JPS62242395A - Manufacture of radio frequency printed - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] (Technical field〕 The uninvention is the space satellite antenna circuit board.

Micros) This relates to a method for manufacturing single-frequency printed circuit boards used as IJ Tsubu ultra-high frequency circuit boards, space satellite broadcast receiver converter circuit boards, personal radio circuit boards, and other surface frequency applied equipment circuit boards. .

(Background Art) Conventionally, as a printed circuit board for high frequency use, a printed circuit board whose dielectric material is Teflon resin and glass fiber is generally used. The cost of Teflon-based printed circuit boards is extremely high, and since all glass fibers are used, the power loss (hereinafter referred to as TA) when Teflon resin is used alone is extremely high.
There is also the problem that tan a is lower than naJ.

(Object of the Invention) The present invention has been made in view of the above points, and has the advantage of being able to form a high-frequency device that can be formed in a feminine value, prevents corrosion from occurring in the circuit, and has excellent electrical characteristics. It is an object of the present invention to provide a method for manufacturing a printed circuit board.

(Disclosure of the Invention) The method for manufacturing a high-frequency printed circuit board according to the present invention is to form a high-frequency printed circuit on one side of an I-burnable film, and apply an organic unsaturated acid to a fiJ flexible film on the printed circuit side. A modified polyolefin modified with polyolefin, a nonpolar polyolefin, a modified polyolefin, a flexible film with a circuit formed on one or both sides, a modified polyolefin, and a metal are laminated in this order, and the layers are laminated in this order at a temperature higher than the melting point of the polyolefin. This is based on heating and pressurizing, and will be described in detail below.

FIG. 1 shows an embodiment of the method for manufacturing a high frequency printed circuit board of the present invention.

In FIG. 3 (IIL), a polyester film or a polyethylene film can be used as the flexible film 1, but it has a sound flexibility that does not cause large deformation when a circuit is formed by etching or the like. The thickness is appropriately determined depending on the physical properties of the film used. Preferably, a low shrinkage polyester film with a thickness of 50 to 200 μm is used.

A metal foil 4 such as aluminum foil, copper foil, tin foil, or iron foil is laminated on one side of the 6Tm film 1 using an adhesive 5 using a conventional method such as a dry lamination method or an extrusion lamination method. Here, metal FM 4 il: One side is formed as a rough surface and the other side as a smooth surface, but it is preferable that the rough surface is brought into contact with the i'iT sinterable film 1.

Next, screen printing or gravure printing is performed on the surface of the metal foil 4.

The resist ink 6 is printed in the desired circuit shape by photographic printing, etc., and then treated with an etching solution to remove unnecessary portions of the metal foil 4 as shown in FIG. 3(b).
to form. The resist ink 6 is often removed after this, but it is not necessary to remove it if the thickness is such that it does not affect the tan δ of the completed printed circuit board. Whether or not to remove the resist ink 6 may be appropriately determined depending on the electrical characteristics (tan δ and dielectric constant εr) of the resist ink 6 used.

After forming the circuit 2 on one or both sides of the flexible film 1 in advance, the flexible film 10 shown in FIG. It consists of a film 7, a layer 8 of non-polar polyolefin, and a layer 3 of metal such as gold JgiW3 or a metal plate, which serves as an overall substrate. These arrangements are made using a flexible film 1. as shown in FIG. Modified polyolefin film 7
, nonpolar polyolefin layer8. Modified polyolefin film 7, flexible film 1 with circuit 2 on one or both sides via adhesive 5, then modified polyolefin film 7
, nonpolar polyolefin layer8. A modified polyolefin film 7 and a gold layer 14 layer 3 are set.

The polyolefin modified with an organic unsaturated acid is used as an adhesive between the nonpolar polyolefin and the metal circuit 2 or the metal N3 that becomes the wire mesh substrate, and the polyolefin is modified with an organic unsaturated acid to impart polarity. , the adhesion is improved. And this is heavy density polyethylene, medium density polyethylene.

It is prepared by modifying polyolefins such as low-density polyethylene, linear low-degree polyethylene, polyglopyrene, copolymers and mixtures thereof, with organic unsaturated acids. As organic unsaturated acids, unsaturated carboxylic acids and their dielectrics are used, and unsaturated carboxylic acids include acrylic acid, methacrylic acid, maninic acid, etc.
Examples of the dielectric material include acid anhydrides, ester amides, and imides of unsaturated carboxylic acids, such as maleic anhydride, citraconic anhydride, methyl methacrylate, and diptylamide fumarate. Among them, maleic anhydride is often used. Modified KRCO, o1 to 3% is preferably used, and this modified polyolefin is preferably used as a film 7 having a thickness of 10 to 200 μm1 and preferably 30 to 100 #y+ from the viewpoint of electrical properties and shielding properties.

In addition, as the non-polar polyolefin, cylindrical density polyethylene, medium density polyethylene, low density polyethylene, linear low @ degree polyethylene, polypropylene, copolymers and mixtures thereof, etc. are used, and the thickness is 100 to 3000 μm.
It is used as the film 8 (or sheet) of Among them, nonpolar polyolefins with a density of 0.92 to 0
．． 97 polyethylene is preferably used.

Furthermore, as the metal part board, a plate or foil of stainless steel, aluminum, iron, or a film or sheet covered with gold foil is used, but the thickness is limited, for example. However, depending on the thickness of the non-polar polyolefin film 8, the thickness of the flexible film 1, etc., it is preferable to set it at a value where warping is less likely to occur.

Then, a printed circuit board for high frequency is created by heating and pressurizing the laminated structure in the "T" configuration shown in FIG. 1 at a temperature higher than the melting point of the non-polar polyolefin film 8. The temperature range is set above the melting point of 8°C, but below this melting point.

It is best to set it to . This temperature range is appropriately set by taking into consideration the characteristics of the nonpolar polyolefin film 8, such as the thermal flow characteristics (melt intex; MI) and the bonding strength required for the printed circuit board. Further, the pressurizing pressure is set to 1 to 10 K9/ct/1 punch, preferably 3 to 8 to/-, and is set in the same manner as the above heating temperature. In this way, as shown in FIG. 2, the modified polyolefin film 7'J? In the process, a non-polar polyolefin film 8 is bath-melted and crushed to form a non-polar polyolefin, a dielectric material (insulating substrate) 10, a flexible film 12 having a circuit 2 using a modified polyolefin as an adhesive, and a gold JM layer 3. By this, a high frequency printed circuit board can be obtained. Since the modified polyolefin layer and the nonpolar polyolefin layer are in a compatible state at the interface, there is no interface.

In the high-frequency printed circuit board obtained in this way, the dielectric layer is formed of polyolefin, so there is no cost burden unlike when using Teflon resin as the dielectric layer. Since the (b) path for high frequency in the housing is already formed on the flexible film, no etching process is applied to the dielectric layer that forms the substrate of the printed circuit board. In addition to eliminating the possibility of warping of the circuit board,
Since warping does not occur in this way, there is no need to add glass fiber or the like, and the tanJy does not decrease. This will prevent the circuit from being corroded or damaged.

Next, the present invention will be specifically explained with reference to Examples.0 (Example 1) A circuit in which a strip line is formed on a microphone for satellite broadcast reception by etching from a 35 μm copper-clad polyester film (50 prn thickness) (A) .

■) respectively (see Figure 1).

This circuit-forming polyester film 1 and a non-polar polyolefin 8 (density i0.94°MI=0.4)
, a maleic anhydride-modified polyolefin film with a thickness of 50 μm and a thickness of 0.0 μm as the R-type polyolefin film 7.
2 mm stainless steel plates (SUS 305) were heated in the order shown in Figure 1 at a temperature of 125°C and a pressure of 2Kf/I:1/
1. Heat and pressurize for 1 minute (heating time: 5 minutes, cooling time: 10 minutes) to produce a high-frequency print (as shown in Figure 2).
b) A stepping stone meeting was held.

(Example 2) Implementation? In Il 1, a polypropylene film (density 0.9°MI=
A high frequency printed circuit board was obtained in the same manner as in Example 1 except that Example 7) was used.

(Comparative Example 1) Using the same steel foil, non-polar polyolefin film, modified polyolefin film, and stainless steel plate as in IM Example 1, these were stacked in order according to the structure shown in Fig. 4 to prepare Example 1.
After integrating under the same heating and pressurizing conditions as in the case of , a high frequency printed circuit board was obtained.

(Comparative Example 2) A high-frequency printed circuit board was obtained by integrating the dielectric layer of Comparative Example 1 with a glass Teflon laminate instead of non-polar polyethylene in the same configuration as Comparative Example 1.

The performance of the high frequency printed circuit boards obtained in Example 1.2 and Comparative Example 1.2 was measured and evaluated. The results are shown in Table 1. In Table 1, [Outdoor exposure test] shows the results of measuring the antenna gain after exposing high frequency printed circuit boards outdoors for one year. In addition, in the [salt water spray test], the external appearance of the high frequency printed circuit board was inspected after 5 cycles of salt water spraying on the high frequency printed circuit board. According to the present invention, one side of the flexible film V
c High frequency printed circuit is formed, printed 1 on the road side,
A flexible film with a modified polyolefin layer modified with organic unsaturated acids, a nonpolar polyolefin layer, and a modified polyolefin layer.

A WJ sabotage film with a complete circuit formed on at least one side.

A modified polyolefin layer, an unscrupulous polyolefin layer, a modified polyolefin layer, and a metal layer are laminated in this order and heated and pressurized at a temperature higher than the melting point of the polyolefin.B) A dielectric layer is formed entirely from polyolefin. This eliminates the unavoidable high cost of using Teflon resin as the dielectric layer, and also because the high frequency circuit is pre-formed on the flexible film. Since the polyolefin that forms the dielectric layer of the printed circuit board is not subjected to etching treatment, the printed circuit board does not warp; There is no need to add glass fiber or the like to the material, and therefore the electrical characteristics in the high frequency band can be improved without lowering the JAN.

[Brief explanation of drawings]

Fig. 1 is an embodiment of the uninvented manufacturing method, Fig. 2 is a sectional view of a high frequency printed circuit board made according to the invention, and Figs. 3 (a) and (b) are the manufacturing steps of the invention. FIG. 4 is a cross-sectional view of a conventional example. 1...Flexible film, 2...Circuit,
3... Metal layer, 4... Gold 14 foil, 5...
...Adhesive, 6...Resist, 7...
...Modified polyolefin film, 8...Nonpolar polyolefin film, 10...S Dentai no So.

Claims (2)

[Claims] (1) A high-frequency printed circuit is formed on one side of a flexible film, and a modified polyolefin layer modified with an organic unsaturated acid, a nonpolar polyolefin layer, a modified polyolefin layer, etc. are further formed on the flexible film on the printed circuit side. A flexible film with a circuit formed on one side, a modified polyolefin layer, a non-polar polyolefin layer, a modified polyolefin layer, and a metal layer are laminated in this order, and heated and pressurized at a temperature equal to or higher than the melting point of the polyolefin. A method of manufacturing a high frequency printed circuit board. (2) The method for producing a high frequency printed circuit board according to claim 1, wherein the nonpolar polyolefin is polyethylene, and the modified polyolefin is mainly a modified polyethylene resin composition made of maleic anhydride.