JPS62244592A - Laser processing equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field to which the invention pertains]

This invention uses a thin film type photoelectric conversion substrate as a workpiece, for example, as a solar cell, and performs laser scribing by irradiating the workpiece surface with laser light, thereby forming a predetermined pattern on the thin film processing surface. The present invention relates to a laser processing device for forming open grooves.

[Prior art and its problems]

A first conductive film layered on an insulating substrate is laser scribed to form a first groove of a predetermined shape and patterned, targeting the photoelectric conversion substrate mentioned above,
Next, after forming an amorphous semiconductor film on the conductive film, laser scribing is performed at a predetermined position using the first groove as a reference to form a second groove in the semiconductor film and patterning is performed. Further, after forming a second conductive film on the semiconductor film, a third trench is formed at a predetermined position by laser scribing based on the second trench to pattern the circuit. A method of patterning a thin film using a laser beam is known. Next, a conventional laser processing apparatus for performing the above-mentioned laser scribing process is shown in FIG. A drive table, 3 is a YAG laser oscillator, 4 is a laser power source, 5 is a laser optical system consisting of a collimator lens 6, a dichroic mirror 7, and a condenser lens 8, 9 is an operation control device, and 10 is a positioning pin for the workpiece 2. It is. With this configuration, during processing, the laser beam 11 oscillated by the laser oscillator 3 in response to a command from the operation control unit W9 is directed to the processing surface of the workpiece 2 via the collimator lens 6, the dichroic mirror 7° and the condensing lens 8. On the other hand, the x
- The y-axis drive table 1 moves
The movement is controlled in the axial and Y-axis directions, whereby the irradiation spot of the laser beam scans the surface to be processed to perform laser scribing processing, thereby forming an open groove 12 corresponding to a predetermined circuit pattern. By the way, the beam spot of the laser beam 11 oscillated and emitted from the laser oscillator 3 in the above configuration usually has a circular cross section, and the laser beam is directly irradiated onto the workpiece surface through the collimator lens 6 and the condensing lens 8 to perform laser scribing. In the conventional laser processing method, the shape of the focused spot of the laser beam is circular, as shown in (a) in Figure 6, and the density distribution of the light intensity in the focused radial direction is as shown in the figure. As shown in (b), the energy density is highest at the center of the focused spot, and exhibits a type of Gaussian distribution in which the energy density rapidly attenuates toward the periphery of the spot. However, as mentioned above, the focused spot of the pulsed laser light, which has a circular shape and the light intensity density distribution exhibits a Gaussian distribution, is directly irradiated onto the workpiece surface, and the laser beam is formed into a predetermined pattern. Therefore, the conventional processing method in which laser scribing is performed while scanning has the following problems. In other words, in order to irradiate the surface to be processed with a circular condensed spot as it is and scan the irradiation spot on the surface to be processed to form the open grooves 12 of uniform width, the seventh step is necessary.
As shown in the figure, repeated irradiation must be performed by scanning in the direction of arrow X while finely overlapping the repeated pulses of irradiation spot 0) along the open groove 12, and as a result, the loss due to the overlapping of the irradiation spots is reduced. Grows and opens groove 1
The processing speed for forming 2 becomes slower. Conversely, the moving speed of table 1 is increased to increase the laser processing speed, and the pitch interval between the irradiation spot of the repeated pulse and the next irradiation spot is widened as shown in Figure 8 to narrow the overlap width of the irradiation spots. As a result, the side edges of the open grooves 12 become wavy, making it difficult to form open grooves of uniform width. In addition, if the number of repeated pulses is increased as another means of increasing the processing speed, the energy per pulse decreases due to laser oscillation characteristics, so there is a limit to increasing the number of repeated pulses, and the light intensity density The output of a laser oscillator whose distribution exhibits a Gaussian distribution is approximately 12 W at most, and an increase in the output energy per pulse cannot be expected. Therefore, the method of increasing the number of repeated pulses is not necessarily the same as the high-speed laser scribing process. does not contribute to Furthermore, as mentioned above, the light intensity distribution of the irradiation spot is a Gaussian distribution with a high energy density at the center, so for example, as shown in FIG. After layering the first conductive film 14 thereon and laser scribing the first groove 15, an amorphous semiconductor wave It! 16, when the second open groove 17 was formed by laser scribing, the groove bottom machined surface of the open groove 17 was not flat due to the light intensity distribution of the laser beam irradiation spot, and as shown in the figure. As shown in the figure, the processing depth of the open groove 17 locally becomes excessive in the central part of the groove and becomes extremely deep, and the processing depth reaches the first conductive coating 14, and this WA 14
In addition to machining damage, the machining depth is insufficient at the side edges of the open groove, and molten residue 18 remains. In addition, there are protrusions 19 and scattered objects 20 on the opening edge of the open groove 17.
Furthermore, as shown in the figure, when a thin film such as a photoelectric conversion element formed as a thin film laminate is used as a workpiece and a groove is selectively formed therein to separate the laminated region, the above-mentioned If unevenness in the machined surface or damage to the underlying film occurs in the open groove 17, this will lead to short circuits in the laminated region and increase in resistance, reducing photoelectric conversion efficiency, resulting in large variations in the characteristics of the product. This may lead to problems such as lower product yields. Furthermore, in the conventional laser processing apparatus shown in FIG. 5, the laser beam 11 oscillated from the laser oscillator 3
Laser optical system 5 For example, the method of scanning the laser beam by controlling the movement using a plotter is unsuitable for laser patterning of thin films, which requires precision, as it tends to cause variations in processing.As a result, the conventional laser beam transmission method 5 was fixedly arranged and the workpiece 2 had to be moved and controlled relative to it by the XY table 1 to scan the irradiated laser beam. Moreover, in order to perform laser scribing on a thin film type photoelectric conversion substrate with large dimensions of, for example, 400 x 1200 squares using such a table movement control method, the maximum stroke of the X-Y axis drive table must be at least 2400 m or more. However, this increases the installation area occupied by the processing equipment, and the X-Y axis drive table becomes a large and heavy object, making high-speed processing difficult and therefore unsuitable for mass production of product processing. Further, in the amorphous semiconductor film 16 in FIG.
In order to correctly position the workpiece 2 when laser scribing the second open groove 17 at a predetermined position with reference to , as shown in FIG. Place three or four points along the side edge of the workpiece 2. In other words, do not look at the monitor television 22 of the monitoring optical system 21 while the thin film photoelectric conversion substrate is pressed against the positioning pin 10.
A method is adopted in which the Y-axis drive table 1 is finely adjusted to align the machining position with respect to the second open groove 17 using the first open groove 15 as a reference. However, with this positioning method, the larger the board is, for example 400 x 1200 m, the more difficult it is to adjust the positioning, and the positioning work requires more effort and time.For example, as shown in FIG. To explain the case of positioning so that the gap 28 between the opening edge of the first opening groove 15 and the opening edge of the second opening groove 17 is maintained at about 0 to 2071 m1, the opening edge of the first opening groove 15 formed by laser scribing is When forming the groove line of the second groove 17 parallel to the line (hereinafter referred to as groove line) by laser scribing, 100
For xlOOm1 substrate, the parallelism θ between the first groove line and the second groove line is at least 20#11/100 fl,
In other words, θ# is 0.01 degree, but 400 x 120
(In the lfi board, the parallelism θ1 between the first groove line and the second groove line is at least 20 μ/1200, that is, θ'#
0.00096 I=I0.001 degree, and the parallelism is about 10 times higher, making it extremely difficult to set the position. Another problem is that when performing laser scribing processing that requires extremely high precision, such as the 11-film photoelectric conversion substrate mentioned above, with conventional equipment, defects occur in the open grooves due to decreases and fluctuations in laser output as described below. There are drawbacks. For example, single mode continuous wave YAG laser (Q
In a (switched) oscillator, due to the instability of the excitation lamp current, when the power supply voltage is kept constant, the laser output fluctuates in a short period with respect to the average output, as shown in Figure 10 (al). In the case of a basin setting, the variation in the excitation lamp current becomes large, and the range of variation in laser output also increases.As a result, variations in the depth of the groove formed by laser scribing are likely to occur. When a laser oscillator is operated for a long time for mass production processing, the output of the laser oscillator tends to decrease as the operating time elapses due to the life of the excitation lamp, as shown in Figure 1 (Figure 1). In addition, fluctuations in the laser output due to fluctuations in the power supply of factory equipment can cause variations in the groove depth of products formed by laser scribing when products are processed continuously for long periods of time, causing problems during mass production. This becomes a factor that leads to an increase in the incidence of non-defective products.

[Purpose of the invention]

This invention has been made in view of the above points,
This method eliminates the drawbacks of the conventional laser processing method described above, and prevents damage during processing of open grooves for thin film workpieces.
Laser processing enables laser scribing to create grooves of uniform width along the processed evaporation turn at high processing speed and stably over a long period of time, thereby ensuring stable product quality without variations during mass production processing. The goal is to provide equipment.

[Key points of the invention]

In order to achieve the above object, this invention is equipped with a table that holds a workpiece with the processing surface in a vertical position, a laser oscillator, and a laser optical system connected to the output end of the laser oscillator via an optical fiber. and a power supply controller that controls the laser power supply so as to maintain the laser output constant based on the detected output value of the oscillator. With this configuration, by first guiding the oscillated laser light from the laser oscillator whose light intensity distribution exhibits a Gaussian distribution into the optical fiber, the optical fiber flattens the light intensity distribution in the beam radial direction as the laser light propagates within the core. It exhibits characteristics that cause it to change. Note that such characteristics tend to be flattened whether the oscillation mode of the laser oscillator used is single mode laser light or multimode laser light. A rectangular field diaphragm parallel to the scanning direction of the laser beam is installed in the system, and the overlap rate of the repeated pulses of the laser beam irradiated onto the surface to be processed is selected to be small during laser scribe processing. This enables high-speed machining of grooves with high precision and uniform width along the machining evaporator turn.In addition, it is possible to use a lightweight and compact laser optical system while fixing the workpiece held on a heavy table. By controlling the movement of the mounted blocks, it is possible to further speed up laser processing. In addition, by installing a power supply controller that detects the l/- laser output of the laser oscillator and controls the laser power supply, it is possible to prevent instantaneous fluctuations in the laser output and problems that may occur when the laser oscillator is operated continuously for a long time. It is possible to maintain a stable laser output at all times by suppressing the decrease in laser output due to excitation lamp life and the relatively gradual fluctuations in laser output due to fluctuations in the power supply of factory equipment. By making the opening portions uniform, it is possible to suppress variations in quality between lofts during mass production of the opening groove portions. Furthermore, by holding the workpiece in a vertical position on the table, it is possible to significantly reduce the area occupied by the processing equipment even when the workpiece is a large-sized substrate, and it is also possible to When holding an object in a vertical position, positioning with good reproducibility can be achieved by using the floor surface of the table as a positioning reference surface, thereby making it possible to significantly reduce the effort and time required for positioning the workpiece.

[Embodiments of the invention]

FIG. 1 shows a configuration diagram of a laser processing apparatus according to an embodiment of the present invention, and the same members corresponding to those in FIG. 5 are given the same reference numerals. First, in FIG. 1, the laser processing apparatus is roughly divided into a vertical X-axis drive table 23 that mounts and holds the workpiece 2 in a vertical position, a laser oscillator 3, a laser power source 4, and an output terminal of the laser oscillator 3. optical fiber 2
A part of the output of the laser oscillator 3 is taken out and detected. a first power supply controller 26 that controls the laser power supply 4; a second power supply controller 27 that detects the laser beam spot output irradiated onto the table 23 and controls the laser power supply 4; and the table 23. Plotter 25
This is a coupler that gives movement control commands to the robot. On the other hand, the laser optical system 5 described above includes a collimator lens 6, a condenser lens 8, and a field diaphragm 28. Here, the field diaphragm body 28 is aligned with the optical axis of the laser beam 11, and the collimator lens 6 and the condensing lens 8
and the field diaphragm 28
A rectangular aperture hole is opened in parallel to the scanning direction of the laser beam irradiated onto the workpiece 2. Further, the laser oscillator 3 includes a Y laser with a wavelength of 1.06 Ina, a narrowing pulse frequency of 1 to 99 kLz, and an output of 0.1 to 1 oow, for example.
An AG laser is used. Further, the oscillation mode of the laser oscillator is not limited to the conventional single mode, but also a multi-mode that can oscillate a higher output than the single mode. Reference numeral 29 is an excitation lamp for the laser oscillator 3, 3o is a mirror that is built in the laser oscillator 3 and takes out part of the laser light output to the rear, and 31 is a laser, such as a photo sensor, arranged after the rear mirror 31. A high-speed optical sensor for detecting the direction of light output, 32 is the workpiece 2
The pulsed laser beam oscillated by the laser oscillator 3 with the above configuration is input from the laser beam input end of the optical fiber 24 and enters the optical fiber 24. The laser beam propagates to the laser beam output end, from where it passes through the collimator lens 6°, the aperture hole of the field diaphragm 28, and the condenser lens 8, and is irradiated onto the processing surface of the workpiece 2. On the other hand, in conjunction with the laser beam irradiation, command control from the operation control device 9 causes
- The laser optical system 5 mounted on the Y-axis plotter 25 is controlled to move in the X-axis and Y-axis directions together with the plotter 25 along the designated groove cutting evaturn. As a result, laser scribing in a predetermined pattern is performed on the processed surface of the workpiece 2, and the open grooves 12 are formed. In this case, the laser beam oscillated by the laser oscillator 3 is propagated through the optical fiber 24, and the laser beam 11 emitted from the laser beam output end has a flat distribution of light intensity density, resulting in a rectangular field of view. In the process of passing through the aperture body 28, the laser beam having a circular beam cross section has its peripheral region trimmed and becomes a long sword-shaped beam. In addition? J! By varying the ratio of the vertical and horizontal dimensions of the aperture hole of the holder 2H, the beam spot shape of the laser beam can be selected from various shapes such as rectangular and square. Further, in this case, the orientation of the field diaphragm body 28 is set so that the two parallel sides of the aperture hole are aligned with the X-axis, which is the scanning direction of the laser beam. By scanning the repeated pulses of the rectangular focused spot on the workpiece surface in this way, the open grooves are formed into straight, uniform width openings, unlike the continuous arcs shown in Figure 8. You will be able to form grooves. Furthermore, by selecting a small overlap rate of the laser beam return pulses during laser scribing as described below, it is possible to form grooves of uniform width at high speed along a predetermined processed pattern. Moreover, according to the above configuration, since the laser oscillator 3 and the laser optical system 5 are connected via the flexible optical fiber 24, the laser oscillator 3 remains fixedly installed and is attached to the plotter 25 with a light weight. Only the laser optical system 5 needs to be installed, and therefore the workpiece 2 can be kept fixed, instead of using a method of fixing the laser optical system 5 and controlling the movement of the table 1 as in the conventional device shown in FIG. Laser scribe processing can be performed by controlling the movement of the laser optical system 5, and since the movement of the laser optical system 5 is controlled by the plotter 25, which is lighter and smaller than the method of moving and scanning a heavy table, the speed of laser processing can be reduced. This makes it possible to achieve even higher speeds. Next, Fig. 5 shows the overlapping state of the irradiation spots as the workpiece surface is scanned by the method described above! When expressed in comparison with the position, it becomes as shown in Fig. 2 11a) and (b).
That is, FIG. 2(a) shows the case of the conventional device, in which repeated pulses of a circular irradiation spot with a radius r centered at 0 are moved along the scanning direction X by a pitch interval l while partially overlapping each other. The overlap rate ρ of repetitive pulses when scanning is ρ-(1-j!/2r) x 100% ・・・・・・・・・
−・・−・・・(1), on the other hand, the second opening)
As shown in , when the repetitive pulses of a rectangular irradiation spot parallel to the laser beam scanning direction X whose side length is 2r are moved and scanned at a pitch interval of 1°, the overlapping rate ρ of the repetitive pulses is expressed as , 11"-(1-1"'/2r)X100% --
--------121. Here, in order to make the grooves on the workpiece surface as close to a uniform width as possible, the radius of the focused spot in Fig. 2(a) is set as 2r = 75Jrm*1
= 15μ, the overlap rate ρ of the focused spots is 80% from equation (1), and if the frequency of the repetitive pulse is 4000Hz, the moving scanning speed of the laser beam is 154×4000Hz−60m/sec −・・−−
−−−−−−−−−−(It becomes 81. On the other hand, the second
In figure (b), the shape of the square focused spot is 75 x 7.
5*, i.e. 2r-75,w, l'=797r
s, the overlap rate of the focused spots p' from equation +21
is approximately 7%, and the frequency of the repetitive pulse is set to 4000H.
If z, the moving scanning speed of the laser beam is 70jnaX
400GHz -280w / see ---
-----(41), and the scanning speed, that is, the laser scribing processing speed, can be increased to 4.7 times compared to the result of equation (3) using the conventional method. By changing the shape of the body 28, the rectangular condensing spot shown in 2.
If the pitch interval of the 2r-200-1 irradiation spot is set to J'-1807rs as a rectangle of 0μ, the overlap rate will be p''-10% from the above equation (2), and if the frequency of the repetition pulse is 10000Hz, the laser beam will be The speed is 200 lmX10000Hz -1800m/sec
−−−−−−(5), and according to the conventional method (3)
It is possible to increase the scanning speed by about 30 times compared to the result of the formula. In this case, by adopting a multi-mode laser oscillator, the repetition pulse frequency can be easily increased.
Moreover, a focused spot with a large area can be obtained without reducing the irradiation energy density of the laser beam. In order to obtain the rectangular condensed spot described above, the aperture hole of the field diaphragm 28 is set to have a rectangular shape with a vertical to horizontal dimension ratio of 75:100. Here, a cross-section of the processed part is shown in Fig. 3 when a thin film type photoelectric conversion substrate is used as a workpiece and an open groove is actually formed by laser scribing using the laser processing apparatus shown in Fig. 1. As is clear from the figure, the open groove 17 contains the melted residue 18. seen in FIG. Protrusion 19. Almost no deposits 20 were observed, the processing depth of the open grooves 17 was almost uniform in the width direction, and processing damage to the underlying conductive coating 14 could be suppressed to an almost negligible level. In addition, in this case, the workpiece 2 is mounted and held in a vertical position on the vertical X-axis drive table 23, so for example
Even if the S-type photoelectric conversion substrate has a large size, the floor space occupied by the processing equipment does not increase, and the table floor part is used as a positioning reference surface when vertically leaning the large-sized substrate as described above. This allows for positioning with good reproducibility and reduces the time and effort required for positioning work. It becomes possible to significantly shorten the time. Further, as described in the apparatus shown in FIG. 1, a part of the laser light output oscillated by the laser oscillator 3 is taken out from the rear mirror 30, and a high-speed sensor placed behind the rear mirror 30, for example, a high-speed response sensor such as a photodiode, is used. The laser oscillator 3
The current of the excitation lamp 29 built in is set in advance and is constantly controlled at high speed so that it reaches a predetermined current value, thereby suppressing instantaneous fluctuations in laser output and maintaining a constant laser output. . Note that the rear mirror 30 may be of such a level that an output of, for example, 1% or less can be detected as a part of the laser light output. Furthermore, as shown in FIG. 1, the laser light output of the focused spot irradiated from the laser oscillator 3 via the laser optical system is detected intermittently by the optical sensor 32, that is, every time one laser scribing process is completed. By sending the detection signal to the second power supply controller 27 and controlling the laser power supply 4 via this power supply controller 27, the life of the excitation lamp that occurs when the laser oscillator 3 is operated continuously for a long time can be reduced. The output of the laser oscillator 3 can be maintained constant by compensating for a relatively gradual decrease in laser output due to a decrease in laser output or power supply fluctuations in factory equipment. In this way, by suppressing instantaneous fluctuations in laser output, as well as relatively gradual fluctuations and drops in laser output, and maintaining a stable output at all times, the accuracy of machining the open groove of the workpiece is improved and mass production is performed. Even when doing so, stable product quality can be maintained. FIG. 4 shows another embodiment, in which a plurality of workpieces 2 are mounted and held in series on both the front and back surfaces of a vertical X-axis drive table 23, and a large A multi-beam method is adopted in which the laser beam oscillated by the output laser oscillator 3 is branched into multiple branches by the branching optical fiber 33, and the laser beam is sent to each workpiece 2 through the laser optical system 5 mounted on each plotter 25.
The irradiation spot of the laser beam is scanned at the same time, and it is possible to laser scribe multiple workpieces 2 at the same time using one laser oscillator 3, which improves product processing. It can also be easily adapted to mass production.

【Effect of the invention】

As described above, according to the present invention, there is provided a table for holding a workpiece with the processing surface in a vertical position, a laser oscillator, and a laser optical system connected to the output end of the laser oscillator via an optical fiber. The table is equipped with a plotter that faces the table, and a power supply controller that controls the laser power supply to maintain a constant laser output based on the detected output value of the laser oscillator. Compared to the conventional method of laser scribing by scanning the circular irradiation spot onto the workpiece surface, the laser processing speed when forming grooves of uniform width is significantly increased, improving work efficiency. You will be able to improve your skills. Furthermore, by using an optical fiber to transmit the laser beam between the laser oscillator and the laser optical system, the light intensity distribution of the laser beam becomes a flat distribution, which prevents machining damage from occurring at the bottom of the groove. This makes it possible to form highly accurate grooves on the thin-film processed surface of the workpiece, especially for semiconductor devices such as thin-film photoelectric conversion substrates. In addition, since a lightweight and compact laser optical system is mounted on the plotter to control its movement, the laser processing speed can be increased even more easily. In addition, the laser output is detected continuously or intermittently and the laser power is controlled by the power controller, so stable laser output can be maintained at all times.This reduces variations in product characteristics and facilitates mass production. It is possible to provide a laser processing device with high practical effects, such as greatly improving product yield.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram of a laser processing apparatus according to an embodiment of the present invention, and FIG. 2 (al and (bl) are explanatory diagrams showing a comparison of scanning states of a repetitive pulse irradiation spot by a conventional laser processing apparatus and a laser processing apparatus according to the present invention, respectively. 3 is an enlarged cross-sectional view of a processed portion of a thin-film photoelectric conversion substrate subjected to laser scribing using the apparatus of the present invention, FIG. 4 is a configuration diagram of a laser processing apparatus according to another embodiment of the present invention, and FIG. The figure is a configuration diagram of a conventional laser processing device, FIG. 6 is a diagram of the shape of a laser beam condensed spot and its light intensity distribution by the laser processing method of a conventional device, and FIGS. 7 and 8 are irradiation spots of a conventional device, respectively. Fig. 9 is an enlarged cross-sectional view of the processed part of a thin-film photoelectric conversion substrate subjected to laser scribing using a conventional device; Fig. 10 (a) and (bl) are short-time and long-time laser output fluctuation characteristic diagrams of a continuous wave YAG laser oscillator with a Q switch, respectively. In each figure, 2: workpiece, 3: laser oscillator, 4: Laser power supply, 5: Laser optical system, 6: Collimator lens, 8+
Condensing lens, 9I operation control device, 11: Laser light, 12
: Open groove, 23: Table for mounting and holding the workpiece in a vertical position, 24: Optical fiber, 25: Plotter, 26: First
27: second power controller;
28: Field stop body, 30: Rear mirror, 31. 32+ Optical sensor for laser output detection. Fig. 5 Fig. 8 Fig. 9 Time (4c) Monen Kazu (G) (b) Fig. 10

Claims (1)

[Claims] 1) For a thin film workpiece, a pulsed laser beam oscillated by a laser oscillator is irradiated onto the workpiece surface through a laser optical system, and the irradiation spot is set on the workpiece surface. This is a laser processing device that scans and scribes open grooves, and includes a table that holds a workpiece with the processing surface in a vertical position, a laser oscillator, and an optical fiber connected to the output end of the laser oscillator. The plotter is equipped with a plotter facing the table and equipped with a laser optical system connected to the table, and a power supply controller that controls the laser power supply so as to maintain the laser output constant based on the detected output value of the laser oscillator. Laser processing equipment that is characterized by: 2) The laser processing apparatus according to claim 1, characterized in that the laser optical system comprises a collimator lens, a field diaphragm having an aperture hole parallel to the scanning direction of the laser beam spot, and a condenser lens. Laser processing equipment. 3) In the laser processing apparatus according to claim 1, a first power supply controller serves as a power supply controller and continuously detects the laser output of the laser oscillator to control the laser power supply; and a laser optical system from the laser oscillator. A laser processing apparatus comprising: a second power supply controller that controls a laser power supply by intermittently detecting the output of a laser beam irradiated through the laser beam. 4) In the laser processing apparatus according to claim 3, a part of the laser output of the laser oscillator is extracted from the rear mirror, detected by an optical sensor, and the detection signal is provided to the first power supply controller. Laser processing equipment featuring: 5) In the laser processing apparatus according to claim 3, the laser light output is detected by an optical sensor arranged on the table side alongside the workpiece, and the detection signal is given to the second power supply controller. A laser processing device characterized by the following.