JPS62230513A - Transfer feeder - Google Patents
Transfer feederInfo
- Publication number
- JPS62230513A JPS62230513A JP7019586A JP7019586A JPS62230513A JP S62230513 A JPS62230513 A JP S62230513A JP 7019586 A JP7019586 A JP 7019586A JP 7019586 A JP7019586 A JP 7019586A JP S62230513 A JPS62230513 A JP S62230513A
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- necessity
- constitution
- rotary
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000428 dust Substances 0.000 abstract description 4
- 239000010409 thin film Substances 0.000 abstract description 3
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 230000002265 prevention Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 20
- 238000004140 cleaning Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Rollers For Roller Conveyors For Transfer (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
この発明は、′FI膜形成やエツチング等を行なう真空
処理室内の移送装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a transfer device within a vacuum processing chamber for forming an FI film, etching, and the like.
(従来の技術)
ウェハーの表面に薄膜形成やエツチング等を行なう真空
処理袋2tlは、第5図に示すように、ロードロック室
2、バッファ室3、クリーニング室4および真空処理室
5を連続して設けるのが一般的である。(Prior art) A vacuum processing bag 2TL that performs thin film formation, etching, etc. on the surface of a wafer has a load lock chamber 2, a buffer chamber 3, a cleaning chamber 4, and a vacuum processing chamber 5 connected in series, as shown in FIG. It is common to provide a
前記ロードロック室2にはゲートバルブ7を設け、オー
トローダ15からウェハーを搬入できるようにしている
。またL記の各室2〜5は、ゲートバルブ8〜10を介
して相互に連通するとともに。A gate valve 7 is provided in the load lock chamber 2 so that wafers can be loaded from the autoloader 15. Further, each of the chambers 2 to 5 shown in L communicate with each other via gate valves 8 to 10.
独立して排気が行なえるようにし、さらにロードロック
室2およびバッファ室3にはウェハーAを載1するカセ
ット11〜13を設けている。In addition, the load lock chamber 2 and buffer chamber 3 are provided with cassettes 11 to 13 on which wafers A are placed.
前記クリーニング室4には、ウェハーAをスパッタクリ
ーニングするエツチングステージ4aと、真空処理され
たウェハーBを冷却する冷却ステージ4bとを設けてい
る。The cleaning chamber 4 is provided with an etching stage 4a for sputter cleaning the wafer A and a cooling stage 4b for cooling the wafer B that has been subjected to vacuum processing.
前記真空処理室5には、水平に移送されてきたウェハー
を垂直状態にして回転移送する回転移送fi5aを設け
、さらに垂直状態に移送されるウェハーAを加熱する加
熱器5bと、スパッタ原子を放出して加熱されたウェハ
ーAを膜材処理するマグネトロンカソード5cとを夕け
ている・前記オートローダ15のカセット17からロー
ドロック室2→バツフア室3→クリーニング室4→真空
処理室5あるいは真空処理室5から上記と逆方向にウェ
ハーAを、順次移送するために移送装置18.19を設
けている。The vacuum processing chamber 5 is provided with a rotary transfer fi5a that rotates and transfers a wafer that has been transferred horizontally to a vertical state, and a heater 5b that heats the wafer A that is transferred to a vertical state, and a heater 5b that emits sputtered atoms. The magnetron cathode 5c that processes the heated wafer A as a film material is connected to the magnetron cathode 5c from the cassette 17 of the autoloader 15 to the load lock chamber 2 → buffer chamber 3 → cleaning chamber 4 → vacuum processing chamber 5 or vacuum processing chamber. Transfer devices 18 and 19 are provided to sequentially transfer the wafers A from 5 to the above direction.
上記移送装置19は、第6図に示すように、駆動シャフ
ト21および従動シャフト22の両端に、駆動プーリ2
3および従動プーリ24を取付け、そのプーリ23.2
4に移送ベルト25を巻回し、この移送ベルト25の移
動によってウェハーAを移送している。As shown in FIG.
3 and the driven pulley 24, and the pulley 23.2
A transfer belt 25 is wound around the wafer A, and the wafer A is transferred by the movement of the transfer belt 25.
前記駆動シャフト21は、連結器31を介して回転導入
機32(第7図参照)の入力軸33に接続しているが、
各室における当該回転導入@32の位置関係は、第5図
に示すとおりである。The drive shaft 21 is connected to an input shaft 33 of a rotation introducing machine 32 (see FIG. 7) via a coupler 31.
The positional relationship of the rotation introduction @32 in each chamber is as shown in FIG.
また、各室における回転導入@32は、第7図に示すよ
うに、入力軸33と一体回転している回転子34と、駆
動回転体35とがシール部材3Bを介して磁気結合され
ており、駆動回転体35が回転すると、磁気結合した回
転子34が回転して入力軸33を回転させる。そして、
前記駆動回転体35に図示しないモータを接続している
。Further, the rotation introduction @32 in each chamber is such that, as shown in FIG. 7, a rotor 34 that rotates integrally with the input shaft 33 and a drive rotary body 35 are magnetically coupled via a seal member 3B. When the drive rotor 35 rotates, the magnetically coupled rotor 34 rotates, causing the input shaft 33 to rotate. and,
A motor (not shown) is connected to the drive rotary body 35.
したがって、モータの駆動力が駆動回転体35および回
転子34を介して入力軸33に伝達し、駆動シャフト2
1を回転させる。Therefore, the driving force of the motor is transmitted to the input shaft 33 via the drive rotating body 35 and the rotor 34, and the drive shaft 2
Rotate 1.
(本発明が解決しようとする問題点)
このようにした従来の移送装置は、プーリ23.24に
巻回した移送ベルト25を回転移動させてウェハーを移
送しているので、移送ベルト25とプーリ23.24と
の摩擦によって塵埃が発生し、真空処理に悪影響を及ぼ
すという問題があった。(Problems to be Solved by the Present Invention) In the conventional transfer device as described above, the wafer is transferred by rotating the transfer belt 25 wound around the pulleys 23 and 24. There was a problem in that dust was generated due to friction with 23 and 24, which adversely affected vacuum processing.
また、駆動シャフト21を円滑に駆動するには、この駆
動シャフト21と、回転導入a32の入力軸33とが同
一軸線上に軸合せしであるのが望ましい。In order to drive the drive shaft 21 smoothly, it is desirable that the drive shaft 21 and the input shaft 33 of the rotation introduction a32 are aligned on the same axis.
しかし、各室2〜5に取付けた回転導入機32は、室の
壁に設けた孔41(第7図参照)に取付けるので、その
取付は位置は孔41の位置によって決定される。このた
め、回転導入機32の取付は位置の目出度がなく、駆動
シャフト21と入力軸33とを軸合せするのが困難であ
った。しかも、通常は各室2〜5に複数の回転導入機3
2を設けるので、各回転導入機ごとに、軸合せしなけれ
ばならないという問題があった。However, since the rotation introduction device 32 attached to each chamber 2 to 5 is attached to a hole 41 (see FIG. 7) provided in the wall of the chamber, its attachment position is determined by the position of the hole 41. For this reason, the rotation introduction device 32 was not installed with precision in its position, and it was difficult to align the drive shaft 21 and the input shaft 33. Moreover, usually there are multiple rotation introduction machines 3 in each chamber 2 to 5.
2, there was a problem in that the axis had to be aligned for each rotation introduction machine.
この発明は、上記問題を解消した移送装置を提供するこ
とを目的とする。An object of the present invention is to provide a transfer device that solves the above problems.
(問題を解決するための手段)
この発明は、上記の目的を達成するために、真空処理装
着内でウェハー等の平板状の目的物を移送する移送装置
において、固定子を気密に封止した永久磁石回転子電動
モータの回転軸にローラを設けた複数個の移送ユニット
を、移送方向に所定の間隔を保って設けている。(Means for Solving the Problem) In order to achieve the above object, the present invention provides a transfer device for transferring a flat object such as a wafer within a vacuum processing equipment, in which a stator is hermetically sealed. A plurality of transfer units each having a roller provided on the rotating shaft of a permanent magnet rotor electric motor are provided at predetermined intervals in the transfer direction.
(本発明の作用)
回転軸が電動モータによって回転し、回転軸の回転とと
もにローラが回転して、ウェハー等を移送する。(Operation of the present invention) A rotating shaft is rotated by an electric motor, and as the rotating shaft rotates, a roller rotates to transfer a wafer or the like.
(本発明の効果)
この発明の移送装置によれば、移送ベルトを使用してい
ないので、4従来のように、移送ベルトとプーリとの摩
擦で塵埃が発生するということがない。また、回転軸を
回転させるのに回転導入機を使用していないから、従来
のようにやっかいな軸合せを行なう必要がない。(Effects of the Invention) According to the transfer device of the present invention, since a transfer belt is not used, there is no possibility that dust is generated due to friction between the transfer belt and the pulley as in the conventional device. Furthermore, since no rotation introducing machine is used to rotate the rotary shaft, there is no need for troublesome axis alignment as in the conventional method.
また回転軸を電動モータで直接回転させるので、ギヤ等
の伝達機構を必要せず、それだけ回転軸の回転機構が筒
単になる。Furthermore, since the rotating shaft is directly rotated by the electric motor, there is no need for a transmission mechanism such as a gear, and the rotating mechanism for the rotating shaft becomes simply cylindrical.
固定子を密封したので、真空処理室における薄膜形成等
の際、この固定子から放出されるガスの影響をなくすこ
とができる。Since the stator is sealed, it is possible to eliminate the influence of gas emitted from the stator during thin film formation in a vacuum processing chamber.
(本発明の実施例)
第1図は移送装置60を示すもので、複数の移送ユニッ
)81で構成している。(Embodiment of the present invention) FIG. 1 shows a transfer device 60, which is composed of a plurality of transfer units 81.
この移送ユニット61は、基台83に設けた保持部材8
2にケースCを固定してい構成しているが、このケース
Cは、第2〜4図に示すように、上記保持部材82に固
定した外筒70と、この外筒70に内装した中筒62と
からなる。This transfer unit 61 includes a holding member 8 provided on a base 83.
As shown in FIGS. 2 to 4, this case C includes an outer cylinder 70 fixed to the holding member 82, and an inner cylinder installed inside the outer cylinder 70. It consists of 62.
上記中筒62の両端には大径部82aを形成し、この大
径部82aを外筒の内周に密着させ、これら中筒62に
は非磁性体からなる回転軸63を、中筒62の軸線に沿
って貫通させるとともに、上記大径部62aに設けた軸
受64で、この回転軸63を支持している。Large diameter portions 82a are formed at both ends of the middle tube 62, and the large diameter portions 82a are brought into close contact with the inner periphery of the outer tube. The rotary shaft 63 is supported by a bearing 64 provided on the large diameter portion 62a.
上記回転軸83には、断面扇状の一対の棒磁石85.8
6(第3図参照)を、その軸に平行に、かつ軸に対して
対称に固定するとともに、この棒磁石85.86の磁極
を図示のようにし、前記棒磁石65.6Gの間には、非
磁性体のスペーサ67、θ8を固定している。上記棒磁
石65.6Bは強い磁束密度を得るためには希土類の磁
石で構成するとよい。A pair of bar magnets 85.8 having a fan-shaped cross section are attached to the rotating shaft 83.
6 (see Fig. 3) is fixed parallel to its axis and symmetrically with respect to the axis, and the magnetic poles of the bar magnets 85.86 are as shown in the figure, and there is a gap between the bar magnets 65.6G. , a non-magnetic spacer 67, and θ8 are fixed. The bar magnet 65.6B is preferably composed of a rare earth magnet in order to obtain a strong magnetic flux density.
上記空間部71には3つの電磁コイル73〜75を配設
しているが、この電磁コイル73〜75は外筒70に設
けたターミナル端子77〜7Bに接続し、外部の電源に
接続するようにしている。そしてこの電磁コイル73〜
75がステータを構成し、上記磁石85. ELSがロ
ータを構成し、そのステータおよびロータととで回転軸
B3を直接回転、させる電動モータを構成している。Three electromagnetic coils 73 to 75 are arranged in the space 71, and these electromagnetic coils 73 to 75 are connected to terminal terminals 77 to 7B provided on the outer cylinder 70, and are connected to an external power source. I have to. And this electromagnetic coil 73~
75 constitutes a stator, and the magnets 85. The ELS constitutes a rotor, and the stator and rotor constitute an electric motor that directly rotates the rotating shaft B3.
そして、上記中筒82と電磁コイル73〜75とkよっ
て、当該電動モータの固定子を構成している。The middle cylinder 82 and the electromagnetic coils 73 to 75 constitute a stator of the electric motor.
なお、軸受84は中筒B2の大径部62aの内周面に装
着したリテイニングリング72によって固定されるとと
もに、このリテイニングリング72を取外すことによっ
て、回転軸63等をケースCから取外すことができるよ
うにしている。Note that the bearing 84 is fixed by a retaining ring 72 attached to the inner peripheral surface of the large diameter portion 62a of the middle cylinder B2, and by removing this retaining ring 72, the rotating shaft 63 etc. can be removed from the case C. We are making it possible to do so.
一方、前記回転軸63の両端に、回転軸63と一体回転
するローラ80を取付け、さらにこのローラ80の外周
にパイトン0リング81を嵌着し、ウェハーA(第1図
参照)との摩擦を大きくさせて、ウェハーAの直線的な
移送を容易にしている。On the other hand, rollers 80 that rotate integrally with the rotating shaft 63 are attached to both ends of the rotating shaft 63, and a Piton O-ring 81 is fitted around the outer circumference of the roller 80 to reduce friction with the wafer A (see FIG. 1). The wafer A is made larger to facilitate linear transfer of the wafer A.
しかして、この移送装置を用いてウェハー等の上板状の
目的物Aを移送するときには、移送ユニット61のロー
ラ80間に上記目的物Aを乗せるとともに、電動モータ
を駆動してローラ80を回転させる。ローラ80が回転
すると、このローラ80に乗せた上記目的物Aが矢印8
0方向に移動し、次に並ぶ移送ユニット61に順送りさ
れつつ目的の箇所まで移送される。When transferring a plate-shaped object A such as a wafer using this transfer device, the object A is placed between the rollers 80 of the transfer unit 61 and the rollers 80 are rotated by driving the electric motor. let When the roller 80 rotates, the object A placed on the roller 80 moves in the direction of the arrow 8.
It moves in the 0 direction and is transported to the target location while being sequentially fed to the next transport unit 61 in line.
なお、上記ローラ80の直径を約30層層に設定し、タ
ーミナル端子77〜79に、5サイクル/秒程度のパル
ス電圧を印加すると約30Or、p、mの回転が得られ
、上記目的物Aの移送速度を約150m■/Sにするこ
とができる。ただし、その目的に応じて移送速度を調整
してもよいことは当然である。If the diameter of the roller 80 is set to about 30 layers and a pulse voltage of about 5 cycles/second is applied to the terminals 77 to 79, rotation of about 30 Or, p, m is obtained, and the object A can be rotated by about 30 Or, p, m. The transfer speed can be approximately 150 m/s. However, it goes without saying that the transfer speed may be adjusted depending on the purpose.
また、目的物Aを上記移送方向と逆方向に移送するとき
には、上記パルス電圧の向きを逆にすればよい。Furthermore, when the object A is to be transferred in a direction opposite to the above-mentioned transfer direction, the direction of the above-mentioned pulse voltage may be reversed.
このように移送ベルトを使用しないで、ウェハーを移送
することができるので、従来のように、移送ベルトとプ
ーリとの間の摩擦で塵埃が発生してしまうということが
ない、また回転導入機を使用しないで1回転軸B3を電
動モータで直接回転させているので、従来のように軸合
せを行なう必要がない。In this way, the wafer can be transferred without using a transfer belt, so there is no dust generated due to friction between the transfer belt and the pulley as in the conventional method, and there is no need to use a rotating introduction machine. Since the one-rotation shaft B3 is directly rotated by the electric motor without being used, there is no need for alignment as in the conventional case.
移送袋7980を移送ユニット81で構成したので、回
転軸B3の回転不良等の際、移送ユニット自体を交換す
ればよいから、修理が簡単である。Since the transfer bag 7980 is constituted by the transfer unit 81, in the event of malfunction of rotation of the rotating shaft B3, the transfer unit itself can be replaced, so that repair is easy.
また回転軸63に棒磁石85.8Bを設けて、その回転
軸63を電磁コイルで直接回転させるので、ギヤ等の伝
達機構を必要とせず、回転軸83の回転機構が簡単にな
る。Further, since the bar magnet 85.8B is provided on the rotating shaft 63 and the rotating shaft 63 is directly rotated by the electromagnetic coil, a transmission mechanism such as a gear is not required, and the rotating mechanism of the rotating shaft 83 is simplified.
密封した空間BB71に電磁コイル73〜75を設置し
たので、真空処理室5におけるVj膜形成の際、電磁コ
イル73〜75から放出されるガスの影響をなくすこと
ができる。Since the electromagnetic coils 73 to 75 are installed in the sealed space BB71, the influence of the gas emitted from the electromagnetic coils 73 to 75 can be eliminated when forming the Vj film in the vacuum processing chamber 5.
なお、上記実施例の移送装置では、移送ユニット81の
全てに電動モータを備えているが、ウェハーの大きさや
、移送ユニー/ )の配置によっては、例えば一つおき
に電動モータを備え、他はアイドラーにしてもよい。In the transfer apparatus of the above embodiment, all of the transfer units 81 are equipped with electric motors, but depending on the size of the wafer and the arrangement of the transfer units, for example, every other unit is equipped with an electric motor, and the others are It can also be an idler.
またこの実施例では、スパッタ装置の移送装置について
説明しているが、これに限らすCVD装置やドライエツ
チング装置、あるいはオートローダ等に利用できること
は勿論である。Although this embodiment describes a transfer device for a sputtering device, it is of course applicable to other applications such as a CVD device, a dry etching device, an autoloader, and the like.
前記電動モータは2つの磁石と3つの電磁コイルで構成
しているが、これら磁極数に限定されるものではない、
さらに、ローターは電動モータの一側だけに複数個設け
るのでもよい。Although the electric motor is composed of two magnets and three electromagnetic coils, the number of magnetic poles is not limited to these.
Furthermore, a plurality of rotors may be provided only on one side of the electric motor.
第1図は実施例の移送装置の斜視図、第2図は実施例の
移送ユニットの断面図、第3図は第2図のニーN線に沿
った断面図、第4図は中筒に電磁コイルを装着した斜視
図、第5図は真空処理装はの概略説明図、第6図は従来
の移送装置の説明図、第7図は回転導入機の説明図であ
る。
1・・・真空処理装置、2・・・ロードロック室、5・
・・真空処理室、60・・・移送装置、61・・・移送
ユニット。Fig. 1 is a perspective view of the transfer device of the embodiment, Fig. 2 is a sectional view of the transfer unit of the embodiment, Fig. 3 is a sectional view taken along the knee N line of Fig. 2, and Fig. 4 is a cross-sectional view of the transfer unit of the embodiment. FIG. 5 is a schematic illustration of a vacuum processing system, FIG. 6 is an illustration of a conventional transfer device, and FIG. 7 is an illustration of a rotation introduction machine. 1... Vacuum processing equipment, 2... Load lock chamber, 5...
...Vacuum processing chamber, 60...Transfer device, 61...Transfer unit.
Claims (1)
る移送装置において、固定子を気密に封止した永久磁石
回転子電動モータの回転軸にローラを設けてなる複数個
の移送ユニットを、移送方向に所定の間隔を保って設け
たことを特徴とする移送装置。In a transfer device that transfers a flat object such as a wafer in a vacuum processing apparatus, a plurality of transfer units each having a roller provided on the rotating shaft of a permanent magnet rotor electric motor whose stator is hermetically sealed are used. A transfer device characterized in that the transfer device is provided at a predetermined interval in the transfer direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61070195A JPH0615365B2 (en) | 1986-03-28 | 1986-03-28 | Transfer device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61070195A JPH0615365B2 (en) | 1986-03-28 | 1986-03-28 | Transfer device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62230513A true JPS62230513A (en) | 1987-10-09 |
JPH0615365B2 JPH0615365B2 (en) | 1994-03-02 |
Family
ID=13424490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61070195A Expired - Lifetime JPH0615365B2 (en) | 1986-03-28 | 1986-03-28 | Transfer device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0615365B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01197213A (en) * | 1987-12-12 | 1989-08-08 | Oxytechnik G Fuer Systemtechnik Mbh | Method of supporting cylindrical shape steel |
JP2005335852A (en) * | 2004-05-25 | 2005-12-08 | Sanki Eng Co Ltd | Wheel conveyor |
JP2012023372A (en) * | 2010-07-12 | 2012-02-02 | Von Ardenne Anlagentechnik Gmbh | Substrate processing apparatus |
JP2012020881A (en) * | 2010-07-12 | 2012-02-02 | Von Ardenne Anlagentechnik Gmbh | Substrate treatment device |
KR101288132B1 (en) * | 2011-04-27 | 2013-07-19 | 주식회사 에스에프에이 | Chamber with transfering apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5712750U (en) * | 1980-06-24 | 1982-01-22 | ||
JPS60122615A (en) * | 1983-12-02 | 1985-07-01 | Toshiyuki Ishino | Roller for conveyer |
-
1986
- 1986-03-28 JP JP61070195A patent/JPH0615365B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5712750U (en) * | 1980-06-24 | 1982-01-22 | ||
JPS60122615A (en) * | 1983-12-02 | 1985-07-01 | Toshiyuki Ishino | Roller for conveyer |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01197213A (en) * | 1987-12-12 | 1989-08-08 | Oxytechnik G Fuer Systemtechnik Mbh | Method of supporting cylindrical shape steel |
JP2005335852A (en) * | 2004-05-25 | 2005-12-08 | Sanki Eng Co Ltd | Wheel conveyor |
JP4562424B2 (en) * | 2004-05-25 | 2010-10-13 | 三機工業株式会社 | Wheel conveyor |
JP2012023372A (en) * | 2010-07-12 | 2012-02-02 | Von Ardenne Anlagentechnik Gmbh | Substrate processing apparatus |
JP2012020881A (en) * | 2010-07-12 | 2012-02-02 | Von Ardenne Anlagentechnik Gmbh | Substrate treatment device |
US8757364B2 (en) | 2010-07-12 | 2014-06-24 | Von Ardenne Anlagentechnik Gmbh | Substrate treatment system |
US8851274B2 (en) | 2010-07-12 | 2014-10-07 | Von Ardenne Anlagentechnik Gmbh | Substrate treatment system |
KR101288132B1 (en) * | 2011-04-27 | 2013-07-19 | 주식회사 에스에프에이 | Chamber with transfering apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPH0615365B2 (en) | 1994-03-02 |
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