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JPS62238393A - Method for electroplating aluminum material - Google Patents

Method for electroplating aluminum material

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Publication number
JPS62238393A
JPS62238393A JP7823386A JP7823386A JPS62238393A JP S62238393 A JPS62238393 A JP S62238393A JP 7823386 A JP7823386 A JP 7823386A JP 7823386 A JP7823386 A JP 7823386A JP S62238393 A JPS62238393 A JP S62238393A
Authority
JP
Japan
Prior art keywords
bath
nickel
acid
electroplating
electrolysis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7823386A
Other languages
Japanese (ja)
Inventor
Toshihiko Sato
敏彦 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Light Metal Co Ltd
Original Assignee
Nippon Light Metal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Light Metal Co Ltd filed Critical Nippon Light Metal Co Ltd
Priority to JP7823386A priority Critical patent/JPS62238393A/en
Publication of JPS62238393A publication Critical patent/JPS62238393A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To enable the electroplating of an Al material even in case where the Al material is Al foil which is hardly electroplated by a conventional method, by pretreating the Al material by AC electrolysis in an acidic nickel salt bath of a specified pH. CONSTITUTION:An Al material is pretreated by AC electrolysis in an aqueous soln. of 2-3.5pH contg. a water soluble nickel salt and an inorg. acid and/or an org. acid forming a porous oxide film together with the nickel salt to form an underlayer. Cathodic electrolysis is then carried out in a conventional electrolytic bath in a single stage or plural stages.

Description

【発明の詳細な説明】 東!上皇科■分亘 本発明はアルミニウムまたはアルミニウム合金材(以下
、総称して「アルミニウム材」という。)へ電気めっき
を施す方法であり、特に前処理としての下地層の形成に
新規な方法を適用する電気めっき方法に関するものであ
る。
[Detailed description of the invention] East! The present invention is a method of electroplating aluminum or aluminum alloy materials (hereinafter collectively referred to as "aluminum materials"), and in particular applies a novel method to the formation of a base layer as a pretreatment. The present invention relates to an electroplating method.

従来技術 アルミニウム材上へ電気めっきを施す場合、直接電気め
っきすると得られた皮膜の密着性が悪く剥離し易いため
、亜鉛や錫の下地層を形成した後、所望金属の電気めっ
きを行なう方法が汎用されてきた。また、アルミニウム
材にリン酸浴による陽極酸化皮膜を形成した後、電気め
っきを施す方法も古くから知られている。
Conventional technology When electroplating is applied to aluminum materials, the adhesion of the resulting film is poor and it easily peels off when electroplated directly, so it is recommended to form a base layer of zinc or tin and then electroplate the desired metal. It has been widely used. Furthermore, a method has long been known in which an anodic oxide film is formed on an aluminum material using a phosphoric acid bath and then electroplated.

しかし、従来法による場合、アルミニウム材の消耗が多
く、そのためアルミニウム箔地材のように薄肉材に適用
するときに、アルミ箔が溶解消滅することもあり、例え
ば、プリント基板用アルミニウム材の製造に適用するこ
とは難しかった。
However, when using the conventional method, the aluminum material is consumed a lot, and therefore, when applied to thin materials such as aluminum foil base materials, the aluminum foil may melt and disappear.For example, when manufacturing aluminum materials for printed circuit boards, It was difficult to apply.

発明が解ンしようとする問題点8 本発明は、従来法の上記のような問題点に鑑み、下地層
の形成に際して被処理材の溶解消耗が少なくしかも電気
めっき層の密着性も向上し得る方法を提案するものであ
る。
Problem 8 to be Solved by the Invention In view of the above-mentioned problems of the conventional method, the present invention reduces dissolution and consumption of the material to be treated when forming the base layer, and also improves the adhesion of the electroplated layer. This paper proposes a method.

これにより、従来から汎用的に処理されている厚肉材は
もとより、プリント基板その他の用途に適用される箔地
材のような薄肉材についても適用できる汎用性の高い手
段を提供できる。
As a result, it is possible to provide a highly versatile means that can be applied not only to thick-walled materials that have conventionally been commonly processed, but also to thin-walled materials such as foil base materials used for printed circuit boards and other uses.

間一点を解決するための手段 本発明は前処理として、アルミニウム材を水溶性ニッケ
ル塩とこれに共存して多孔質酸化皮膜を形成する無機酸
または/および有機酸を含有し、。
Means for Solving the Problems The present invention pre-treats the aluminum material by containing a water-soluble nickel salt and an inorganic acid and/or an organic acid that coexists with the water-soluble nickel salt to form a porous oxide film.

pH値が2.0ないし3.5の水溶液中で交流電解処理
して下地層を形成した後、常法の電気めっき浴中で一段
または複数段の陰極電解を行なうことを特徴とするアル
ミニウム材への電気めっき方法である。
An aluminum material characterized by forming a base layer by performing alternating current electrolysis treatment in an aqueous solution with a pH value of 2.0 to 3.5, and then performing one or more stages of cathodic electrolysis in a conventional electroplating bath. This is an electroplating method.

水溶性ニッケル塩として、硫酸ニッケル、塩化ニッケル
、酢酸ニッケル等を適用し得るがその濃度はLog/j
’から飽和濃度までの広い範囲に亙って使用可能であり
、最適の塩である硫酸ニッケル(NtSO,・6H,0
)の場合、10g/l〜250g、Q’が望ましい。
As the water-soluble nickel salt, nickel sulfate, nickel chloride, nickel acetate, etc. can be used, but the concentration is Log/j
Nickel sulfate (NtSO, 6H, 0
), 10 g/l to 250 g, Q' is desirable.

この濃度におけるニッケル塩水溶液に対して、ニッケル
塩と共存して多孔質酸化皮膜を形成する無機酸、有機酸
及びそれらの混合酸を添加して水溶液のpH値を2.0
〜3.5に調整する。
To the nickel salt aqueous solution at this concentration, an inorganic acid, an organic acid, and a mixed acid thereof that coexist with the nickel salt to form a porous oxide film are added to adjust the pH value of the aqueous solution to 2.0.
Adjust to ~3.5.

この種の無機酸としては、硫酸が最適であるが、はう酸
、塩酸、硝酸等も適用でき有機酸としては、酢酸、酒石
酸、クエン酸、スルファミン酸1.マレイン酸、リンゴ
酸等が適用し得るし、混酸として適用する場合には無機
酸同士、有機酸同士及び無機酸と有機酸の組合せのいず
れかであってもよい。
As this kind of inorganic acid, sulfuric acid is most suitable, but chloric acid, hydrochloric acid, nitric acid, etc. can also be used.As organic acids, acetic acid, tartaric acid, citric acid, sulfamic acid, etc. Maleic acid, malic acid, etc. can be used, and when used as a mixed acid, a combination of inorganic acids, organic acids, or a combination of an inorganic acid and an organic acid may be used.

上記により調製された酸性ニッケル浴に対して、アルミ
ニウム材を浸漬し、浴温1o〜60 ’C1電解密度0
.1〜10 A/dm” 、電解電圧4〜1.OVにて
5〜60分間の交流電解処理を行なう。交流は通常の商
用交流が汎用的であるが、PR波であってもよい。
The aluminum material was immersed in the acidic nickel bath prepared above, and the bath temperature was 1o~60'C1 electrolytic density was 0.
.. AC electrolytic treatment is performed for 5 to 60 minutes at an electrolytic voltage of 4 to 1.0 A/dm" and an electrolytic voltage of 4 to 1.OV. The AC is commonly used as ordinary commercial AC, but PR waves may also be used.

このような下地処理によって、アルミニウムの溶出量が
少ない状態で、1μ−前後の薄い多孔質酸化皮膜が形成
されると共にそのボアー中に金属状ニッケルが析出して
いる構造の下地層が形成され、この析出ニッケル粒子が
電気めっき際の導電性金属析出活性点となる。
Through such surface treatment, a thin porous oxide film of around 1μ is formed with a small amount of aluminum eluted, and a base layer with a structure in which metallic nickel is precipitated in the bores is formed. These precipitated nickel particles serve as active sites for depositing conductive metal during electroplating.

このような交流電解処理において、浴のpH値と電解電
圧値が上記のような所望の下地層を形成するのに重要で
ある。即ち、浴のpH値が2.0以下の強酸性になると
ニッケルイオンの電析よりも水素ガス発生反応の方が優
勢になり、酸化皮膜の形成はみられるがニッケルの析出
が発現せず、所望の下地層が得られない。一方、pH値
が4.0以上の弱酸性になると、ニッケルイオンの電析
が生ずるが多孔質酸化皮膜が形成され難くなるので好ま
しくなく、実用的にはpH値が2.0〜3.5であるこ
とが適当である。
In such AC electrolytic treatment, the pH value of the bath and the electrolytic voltage value are important for forming the desired underlayer as described above. That is, when the pH value of the bath becomes strongly acidic (below 2.0), the hydrogen gas generation reaction becomes more dominant than the electrodeposition of nickel ions, and although an oxide film is formed, nickel precipitation does not occur. Desired base layer cannot be obtained. On the other hand, if the pH value becomes weakly acidic (4.0 or higher), nickel ions will be deposited, but a porous oxide film will be difficult to form, which is undesirable. It is appropriate that

更に、浴のpH値が2.0〜3.5の範囲にある場合で
あっても、電解電圧が4V以下の場合には酸化皮膜の形
成とニッケルの析出も発現し難く、又、10V以上にな
ると酸化皮膜中のバリヤ一層が厚くなり過ぎて、ニッケ
ルイオンの電析が行なわれなくなるので好ましくない。
Furthermore, even if the pH value of the bath is in the range of 2.0 to 3.5, the formation of an oxide film and the precipitation of nickel are difficult to occur when the electrolytic voltage is 4V or less; This is not preferable because the barrier layer in the oxide film becomes too thick and nickel ions are no longer deposited.

なおpH値の調整において、無機酸単独で調製する場合
には、下限側pH値を2.5程度とするのが好ましく有
機酸単独又は混酸で用いる場合には有機酸のキレート効
果も発揮されるのでpH2,0でも効果が発現される。
In addition, when adjusting the pH value, when preparing with an inorganic acid alone, it is preferable to set the lower limit pH value to about 2.5, and when using an organic acid alone or a mixed acid, the chelating effect of the organic acid is also exhibited. Therefore, the effect is expressed even at pH 2.0.

このような交流電解処理に供するアルミニウム材として
は(a)通常の脱脂処理、エツチング処理等の前処理を
経て用意されるアルミニウム材は勿論のこと、(b)例
えばプリント基板の製造に見られるようにあるパターン
や模様状に電気めっ層を形成したい場合には予め非電気
めっき処理領域を非導電性皮膜処理したアルミニウム材
とすることもできる。その場合、非導電性皮膜は、合成
樹脂塗膜や厚いバリヤー型陽極酸化皮膜などとすること
ができる。
Aluminum materials to be subjected to such AC electrolytic treatment include (a) aluminum materials prepared through normal pretreatment such as degreasing and etching, and (b) aluminum materials that are used, for example, in the manufacture of printed circuit boards. If it is desired to form an electroplated layer in a certain pattern or pattern, an aluminum material may be used in which the non-electroplating areas have been previously treated with a non-conductive film. In that case, the non-conductive film can be a synthetic resin coating, a thick barrier type anodic oxide coating, or the like.

なお、浴をニッケル塩としたが、Ag、Sn。Although the bath was made of nickel salt, Ag and Sn were used as the bath.

Cu塩でも同様に可能であるがAg、Sn浴では浴の劣
化が激しく多量処理に不適当であり、Cu浴では皮膜の
密着性の信頼性に欠けるので、安定操業を容易になしう
るニッケル塩に限定した。
It is possible to do the same with Cu salt, but Ag and Sn baths cause severe deterioration and are unsuitable for large-scale processing, and Cu baths lack reliability in film adhesion, so nickel salts, which can facilitate stable operation, are used. limited to.

交流電解処理後、次いで電気めっき処理を行なうが、交
流電解処理おいて酸化皮膜中に金属ニッケルが析出して
おり、それが導通下地層として、その上部に所望金属め
っき層を形成することができる。従って電気めっき法と
して適宜の電気めっき方式による各種金属のめっき層を
適用できるものであって、例えば汎用されているニッケ
ル、スズ、銅、亜鉛、クロム、銀等の電気めっき処理を
被処理材の用途に応じて適宜選定し得る。又、電気めっ
き方式としても一段または複数段処理として単一層から
成るめっき層を形成する処理方法または異種金属を多層
に積層して成るめっき層を形成する処理法なども適宜常
法によって適用し得る。
After AC electrolysis treatment, electroplating treatment is performed next, but metallic nickel is precipitated in the oxide film during AC electrolysis treatment, and it can be used as a conductive base layer to form the desired metal plating layer on top. . Therefore, as an electroplating method, plating layers of various metals can be applied using an appropriate electroplating method. For example, electroplating of commonly used nickel, tin, copper, zinc, chromium, silver, etc. It can be selected as appropriate depending on the purpose. In addition, as an electroplating method, a treatment method of forming a plating layer consisting of a single layer as a single-stage or multi-step treatment, or a treatment method of forming a plating layer consisting of multiple layers of different metals, etc. can be applied as appropriate by conventional methods. .

以下、代表例として交流電解処理に続いてニッケルめっ
きを行なう場合について述べる。
The case where nickel plating is performed subsequent to AC electrolytic treatment will be described below as a typical example.

ニッケルめっきの場合には、酸性ニッケル浴が電気めっ
きを行なうのに十分なニッケル濃度を有するときにその
まま同一浴中で直流陰極電解を引続いて実施する方式と
通常のワット浴等と知られている別組成の電気めっき専
用浴中で実施する方式とを採ることができる。
In the case of nickel plating, there are two methods: when the acidic nickel bath has a sufficient nickel concentration for electroplating, direct current cathodic electrolysis is subsequently carried out in the same bath, and there is a method known as a normal Watt bath. It is also possible to adopt a method in which the electroplating is carried out in a dedicated electroplating bath with a different composition.

前者の方式によるときは水洗工程が不要であるというメ
リットも発現し得るが、例えば硫酸ニッケル10〜25
0g/lに硫酸、はう酸、酒石酸、クエン酸等を添加し
、pH2,0〜3.5にある浴温30〜60℃の水溶液
で所定の交流電解処理を実施した後、電解電圧2〜10
v、電流密度1.5〜2.5A/dm”の条件下で5〜
60分の直流陰極電解を行ない0.1〜10μmのニッ
ケルめっき層を形成する。この場合、更に引続いてクロ
ムめっきや銅めっきを別浴で施すこともできる。
The former method may have the advantage of not requiring a water washing process, but for example, nickel sulfate of 10 to 25
After adding sulfuric acid, halonic acid, tartaric acid, citric acid, etc. to 0 g/l and carrying out a specified AC electrolytic treatment in an aqueous solution with a pH of 2.0 to 3.5 and a bath temperature of 30 to 60°C, the electrolytic voltage was set to 2. ~10
v, 5 to 5 under the condition of current density 1.5 to 2.5 A/dm"
Direct current cathode electrolysis is performed for 60 minutes to form a 0.1-10 μm nickel plating layer. In this case, chromium plating or copper plating can be applied subsequently in a separate bath.

後者の場合、一般のニッケルめっき浴として知られてい
るワット浴、スルファミン酸浴、ワイスベルブ浴、普通
浴、混合浴等を被処理材の用途などに応じて適宜選定し
適用される。
In the latter case, a Watt bath, a sulfamic acid bath, a Weissberb bath, an ordinary bath, a mixed bath, etc., which are known as general nickel plating baths, are appropriately selected and applied depending on the use of the material to be treated.

例えばワット浴の場合、硫酸ニッケル240g/l、塩
化ニッケル45g/l、はう酸30g#を主成分とする
浴(pl、5〜5.5)に、交流電解処理したアルミニ
ウム材を浸漬し、浴温45〜70℃、電流密度2〜8A
/dI62電解電圧2〜5vの条件で1()〜60分間
直流電解を行ないニッケルめっき層を形成させる。
For example, in the case of a Watt bath, an aluminum material subjected to AC electrolysis treatment is immersed in a bath (pl, 5 to 5.5) whose main components are 240 g/l of nickel sulfate, 45 g/l of nickel chloride, and 30 g of halonic acid. Bath temperature 45-70℃, current density 2-8A
Direct current electrolysis is performed for 1 ( ) to 60 minutes at an electrolytic voltage of 2 to 5 V to form a nickel plating layer.

同様に他金属の場合であっても、金属表面技術便覧(日
刊工業新聞社列)、表面処理ハンドブック(産業図書社
刊)、などに記載されている適宜の方法が適用できるが
、その−例を次表に示す。
Similarly, even in the case of other metals, appropriate methods described in the Metal Surface Technology Handbook (Nikkan Kogyo Shimbunsha Series), Surface Treatment Handbook (Sangyo Toshosha Publishing Co., Ltd.), etc. can be applied. are shown in the table below.

以」二のような電気めっき処理において、プリント基板
の製造などのように被処理材の一部分にめっき処理を施
こす場合などにみられるように電気めっき層の形成は被
処理材に対して部分的、模様状、全面的のいずれであっ
てもよい。
In the electroplating process described below, the electroplating layer is formed on a portion of the material to be processed, as seen when plating is applied to a portion of the material to be processed, such as in the manufacture of printed circuit boards. It may be a pattern, a pattern, or an entire surface.

実施例 以下、本発明を実施例によって詳述する。Example Hereinafter, the present invention will be explained in detail with reference to Examples.

〈実施例1〉 純度99.9%、厚さ100μmのアルミニウム箔をア
セトンで脱脂後、硫酸ニッケル(N15On・6HzO
) 250 g/ l、はう酸25g/l、硫酸5 g
/ (!から成るpH3,0の浴にて、浴温60℃、浴
電圧6Vで50Hzの交流を用い、10分間交流電解処
理を行ない水洗した。
<Example 1> After degreasing an aluminum foil with a purity of 99.9% and a thickness of 100 μm with acetone, it was degreased with nickel sulfate (N15On・6HzO
) 250 g/l, oxalic acid 25 g/l, sulfuric acid 5 g
AC electrolytic treatment was performed for 10 minutes using a bath temperature of 60° C., bath voltage of 6 V, and 50 Hz alternating current in a pH 3.0 bath consisting of / (!), followed by washing with water.

この時、アルミニウム箔は緑色に着色されており、指で
こすっても脱色せず、析出ニッケルが交流皮膜中のボア
ー中にあることが分かる。
At this time, the aluminum foil was colored green and did not discolor even when rubbed with a finger, indicating that the precipitated nickel was in the bores in the AC coating.

次いで、ニッケル電気めっき処理として、硫酸ニッケル
(N15Oa・6HzO) 300g/β、塩化ニッケ
ル(N1Cj!z ) 45g/j?、はう酸30g/
l!から成るpH5,0の浴にて、ニッケル陽極を用い
て浴温50゛C1電流密度5A/dm2の条件で直流陰
極電解を10分間行なった。
Next, as nickel electroplating treatment, nickel sulfate (N15Oa・6HzO) 300g/β and nickel chloride (N1Cj!z) 45g/j? , 30g/
l! Direct current cathodic electrolysis was carried out for 10 minutes using a nickel anode at a bath temperature of 50°C and a current density of 5A/dm2 in a pH 5.0 bath consisting of the following.

ニッケルめっき膜(5μ■)が形成されたアルミニウム
箔に対して繰返し折り曲げ試験を試みたが剥離せず、密
着性の良好なめっき膜が形成されたことが確認された。
A repeated bending test was performed on the aluminum foil on which the nickel plating film (5 μm) was formed, but no peeling occurred, and it was confirmed that a plating film with good adhesion was formed.

〈実施例2〉 JIS6063製アルミニウム押出管についてカセイソ
ーダエツチング処理を行ない、水洗後、硫酸ニッケル(
NtSOn・68tO) 250g1l、酒石酸50g
/i I)H3,0(7)浴にて、浴温40℃、浴電圧
8■で50Hzの商用交流を用い30分間交流電解処理
を行なった。
<Example 2> JIS6063 aluminum extruded tube was subjected to caustic soda etching treatment, and after washing with water, nickel sulfate (
NtSOn・68tO) 250g1l, tartaric acid 50g
/i I) AC electrolytic treatment was carried out in a H3,0(7) bath for 30 minutes using a commercial alternating current of 50 Hz at a bath temperature of 40° C. and a bath voltage of 8 μ.

次いで、同浴中で浴温40℃、電流密度6A/dm”に
て、陽極としてニッケル極を用いて直流陰極電解を5分
間行なった。生成ニッケルめっき層の密着性は、従来法
のものと遜色なかった。
Next, DC cathode electrolysis was performed in the same bath at a bath temperature of 40°C and a current density of 6 A/dm for 5 minutes using a nickel electrode as an anode. It was comparable.

次いで、無水クロム酸250g#’、ゲイフッ化ナトリ
ウム5g/l、硫酸1.5 g/ lから成る浴中に浸
漬し、浴温55℃、電流密度40A/dm2で直流陰極
電解を10分間行ないニッケル層の上にクロム層を形成
したが、従来法と同様に安定しためっき処理を行なうこ
とができた。
Next, it was immersed in a bath consisting of 250 g of chromic anhydride, 5 g/l of sodium fluoride, and 1.5 g/l of sulfuric acid, and DC cathode electrolysis was performed for 10 minutes at a bath temperature of 55°C and a current density of 40 A/dm2 to remove nickel. Although a chromium layer was formed on top of the chromium layer, stable plating could be performed in the same manner as in the conventional method.

〈実施例3〉 純度99.0%のアルミニウム板(0,3龍厚)をトル
エンで脱脂後板の下半分だけを50g/l酒石酸アンモ
ニウム水溶液の浴中で浴温25℃、浴電圧50Vで直流
陽極酸化処理を2分間行ない、バリヤー型酸化皮膜を形
成させた。
<Example 3> After degreasing an aluminum plate (0.3 times thick) with a purity of 99.0% using toluene, only the lower half of the plate was placed in a bath of 50 g/l ammonium tartrate aqueous solution at a bath temperature of 25°C and a bath voltage of 50 V. Direct current anodic oxidation treatment was performed for 2 minutes to form a barrier type oxide film.

次に、板金体を硫酸ニッケル(NiSO4・6H,0)
250g/11クエン酸70g/l、 pH2,5の浴
温50℃の浴にて浴電圧7vで50Hzの交流を用い、
15分間交流電解処理を行なったところ、板の上半分だ
けが着色された。
Next, the sheet metal body was made of nickel sulfate (NiSO4.6H,0).
250g/11 citric acid 70g/l, pH 2.5, bath temperature 50°C, bath voltage 7v, using 50Hz alternating current,
When AC electrolytic treatment was performed for 15 minutes, only the upper half of the board was colored.

続いて、はうふつ化ニッケル300g/j?、はう酸3
0g/lの浴に板の全面を浸漬し、浴温50℃、電流密
度10A/dm2にて25分間直流陰極電解を行ない、
水洗後、沸騰水中に浸漬し板の下半分の封孔処理を行な
った。
Next, 300g/j of sulfurized nickel? , hydric acid 3
The entire surface of the plate was immersed in a 0 g/l bath, and DC cathode electrolysis was performed for 25 minutes at a bath temperature of 50°C and a current density of 10 A/dm2.
After washing, the bottom half of the board was sealed by immersing it in boiling water.

これらの処理によって板の上半分にニッケルめっき層が
、板の下半分に酸化皮膜の絶縁層が形成された部分めっ
き材が得られた。
Through these treatments, a partially plated material was obtained in which a nickel plating layer was formed on the upper half of the plate and an insulating layer of oxide film was formed on the lower half of the plate.

又ユ皇皿玉 本発明はpH2,0〜3.5の酸性ニッケル塩浴中で交
流電解処理を行なうことによりボアー中に金属ニッケル
が析出している薄膜の酸化皮膜から成る下地皮膜を一段
で形成し得るものであって、しかもアルミニウムの溶出
量も極めて少ない状態で達成できる。これにより従来、
困難であった箔地材への電気めっきも、本発明を利用し
て行なうことができる。
In addition, the present invention is capable of forming a base film consisting of a thin oxide film in which metallic nickel is precipitated in the bore in one step by performing AC electrolytic treatment in an acidic nickel salt bath with a pH of 2.0 to 3.5. This can be achieved with extremely small amounts of aluminum being eluted. As a result, conventionally,
Electroplating on foil base materials, which has been difficult, can also be performed using the present invention.

また交流電解に続いて、所望のめっき皮膜に応じた金属
塩を含有する電気めっき浴中で電気めっき処理を一回ま
たは複数回繰返して行なうが、ボアー中に入ったニッケ
ルと一体化しためっき層が形成されるため、例えば置換
法などの下地処理によるものと較べて密着性が優れてい
る。
Further, following AC electrolysis, electroplating is repeated once or multiple times in an electroplating bath containing metal salts depending on the desired plating film, but the plating layer is integrated with the nickel contained in the bore. is formed, so the adhesion is superior to that obtained by surface treatment such as the substitution method.

Claims (1)

【特許請求の範囲】[Claims] アルミニウム材を水溶性ニッケル塩とこれに共存して多
孔質酸化皮膜を形成する無機酸または/および有機酸を
含有し、pH値が2.0ないし3.5の水溶液中で交流
電解処理した後、電気めっき浴中で一段または複数段の
陰極電解を行なうことを特徴とするアルミニウム材への
電気めっき方法。
After aluminum material is subjected to AC electrolytic treatment in an aqueous solution containing a water-soluble nickel salt and an inorganic acid and/or an organic acid that coexists with this to form a porous oxide film and has a pH value of 2.0 to 3.5. , a method for electroplating aluminum materials, characterized by carrying out one or more stages of cathodic electrolysis in an electroplating bath.
JP7823386A 1986-04-07 1986-04-07 Method for electroplating aluminum material Pending JPS62238393A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7823386A JPS62238393A (en) 1986-04-07 1986-04-07 Method for electroplating aluminum material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7823386A JPS62238393A (en) 1986-04-07 1986-04-07 Method for electroplating aluminum material

Publications (1)

Publication Number Publication Date
JPS62238393A true JPS62238393A (en) 1987-10-19

Family

ID=13656322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7823386A Pending JPS62238393A (en) 1986-04-07 1986-04-07 Method for electroplating aluminum material

Country Status (1)

Country Link
JP (1) JPS62238393A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04297595A (en) * 1991-02-07 1992-10-21 Sumitomo Metal Ind Ltd Zinc-based electroplating method on aluminum strip
JPH0617289A (en) * 1992-07-03 1994-01-25 Sumitomo Metal Ind Ltd Electroplated aluminum plate with excellent adhesion and method for producing the same
EP0725166A1 (en) * 1995-02-02 1996-08-07 Aluminium Pechiney Process for plating a face of an aluminium or aluminium alloy workpiece

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5410333A (en) * 1977-05-11 1979-01-25 Bayer Ag Monoazo dyestuff being stable under dyeing condition
JPS5418969A (en) * 1978-06-02 1979-02-13 Seijirou Ikeda Dyeing aid
JPS5418970A (en) * 1977-07-14 1979-02-13 Toppan Printing Co Ltd Transfer printing method
JPS5438983A (en) * 1977-07-12 1979-03-24 Toray Monofilament Co Production of synthetic fiber monofilament net material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5410333A (en) * 1977-05-11 1979-01-25 Bayer Ag Monoazo dyestuff being stable under dyeing condition
JPS5438983A (en) * 1977-07-12 1979-03-24 Toray Monofilament Co Production of synthetic fiber monofilament net material
JPS5418970A (en) * 1977-07-14 1979-02-13 Toppan Printing Co Ltd Transfer printing method
JPS5418969A (en) * 1978-06-02 1979-02-13 Seijirou Ikeda Dyeing aid

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04297595A (en) * 1991-02-07 1992-10-21 Sumitomo Metal Ind Ltd Zinc-based electroplating method on aluminum strip
JPH0617289A (en) * 1992-07-03 1994-01-25 Sumitomo Metal Ind Ltd Electroplated aluminum plate with excellent adhesion and method for producing the same
EP0725166A1 (en) * 1995-02-02 1996-08-07 Aluminium Pechiney Process for plating a face of an aluminium or aluminium alloy workpiece
FR2730245A1 (en) * 1995-02-02 1996-08-09 Pechiney Aluminium PROCESS FOR COATING PARTS OF MOTOR VEHICLES IN ALUMINUM OR ALUMINUM ALLOY
US5643434A (en) * 1995-02-02 1997-07-01 Aluminum Pechiney Process for coating the face of a part made of aluminum or aluminum alloy

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