・・・・球
状フィシを含有する透光性内部樹脂、３・・・・・・リ
ードフレーム、４・・・・・・発光素子、５・・・・・
・ペレットコーティング、６・・・・・・受光素子、７
・・・・・・フィシを含有しない透明内部樹脂。
代理人 弁理士 内 原 晋ｊ子・ｑ＝：。
・ 牛 ２ 図FIG. 1 is a cross-sectional view of a double-molded optical coupling element using a resin containing spherical fissures of the present invention as an internal resin;
FIG. 2 is a sectional view of a double-molded optical coupling element using a conventionally used resin that does not contain fins as an internal resin. FIG. 3 is a diagram showing the effects of the present invention. 1... Light-opaque outer resin, 2... Light-transparent inner resin containing spherical fissures, 3... Lead frame, 4... Light emitting Motoko, 5...
・Pellet coating, 6... Light receiving element, 7
...Transparent internal resin that does not contain fisi. Agent: Patent attorney Shinko Uchihara:.・Cow 2 diagram
Claims (1)
ーとして球状の無機質を含有することを特徴とする光結
合素子。An optical coupling element characterized in that a light-transmitting resin filling a light transmission part of the optical coupling element contains a spherical inorganic substance as a filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61118754A JPS62274679A (en) | 1986-05-22 | 1986-05-22 | optical coupling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61118754A JPS62274679A (en) | 1986-05-22 | 1986-05-22 | optical coupling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62274679A true JPS62274679A (en) | 1987-11-28 |
Family
ID=14744227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61118754A Pending JPS62274679A (en) | 1986-05-22 | 1986-05-22 | optical coupling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62274679A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7437030B2 (en) | 2003-11-27 | 2008-10-14 | Ibiden Co., Ltd. | Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard |
| US8076782B2 (en) | 2002-04-01 | 2011-12-13 | Ibiden Co., Ltd. | Substrate for mounting IC chip |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55166971A (en) * | 1979-06-14 | 1980-12-26 | Nec Corp | Photocoupling device |
| JPS6281072A (en) * | 1985-10-04 | 1987-04-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for photocoupler |
-
1986
- 1986-05-22 JP JP61118754A patent/JPS62274679A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55166971A (en) * | 1979-06-14 | 1980-12-26 | Nec Corp | Photocoupling device |
| JPS6281072A (en) * | 1985-10-04 | 1987-04-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for photocoupler |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8076782B2 (en) | 2002-04-01 | 2011-12-13 | Ibiden Co., Ltd. | Substrate for mounting IC chip |
| US8120040B2 (en) | 2002-04-01 | 2012-02-21 | Ibiden Co., Ltd. | Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication |
| US7437030B2 (en) | 2003-11-27 | 2008-10-14 | Ibiden Co., Ltd. | Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard |
| US7526152B2 (en) | 2003-11-27 | 2009-04-28 | Ibiden Co., Ltd. | Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard |
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