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JPS6226047U - - Google Patents

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Publication number
JPS6226047U
JPS6226047U JP11774285U JP11774285U JPS6226047U JP S6226047 U JPS6226047 U JP S6226047U JP 11774285 U JP11774285 U JP 11774285U JP 11774285 U JP11774285 U JP 11774285U JP S6226047 U JPS6226047 U JP S6226047U
Authority
JP
Japan
Prior art keywords
integrated circuit
lead
penetrating
attaching
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11774285U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11774285U priority Critical patent/JPS6226047U/ja
Publication of JPS6226047U publication Critical patent/JPS6226047U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図は本考案の一実施例を示す平面
図・側面図、第3図は本考案の集積回路パツケー
ジを利用して、多層に集積回路を組立てた構造を
示す図、第4図は従来例の平面図・側面図である
。 1…ケース、2…リード、3…取付部、4…集
積回路パツケージ(本考案)、5…組立用基板、
6…パツケージ用基板。
1 and 2 are plan and side views showing an embodiment of the present invention, FIG. 3 is a diagram showing a structure in which integrated circuits are assembled in multiple layers using the integrated circuit package of the present invention, and FIG. FIG. 4 is a plan view and a side view of a conventional example. DESCRIPTION OF SYMBOLS 1...Case, 2...Lead, 3...Mounting part, 4...Integrated circuit package (this invention), 5...Assembling board,
6...Package board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 集積回路を収納するケースより引出されたリー
ドが可撓性のものであつて、該リードの先端に接
続導体を貫通し取付ける取付部を有することを特
徴とする集積回路パツケージ。
An integrated circuit package characterized in that a lead drawn out from a case housing the integrated circuit is flexible and has a mounting portion at the tip of the lead for penetrating and attaching a connecting conductor.
JP11774285U 1985-07-31 1985-07-31 Pending JPS6226047U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11774285U JPS6226047U (en) 1985-07-31 1985-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11774285U JPS6226047U (en) 1985-07-31 1985-07-31

Publications (1)

Publication Number Publication Date
JPS6226047U true JPS6226047U (en) 1987-02-17

Family

ID=31003538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11774285U Pending JPS6226047U (en) 1985-07-31 1985-07-31

Country Status (1)

Country Link
JP (1) JPS6226047U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5972156A (en) * 1982-10-18 1984-04-24 Toshiba Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5972156A (en) * 1982-10-18 1984-04-24 Toshiba Corp Semiconductor device

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