JPS6222529B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a probe card used for testing semiconductor wafers.

Conventional probe cards have an insulating substrate with a hole in the center for microscopic observation and probes are arranged radially surrounding the hole. It is necessary to adjust the position of each probe so that the tip of the probe matches the arrangement position of the terminals on the wafer while observing the terminals of the placed semiconductor wafer to be tested or the diagram depicting the arrangement position of the terminals. There is. Not only is this process becoming more and more time-consuming and complex, especially as the number of terminals on wafers increases, but probe cards manufactured in this way are also subject to slight handling problems. There are also disadvantages such as the position of the probe changing due to carelessness and requiring readjustment of the probe position, and also disadvantages such as the probe tip slipping when the wafer terminal is of a bump type.

The present invention eliminates the above-mentioned drawbacks and prevents the relative positional relationship between the contact pieces to the wafer terminals from shifting during a certain work process regardless of the number of terminals on the wafer or the complexity of the terminal arrangement pattern. ,
Moreover, it is an object of the present invention to provide a method for manufacturing a probe card in which the contacts do not slip even when the terminals are of a bump type.

For the above purpose, the present invention includes a step of forming a pattern of a wafer terminal and a lead portion connected thereto on an elastic insulator by a metal photoetching method, and an insulator having the pattern formed on the surface thereof. Fix the body onto the printed wiring board,
It consists of a process of making a predetermined electrical connection between the above pattern and printed wiring.

Embodiments of the present invention will be described below based on the drawings.

First, as shown in Figure 1, a 0.2 mm thick copper plate 1 is coated with a photoresist, such as Microresist 752 manufactured by Kodatsu, and the terminal patterns 3 of the semiconductor wafer to be tested are connected to the external circuit. After the circuit pattern consisting of the pattern 4 of the lead portion for the circuit is photoprinted so that that portion is exposed to light, it is developed using, for example, a Kodak Microresist Developer to remove unnecessary resist from portions other than the circuit pattern.

FIG. 2 shows the state of adhesion of the photoresist on the copper plate at this stage in a cross section taken along line L in FIG. Next, from the back side of copper plate 1,
As shown in FIG. 3, a rubber with a thickness of 2 mm and a rubber with a thickness of 1
After pasting the plastic reinforcing plate 6 of mm in diameter, etching is applied to the copper plate 1 (Fig. 4), and further,
When the photoresist remaining on the copper surface is removed using a microresist removal solution manufactured by Kodak, a copper terminal pattern is formed on the surface of the elastic plate 5, as shown in FIG. A perspective view of this from diagonally above is shown in FIG. In Fig. 6, the circuit pattern is formed by etching the copper plate 1, but the symbol 1 is not used here, and symbols are used for each part of the circuit pattern corresponding to the terminal pattern and lead pattern in Fig. 1. 3 (terminal) and symbol 4 (lead) are used. As shown in FIG. 7, this is adhesively fixed onto a printed wiring board 7 prepared in advance, and electrical connections are made between each lead part 4 and a predetermined wiring 8 of the printed wiring board 7. , a probe card is obtained by the manufacturing method of the present invention. FIG. 8 shows a cross section of the probe card 7 along line M in FIG.

As described above, according to the present invention, contact with the terminals of the wafer to be tested can be obtained through a constant photoetching process regardless of the number of terminals or the complexity of the arrangement pattern, and No deviation occurs. Furthermore, since the contactor is backed and held by an elastic plate, its elasticity allows it to be pressed into contact with the wafer terminal, thereby preventing an increase in contact electrical resistance at the contact point. Furthermore, by using the probe card manufactured by the method based on the present invention, the two-dimensional positional relationship between the wafer and the probe card can be adjusted even when aligning the positions between the contacts and the wafer terminals during wafer testing. need only be determined once, and there is no need to monitor and adjust the contact between the probe and wafer terminal for each probe using a microscope, as is the case with conventional probe cards.

[Brief explanation of the drawing]

FIG. 1 shows the pattern to be photoetched in an embodiment of the invention. FIGS. 2 and 3 are diagrams for explaining the preparation process for performing photoetching. FIG. 4 is a cross-sectional view of a pattern formed on an elastic plate by photoetching. Figures 5 and 6 show that the residual photoresist has been removed;
FIG. 3 is a cross-sectional view and a perspective view, respectively, of a copper pattern formed on an elastic plate. FIGS. 7 and 8 are a plan view and a sectional view, respectively, of a probe card manufactured according to this example. DESCRIPTION OF SYMBOLS 1...Copper plate, 2...Photoresist, 3...Terminal pattern, 4...Lead pattern, 5...Elastic plate, 6...Reinforcement plate, 7...Printed wiring board, 8...Printed wiring.

Claims (1)

[Claims] 1. Apply photoresist to one side of a metal plate, photoprint a circuit pattern consisting of terminal patterns of the semiconductor wafer to be tested and patterns connected to these terminal patterns to form lead parts on the photoresist, and then print the circuit pattern on the photoresist. Remove the photoresist from other parts of the metal plate,
After attaching an elastic insulating plate to the side on which the photoresist is not applied, etching is applied to the metal plate from the side having the circuit pattern to place the metal part showing the circuit pattern on the insulating plate. After forming the remaining photoresist, removing the photoresist remaining on the surface of the metal part, fixing the insulating plate on the printed wiring board, and electrically connecting the lead part of the circuit pattern to the predetermined wiring of the printed wiring board. A method for manufacturing a probe card, the method comprising: forming a probe card by forming a probe card.