JPS6226899A - Moisture adjustor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a humidity adjustment device, and more particularly to a humidity adjustment device with a simple structure that adjusts the humidity within a closed structure.

[Technical Background of the Invention] A fixed disk device (hereinafter simply referred to as a device) for recording and reproducing information on a disk-shaped single recording disk is usually configured as shown in FIG. That is, a recording single plate 2 rotated by a motor (not shown) on a frame 1, a magnetic head assembly 3 for recording and reproducing information on the recording single plate 2, and a magnetic head assembly 3 that supports the magnetic head assembly 3 and supports the recording single plate 2. Head access mechanism section 4 driven in the radial direction of No. 2
is provided. A cover 5 for housing and sealing these parts is provided on the frame 1 to form a closed container.

When storing precision electronic components such as those described above, the air inside the container must be clean and have low humidity. For this reason, in the case of small-sized devices, conventionally a nozzle hole 6 was provided in the cover 2 as shown in FIG. 3, and a filter 7 was fixed to the inner surface of the cover 2 at that position. In addition, large-sized devices are provided with a moisture absorbent such as silica gel in an amount that is consumed during the life of the device.

[Problems with the Background Art] In the conventional moisture absorption adjusting device configured as described above, the small device does not have an internal moisture absorption mechanism, so when the external relative humidity reaches 80% or more, the moisture inflow and diffusion takes place for a long period of time. In the case of storage, there was a problem that the head would stick to the recording single plate 2. In addition, a sudden change in external temperature often causes condensation inside the device, such as a veneer, making the device unusable. For this reason, it became necessary to take special precautions such as avoiding places with high humidity in the environment in which the device is installed and minimizing changes in external temperature. For this reason, there is a drawback that the transportation and use environment of the device are restricted.

In the case of a large-sized device, a large-sized moisture absorbent must be provided inside the container, which requires a large space, making the device even larger, which poses a problem of increasing the cost of the device.

Purpose of the Invention] The present invention i has been made in view of the above-mentioned points, and has a simple structure and can easily prevent dew condensation by lowering the humidity inside a sealed container etc. even when the external temperature changes. The purpose is to provide a regulating device.

[Summary of the Invention] The present invention forms a sealed structure at least in part with a member having good thermal conductivity, and integrally forms a porous member with good heat conductivity in at least a part of the inner surface of the member. It was designed to achieve the intended purpose.

[Embodiment of the Invention] Hereinafter, an embodiment of the humidity adjusting device according to the present invention will be described with reference to the drawings.

FIG. 1 shows an embodiment of the present invention. In this figure, parts that are the same or equivalent to those of the conventional example shown in FIG. 3 are denoted by the same reference numerals, and their explanation will be omitted. A cover 8 on which fins for heat radiation are formed is airtightly fixed to the upper surface of the frame 1 to form a closed container. A porous member 9 made of a metal such as aluminum and having good thermal conductivity is adhered to the inner surface of the cover 8. The adhesive used for this bonding also has good thermal conductivity.

The operation of this embodiment configured as described above will be explained below. When the external temperature of the device drops from normal temperature to a low temperature, for example O''C, the temperature drop is fastest through the cover 8, and the porous member 9 bonded to the inside of the cover 8 is made of metal and has relatively good heat conduction. Therefore, the temperature is low like that of the cover 8.Since the specific heat of air is larger than that of metal such as aluminum, the temperature of the air 10 inside the sealed container decreases slowly. A temperature difference is generated between the porous member 9 and the inner air 10, and the relative humidity increases due to the temperature drop of the internal air 10. When the moist air that comes into contact with the cooled porous member 9 reaches its saturation limit, dew condensation begins. .

Figure 2 shows the structure of a porous member. Water that condenses near the surface is sucked into the interior by capillary action.
The porous member 9 contains sufficient condensed water 11 as shown in FIG. 2 (A>).

Therefore, the absolute humidity of the internal air 10 decreases. This action will continue until the temperature drops sufficiently and the difference between the surface temperature of the porous member 9 and the temperature of the air 10 inside becomes small.

When the temperature outside the device rises, on the contrary, the temperature of the cover 8 rises fastest, and the temperature of the porous member 9 also begins to rise. However, the moisture sucked into the interior by capillary action is shown in Figure 2 (
As shown in B), the air 10 inside the container whose temperature is rising does not come out to the surface unless the temperature is high enough.
Not enough humidity is applied to the area. Therefore, the relative humidity will be suppressed until the temperature approaches room temperature.

As described above, according to this embodiment, the increase in humidity inside the device due to changes in external temperature can be adjusted using a simple structure in which a porous member 9 with good thermal conductivity is adhered to the inside of the cover 8 which is most easily cooled. can do. Moreover, since it can be used semi-permanently, it can be made cheaper than conventional humidity control devices. Furthermore, since the porous member 9 can adsorb not only moisture but also minute dust, the cleanliness of the air 10 inside the device can be automatically increased.

In the above-mentioned embodiment, a case has been described in which the porous member 9 is bonded to the cover 8 using an adhesive, but the porous member 9 may be integrated by welding. In addition, although this example describes a humidity adjustment device that applies to a sealed fixed disk device, it can also be applied to structures that have a sealed structure and have problems with changes in internal humidity or condensation due to changes in external temperature. and has similar effects.For example, food packaging materials, buildings, and
It is also effective for use in interior materials such as vehicles.

[Effects of the Invention] As described above, according to the present invention, a porous member with good thermal conductivity is integrally provided on the inner surface of a member with good thermal conductivity,
Since a closed structure is formed from these members, even if there is a change in the outside temperature, an increase in humidity inside the closed container or the like can be suppressed and dew condensation can be prevented with a simple structure.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing one embodiment of the humidity adjustment device according to the present invention, FIG. 2 is a partial sectional view showing the operation of this embodiment, and FIG.
The figure is a sectional view showing a conventional humidity adjustment device. 5.8... Cover (member with good thermal conductivity) 9... Porous member Representative Patent attorney Nori Chika Yudo Sanno −

Claims (3)

[Claims] (1) At least a part of the hermetic structure is formed of a member with good thermal conductivity, and at least a part of the inner surface of the member is integrally formed with a porous member with good thermal conductivity. Humidity adjustment device. (2) The means for integrally forming the porous member with good thermal conductivity on the inner surface of the member with good thermal conductivity is adhesion using an adhesive with good thermal conductivity. The humidity adjustment device according to item 1. (3) The humidity adjusting device according to claim 1, wherein the means for integrally forming the porous member with good thermal conductivity on the inner surface of the member with good thermal conductivity is welding.