JPS6224971A - Circular saw for hard workpiece - Google Patents

Abstract

PURPOSE:To make it possible to form thin blade sections keeping the strength of a disk by providing the thinner blade forming sections than the disk arranged to the outer peripheral end of the disk alternately with notch sections with many holes and by coating the surfaces of the blade forming sections and the inner cylindrical peripheries of the holes with one or two layers of fine diamond particles. CONSTITUTION:A disk 1 made of sheet steel or the like is arranged with blade forming sections 2 having proper width and formed thinner than the disk 1 by the cutting of both front and rear faces alternately with notch sections 8 in concentric direction. And the surface of the blade forming section 2 and inner cylindrical peripheries of through holes 3 are coated with one or two layers of diamond fine particles 4 by way of electroplating forming a blade section 5. And the cutting amounts of both front and rear faces of the disk 1 determining the thickness of the blade forming section 2 is to be same as the thickness of the layers of fine diamond particles 4 or slightly less so that the thickness of the blade section 5 may be same as that of the disk or slightly more. The slight cutting allowance of a precious and hard workpiece can, thus, be cut and also the life of a circular saw can be prolonged improving economy and operationability.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a circular saw for cutting hard materials such as various semiconductor materials such as silicon, ceramics, tungsten, carbide, and gemstones. It is something.

(Prior art) Conventionally, a circular saw for cutting hard materials was developed
This prior art, which includes techniques disclosed in Japanese Patent Publication No. 593 (Japanese Unexamined Patent Publication No. 49-106688) and Japanese Patent Publication No. 50-39594 (Japanese Unexamined Patent Publication No. 49-106689), A number of holes are arranged at equal intervals in a blade forming part having an appropriate width toward the center of the blade, and diamond fine particles are bound in series to the surface of the blade forming part and the inner peripheral wall of the holes to form a blade. It forms a part.

(Problems to be Solved by the Invention) Generally, semiconductor materials, jewelry, and other hard objects are expensive, so the cutting allowance required for processing such as cutting must be minimized as much as possible.

Particularly in recent years, with the rapid spread of semiconductors, it has become necessary to precisely cut or cut semiconductor materials into extremely thin pieces. There is a problem in that the blade thickness of the circular saw must be thinner than that of conventional ones.

However, in the conventional circular saw for cutting, the blade portion is formed on the surface of the blade forming portion having the same wall thickness as the circular plate, so that the wall thickness of the blade portion is It is not possible to make the blade any thinner, and the binding force of the blade made of fine diamond particles to the blade forming part cannot be made any stronger.

In addition, when cutting hard materials, there is a problem that cutting efficiency is poor due to clogging due to chips (dust) or failure due to heat generation.Especially when the blade thickness is made thin, overload due to deformation due to heat and clogging occurs. There was a problem in that failures were likely to occur.

(Means for Solving the Problems) In order to solve these problems, according to the present invention, blade forming portions and notches are alternately arranged at the outer peripheral end of the circular plate, and the blade portions are The thickness of the forming portion is made thinner than the wall thickness of the circular plate excluding the blade forming portion, and a large number of through holes are provided on the surface thereof, and the surface of the blade forming portion and the inner peripheral wall of the through hole are Provided is a circular saw for cutting hard materials, characterized in that a blade portion is formed by bonding diamond fine particles in a series.

In the above configuration, the diamond fine particles can be bonded to only one layer on the surface of the blade forming portion and the inner circumferential wall of the through hole.

In this case, the blade thickness of the circular cutting saw can be made thinner, and the blade portion can be precisely formed.

Further, in the above configuration, two or more layers of diamond fine particles can be bonded to the surface of the blade forming portion and the inner circumferential wall of the through hole.

In this case, the wear resistance of the cutting saw blade can be improved.

(effect) The above technical means works as follows.

By making the wall thickness of the blade forming part thinner than the wall thickness of the circular plate, firstly, the thickness of the circular plate can be made thinner without reducing the overall wall thickness of the circular plate to 1, that is, without reducing the strength of the circular plate. The blade part is formed to reduce the cutting width as much as possible.

Secondly, the bonding area of the diamond fine particles that bind to the blade forming part increases due to the step formed by making the wall thickness of the blade forming part thinner than the wall thickness of the circular plate. Therefore, it acts as if the binding force can be strengthened.

Thirdly, the stress that is applied to the diamond particles in the vicinity of the stepped portion at least during use is absorbed by the stepped portion, thereby improving durability.

Fourthly, by forming the notch, chips, cooling water, cutting oil, etc. are removed from the notch, and the circulation of air and fluids is improved (this increases the cooling effect and clogging prevention effect). It works very well.

(Embodiment) An embodiment of the present invention will be described with reference to the drawings. [11
is a circular plate or annular circular plate made of steel, etc., and the circular plate (1) has an appropriate width from the outer peripheral edge to the center of the circular plate, and the front and back sides of the circular plate (11) are cut. As a result, blade forming portions (2) formed to be thinner than the wall thickness of the circular plate (1) and cutout portions (8) are alternately arranged.

(3) is a large number of through holes arranged at equal intervals in the blade forming portion (2).

(4) is the surface of the blade forming part (2) and the through hole (3)
Diamond particles are bonded in a single layer to the inner circumferential wall of the blade by electroplating, and the blade portion (5) is formed by bonding the 8-diamond particles (4).

The through holes (3) are arranged in the circumferential direction so that the lines connecting the outer peripheries of the through holes (3) in each row are connected to the adjacent through holes (3), respectively. Each through hole (3) inserted into the line connecting the outer periphery of...
The diamond particles (4) bound to the inner circumferential wall of the blade part (5) are formed so as to have a continuous cutting function over the entire surface.

(6) is a stepped portion formed by cutting both the front and back surfaces of the circular plate (11), and the stepped portion (6) is the inner peripheral edge of the blade portion (
Diamond fine particles (4) are bound together as shown in 7).

In addition, the amount of cutting on both the front and back sides of the circular plate (1), which determines the thickness of the blade forming part (2), is determined by the amount of cutting on both the front and back sides of the circular plate (1), which determines the thickness of the blade forming part (2).
It is sufficient to determine the thickness to be the same as or slightly less than the thickness of
The thickness of the blade portion (5) may be the same or slightly thicker than the thickness of the circular plate (1).

When carrying out the present invention, the thickness of the round plate (1) can be made from an ultra-thin steel plate, for example, about 0.1 to 1.5 mm thick, and the shape of the through hole (3) is It may be round, polygonal, oval, etc.

(Effects of the Invention) As explained above, the present invention has the advantage that diamond fine particles are bound to the inner circumferential wall of the through-holes provided in the blade forming portion, that is, diamond fine grain pillars are formed. The diamond fine particles that are bound to the surface of the blade forming part can be firmly bound, and the formed blade part continuously exhibits a cutting effect, and its through holes allow good circulation of water or cutting oil. Not only does it have the effect of improving the cooling effect, but by making the wall thickness of the blade part forming part thinner than the wall thickness of the circular plate, the thickness of the blade part can be reduced without reducing the thickness of the entire circular plate. The thickness can be made thinner.

Next, since the binding area can be increased by the step formed by making the wall thickness of the blade forming part thinner than that of the circular plate, the binding area of the blade part to the blade forming part can be increased. can be made larger.

Further, since the stepped portion can at least withstand the stress applied to the diamond particles in the vicinity of the stepped portion, the durability of the blade portion, that is, the circular saw can be improved.

Furthermore, by having a notch, chips generated during cutting work can be easily removed from the notch, and the fluidity of cooling water, etc. is improved, preventing the blade from clogging, and improving cooling. Efficiency can be improved.

As a result, the cutting allowance for expensive hard materials can be reduced, the life of the circular saw can be extended, and economic efficiency and workability can be improved, such as continuous heavy cutting.

[Brief explanation of drawings]

The drawings show an embodiment of a circular saw for cutting hard materials according to the present invention, and FIG. 1 is a front view of the main part with a part of the outer circumferential end cut away, FIG. 2 is a partially enlarged front view, and FIG. The figure is an enlarged sectional view taken along the line A--A of the main part of FIG. In the drawings, (1) is a circular plate, (2) is a blade forming part, (
3) is a through hole, (4) is a diamond particle, (5) is a blade portion, (6 is a step portion, (7) is an inner peripheral edge of a blade portion, and (8) is a notch portion.

Claims (1)

[Scope of Claims] 1. Blade forming portions and notches are alternately arranged on the outer peripheral edge of the circular plate, and the thickness of the blade forming portion is greater than the wall thickness of the circular plate excluding the blade forming portion. The blade is made thinner and has a large number of through holes on its surface, and the blade is formed by binding diamond fine particles in a series to the surface of the blade forming part and the inner circumferential wall of the through hole. Circular saw for cutting hard materials. 2. The circular saw for cutting hard materials according to claim 1, characterized in that diamond fine particles are bonded to only one layer on the surface of the blade forming portion and the inner circumferential wall of the through hole. 3. The circular saw for cutting hard materials according to claim 1, characterized in that two or more layers of diamond fine particles are bonded to the surface of the blade forming part and the inner circumferential wall of the through hole.