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JPS62258735A - Apparatus for recirculating chemical liquid - Google Patents

Apparatus for recirculating chemical liquid

Info

Publication number
JPS62258735A
JPS62258735A JP10138686A JP10138686A JPS62258735A JP S62258735 A JPS62258735 A JP S62258735A JP 10138686 A JP10138686 A JP 10138686A JP 10138686 A JP10138686 A JP 10138686A JP S62258735 A JPS62258735 A JP S62258735A
Authority
JP
Japan
Prior art keywords
recovery tank
chemical liquid
tank
chemical
recovery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10138686A
Other languages
Japanese (ja)
Other versions
JP2546825B2 (en
Inventor
Seiichi Kumagai
誠一 熊谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP61101386A priority Critical patent/JP2546825B2/en
Publication of JPS62258735A publication Critical patent/JPS62258735A/en
Application granted granted Critical
Publication of JP2546825B2 publication Critical patent/JP2546825B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/0006Controlling or regulating processes
    • B01J19/002Avoiding undesirable reactions or side-effects, e.g. avoiding explosions, or improving the yield by suppressing side-reactions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Weting (AREA)

Abstract

PURPOSE:To prevent the generation of dust or the contamination of a chemical liquid, by providing a chemical liquid tank and a hermetically closed recovery tank at positions having different heights in an up-and-down direction and arranging chemical liquid recovery piping and chemical liquid supply piping, both of which have opening and closing valves, between the chemical liquid tank and the recovery tank in parallel. CONSTITUTION:A valve 4b is closed and a valve 5b is opened to introduce clean air into a recovery tank B from an air pressure feeder 5 through an air supply and exhaust port 3b. At this time, a valve 8b is closed and a valve 7b is opened and the air in the recovery tank B is compressed by air fed under pressure and the chemical liquid pressurized by the compressed air is discharged from a discharge port 1b to perform emitting operation. Liquid level detectors 9a, 10b are provided to a recovery tank A and the recovery tank B and, when the upper limit of the recovery tank A is detected by the liquid level detector 9a while the lower limit of the recovery tank B is detected by the liquid level detector 10b, the recovery tank B is allowed to perform liquid storing operation and the recovery tank A is allowed to perform emitting operation. Both tanks A, B are changed over so that the both operations are performed alternately.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は複数枚の半導体基板を薬液等で浸漬処理を行う
半導体基板処理装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor substrate processing apparatus that performs immersion treatment of a plurality of semiconductor substrates in a chemical solution or the like.

〔従来の技術〕[Conventional technology]

従来、この種の半導体基板処理装置は薬液槽から回収し
た薬液をr過器に通して浄化し、うず巻ポンプ、ダイア
フラムポンプ、ベローズポンプ等により浄化薬液を再び
薬液槽に戻すことにより薬液処理を行うようになってい
る。
Conventionally, this type of semiconductor substrate processing equipment performs chemical processing by passing the chemical recovered from the chemical tank through an R-filter, purifying it, and returning the purified chemical to the chemical tank using a spiral pump, diaphragm pump, bellows pump, etc. It is supposed to be done.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の処理装置は回転を支持する軸や軸受を有
するうず巻ポンプや膜や蛇腹の変化を利用するダイアフ
ラムポンプ、ベローズポンプ等を用いているため、ポン
プの軸受や蛇腹等の摺動部分から半導体装置製造上量も
障害となる汚染源を発生させたり、また摩耗部分がある
から薬液の循環装置としての寿命が短命であるという欠
点があった・ 本発明の目的は機械的な摩耗部分をな゛くし発塵や薬液
への汚染を防止した薬液循環装置を提供することにある
The conventional processing equipment described above uses a centrifugal pump that has a shaft or bearing that supports rotation, a diaphragm pump that utilizes changes in membrane or bellows, a bellows pump, etc. This has the disadvantage that it generates a source of contamination that is an obstacle to the production of semiconductor devices, and that the lifespan of a chemical circulation device is short due to the presence of worn parts. It is an object of the present invention to provide a chemical liquid circulation device that prevents dust generation and contamination of the chemical liquid.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は複数の半導体基板を収納した半導体基板収納箱
を薬液槽内に浸漬し、半導体基板の薬液処理を行う処理
装置において、薬液槽と回収槽とを上下に異なる高さ位
置にそれぞれ設置し、薬液槽と回収槽との間にそれぞれ
開閉弁を備えた薬液回収配管と薬液供給用配管とを並列
に設置し、薬液供給用配管に濾過器を設け、さらに回収
槽内に高圧気体を送り込み槽内の空気を圧縮する気体圧
送器を備えたことを特徴とする薬液循環装置である。
The present invention provides a processing apparatus for processing semiconductor substrates with a chemical solution by immersing a semiconductor substrate storage box containing a plurality of semiconductor substrates in a chemical solution tank, in which the chemical solution tank and the recovery tank are installed at different vertical positions. A chemical liquid recovery pipe and a chemical liquid supply pipe each equipped with an on-off valve are installed in parallel between the chemical liquid tank and the recovery tank, a filter is installed in the chemical liquid supply pipe, and high pressure gas is sent into the recovery tank. This is a chemical liquid circulation device characterized by being equipped with a gas pressure feeder that compresses air in a tank.

〔実施例〕〔Example〕

以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

第1図において、薬液槽2と2つの密閉回収槽A、Bと
を上下に異なる高さ位置にそれぞれ設置し、薬液槽2の
底部流出口4から薬液回収配管し、を導出し、これを2
つに分岐させてそれぞれを開閉弁8a 、 &bを介し
て下段の各々の回収槽A、Bに開口する。一方、薬液供
給配管り、 、 L、の一部を回収槽A。
In Fig. 1, a chemical solution tank 2 and two closed recovery tanks A and B are installed at different vertical positions, and a chemical solution recovery pipe is led out from the bottom outlet 4 of the chemical solution tank 2. 2
It branches into two collection tanks A and B in the lower stage through respective on-off valves 8a, &b. On the other hand, part of the chemical solution supply piping, L, is installed in the recovery tank A.

Bの底部付近に開口し、それぞれ開閉弁7a 、 7b
を介して一本にまとめてこれを濾過器3の入口側に接続
し、濾過器3の出口側を上段の薬液槽2に開口する。さ
らに回収槽A、B内に高圧気体を圧送する気体圧送器5
を備え、気体圧送器5を開閉弁5a、5bに通して各回
収槽A、ISに配管し1.L6により接続する。 L、
 、 L、は回収槽A、Bを大気に開放する配管であり
、各配管り、 、 L、には開閉弁4a 、 4bが設
けである。また各回収槽A、B内には配管し1の開口高
さ位置で上限の薬液液面を検出する液面検出器9a、9
bと、配管り、 、 L、の開口高さ位置で下限の薬液
液面を検出する液面検出器10a 、 10bとを設置
しである。また1本発明の薬液循環装置1から気体圧送
器5を切り離してそれぞれ別途雰囲気中に設置する。
Opening near the bottom of B, opening and closing valves 7a and 7b, respectively.
These are connected together to the inlet side of the filter 3 via the filter 3, and the outlet side of the filter 3 is opened to the upper chemical tank 2. Further, a gas pump 5 that pumps high pressure gas into the recovery tanks A and B
1. The gas pressure feeder 5 is passed through the on-off valves 5a and 5b and piped to each collection tank A and IS. Connect via L6. L,
, L are piping that open the recovery tanks A and B to the atmosphere, and each piping, , L, is provided with on-off valves 4a and 4b. In addition, liquid level detectors 9a and 9 are installed in each collection tank A and B to detect the upper limit of the chemical liquid level at the opening height position 1.
b, and liquid level detectors 10a and 10b for detecting the lower limit of the chemical liquid level at the opening height position of the piping, L, and L. Further, the gas pressure feeder 5 is separated from the chemical liquid circulation device 1 of the present invention and installed separately in the atmosphere.

実施例において、薬液槽2の底部に設けた流出口4から
薬液を薬液循環装置1へ自然落下により供給し、同時回
収した薬液を気体で加圧して、濾過及び温度調節等の薬
液管理を行う濾過器3を通して吐出口6より薬液槽2へ
戻す動作を連続的に行う。すなわち、先ず回収槽Aで弁
7aを閉じて弁8aを開け、配管し1の導入口2aより
薬液を導入して薬液を貯める。このとき、弁5aを閉じ
て弁4aを開け、貯液により排除される気体を気体給徘
口3aより排気口6aへ排出し、貯液動作を行う。回収
槽Aにて上述の動作を行っている間、他方の回収槽Bで
?+’j1杯となった薬液の吐出動作を行う。すなわち
弁4bを閉じて弁5bを開け、清浄な気体を気体圧送器
5より気体給徘口3bを通して回収槽Bに導入する。こ
のとき、弁8bを閉じて弁7bを開け、圧送気体により
回収槽B内の気体を圧縮し、その圧縮気体により加圧さ
れた薬液を排出口1bより排出し、吐出動作を行う。
In the embodiment, the chemical liquid is supplied to the chemical liquid circulation device 1 by gravity from the outlet 4 provided at the bottom of the chemical liquid tank 2, and the chemical liquid recovered at the same time is pressurized with gas to perform chemical liquid management such as filtration and temperature control. The operation of passing through the filter 3 and returning it to the chemical tank 2 through the discharge port 6 is performed continuously. That is, first, in the recovery tank A, the valve 7a is closed, the valve 8a is opened, and the chemical solution is introduced through the inlet 2a of the piping 1 and stored. At this time, the valve 5a is closed and the valve 4a is opened, and the gas removed by the liquid storage is discharged from the gas supply port 3a to the exhaust port 6a, thereby performing the liquid storage operation. While the above operation is being performed in recovery tank A, what happens in the other recovery tank B? +'j Performs a discharge operation for one cup of chemical liquid. That is, the valve 4b is closed, the valve 5b is opened, and clean gas is introduced into the recovery tank B from the gas pressure feeder 5 through the gas supply port 3b. At this time, the valve 8b is closed and the valve 7b is opened, the gas in the recovery tank B is compressed by the pressurized gas, and the chemical solution pressurized by the compressed gas is discharged from the discharge port 1b to perform a discharge operation.

回収槽A及び回収槽Bに設けた液面検出器9aにより回
収イtAの上限を、また一方ロ収イ色Bの下限を液面検
出器10bでそれぞれ検出したときに、前述した貯液動
作を回収槽Bに行わせ、吐出動作を回収槽Aが交替して
行うように切替える。
When the liquid level detectors 9a provided in the recovery tank A and the recovery tank B detect the upper limit of the recovery time A, and the lower limit of the recovery color B is detected by the liquid level detector 10b, the above-mentioned liquid storage operation is performed. The recovery tank B is made to perform the discharge operation, and the discharge operation is switched so that the recovery tank A takes turns performing the discharge operation.

このようにして液面検出器にてそれぞれの回収槽の液面
状態を検出し、交互に貯液動作と吐出動作をくりかえす
ことにより連続的に薬液循環を行う。
In this way, the liquid level state of each collection tank is detected by the liquid level detector, and the chemical solution is continuously circulated by alternately repeating the liquid storing operation and the discharging operation.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は回収槽への貯液を自然落下
により行っていること及び、薬液の加圧を清浄化した圧
縮気体により行うため、発塵や薬液への汚染がなく、機
械動作が少なし\ため、装置の長寿命化が実現できる効
果がある。
As explained above, in the present invention, the liquid is stored in the collection tank by natural fall, and the pressurization of the chemical liquid is performed using clean compressed gas, so there is no dust generation or contamination of the chemical liquid, and the mechanical operation is possible. Since there is less \\, there is an effect that the life of the device can be extended.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の半導体基板処理槽薬液循環装置の配管
系統図である。
FIG. 1 is a piping system diagram of the semiconductor substrate processing tank chemical circulation device of the present invention.

Claims (1)

【特許請求の範囲】[Claims] (1)複数の半導体基板を収納した半導体基板収納箱を
薬液槽内に浸漬して半導体基板の薬液処理を行う処理装
置において、薬液槽と密閉回収槽とを上下に異なる高さ
位置にそれぞれ設置し、薬液槽と回収槽との間にそれぞ
れ開閉弁を備えた薬液回収用配管と薬液供給用配管とを
並列に設置し、薬液供給用配管にろ過器を設け、さらに
、回収槽内に高圧気体を送り込み槽内の空気を圧縮する
気体圧送器を備えたことを特徴とする薬液循環装置。
(1) In a processing device that performs chemical treatment on semiconductor substrates by immersing a semiconductor substrate storage box containing multiple semiconductor substrates into a chemical tank, the chemical tank and sealed recovery tank are installed at different vertical positions. A chemical liquid recovery pipe and a chemical liquid supply pipe each equipped with an on-off valve are installed in parallel between the chemical liquid tank and the recovery tank, a filter is installed in the chemical liquid supply pipe, and a high pressure A chemical liquid circulation device characterized by being equipped with a gas pressure feeder that sends gas and compresses air in a tank.
JP61101386A 1986-05-01 1986-05-01 Chemical circulation device Expired - Fee Related JP2546825B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61101386A JP2546825B2 (en) 1986-05-01 1986-05-01 Chemical circulation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61101386A JP2546825B2 (en) 1986-05-01 1986-05-01 Chemical circulation device

Publications (2)

Publication Number Publication Date
JPS62258735A true JPS62258735A (en) 1987-11-11
JP2546825B2 JP2546825B2 (en) 1996-10-23

Family

ID=14299320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61101386A Expired - Fee Related JP2546825B2 (en) 1986-05-01 1986-05-01 Chemical circulation device

Country Status (1)

Country Link
JP (1) JP2546825B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0294435A (en) * 1988-09-29 1990-04-05 Nec Corp Etching apparatus
JPH04256318A (en) * 1991-02-08 1992-09-11 Nec Yamagata Ltd Chemical treatment device
JP2003174004A (en) * 2001-12-04 2003-06-20 Nec Electronics Corp Chemical treatment device for semiconductor substrate
JP2008135464A (en) * 2006-11-27 2008-06-12 Matsushita Electric Works Ltd Processing apparatus for wiring board and processing method employing it

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49129360A (en) * 1973-04-16 1974-12-11
JPS5346292U (en) * 1976-09-24 1978-04-19
JPS5416944A (en) * 1977-07-08 1979-02-07 Hitachi Ltd Input/output interface control system
JPS56152970A (en) * 1980-04-25 1981-11-26 Oki Electric Ind Co Ltd Etching device
JPS5876135A (en) * 1981-11-02 1983-05-09 Hitachi Ltd Mechanism for supplying chemical liquid
JPS5877044U (en) * 1981-11-19 1983-05-24 富士通株式会社 Thin film peeling device
JPS5887826A (en) * 1981-11-20 1983-05-25 Hitachi Ltd Treatment of substance and device thereof
JPS58147125A (en) * 1982-02-26 1983-09-01 Nippon Telegr & Teleph Corp <Ntt> Wet processing device
JPS58193725A (en) * 1981-12-18 1983-11-11 Nec Kyushu Ltd Method for supplying organic chemical to production device for semiconductor

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49129360A (en) * 1973-04-16 1974-12-11
JPS5346292U (en) * 1976-09-24 1978-04-19
JPS5416944A (en) * 1977-07-08 1979-02-07 Hitachi Ltd Input/output interface control system
JPS56152970A (en) * 1980-04-25 1981-11-26 Oki Electric Ind Co Ltd Etching device
JPS5876135A (en) * 1981-11-02 1983-05-09 Hitachi Ltd Mechanism for supplying chemical liquid
JPS5877044U (en) * 1981-11-19 1983-05-24 富士通株式会社 Thin film peeling device
JPS5887826A (en) * 1981-11-20 1983-05-25 Hitachi Ltd Treatment of substance and device thereof
JPS58193725A (en) * 1981-12-18 1983-11-11 Nec Kyushu Ltd Method for supplying organic chemical to production device for semiconductor
JPS58147125A (en) * 1982-02-26 1983-09-01 Nippon Telegr & Teleph Corp <Ntt> Wet processing device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0294435A (en) * 1988-09-29 1990-04-05 Nec Corp Etching apparatus
JPH04256318A (en) * 1991-02-08 1992-09-11 Nec Yamagata Ltd Chemical treatment device
JP2003174004A (en) * 2001-12-04 2003-06-20 Nec Electronics Corp Chemical treatment device for semiconductor substrate
JP2008135464A (en) * 2006-11-27 2008-06-12 Matsushita Electric Works Ltd Processing apparatus for wiring board and processing method employing it

Also Published As

Publication number Publication date
JP2546825B2 (en) 1996-10-23

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