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JPS62219949A - Soldering - Google Patents

Soldering

Info

Publication number
JPS62219949A
JPS62219949A JP61064461A JP6446186A JPS62219949A JP S62219949 A JPS62219949 A JP S62219949A JP 61064461 A JP61064461 A JP 61064461A JP 6446186 A JP6446186 A JP 6446186A JP S62219949 A JPS62219949 A JP S62219949A
Authority
JP
Japan
Prior art keywords
jig
heat sink
stem
substrate
brazing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61064461A
Other languages
Japanese (ja)
Inventor
Tetsuo Hino
哲男 日野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP61064461A priority Critical patent/JPS62219949A/en
Publication of JPS62219949A publication Critical patent/JPS62219949A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To solder a heat sink at a predetermined position on a substrate stably and with high accuracy by a method wherein the heat sink is held between 1st and 2nd jigs and soldered in that state and the 1st jig has the high dimensional accuracy. CONSTITUTION:As 1st jig 24 is abutted on a recessed part 29 to keep a certain relative position to a stem substrate 21, a heat sink 22 which is held between the 1st jig 24 and 2nd jig 25 is kept at a predetermined position defined by the front surface (a) of the 1st jig 24 and soldered to the stem substrate 21 in that state. Therefore, if the 1st jig 24 has the high dimensional accuracy, the heat sink 22 is always soldered to the predetermined position on the stem substrate 21 stably and with high accuracy without discrepancy or inclination even if the dimensional accuracies of other jigs 25-28 are inferior a little.

Description

【発明の詳細な説明】 産業上皇■且分立 本発明はレーザ用ステム〔気密端子〕などの製造に利用
されるロウ付け方法に関し、特に金属の基板上に角形の
ヒートシンクを高精度に位置決めしてロウ付けする方法
に関する。
[Detailed Description of the Invention] The present invention relates to a brazing method used in the manufacture of laser stems (hermetic terminals), etc., and particularly relates to a method for positioning a rectangular heat sink with high precision on a metal substrate. Concerning how to braze.

従来立1丘 レーザディスク等にレーザ光を照射するレーザ光源に使
用されるレーザ用ステムは、リード線がガラス封止され
たステム基板上に、レーザ素子マウント用ヒートシンク
をロウ付けして構成される。このレーザ用ステムに対し
、ヒートシンクの垂直壁面にレーザ素子〔ダイオード〕
が固定され、レーザ素子とリード線が電気的接続されて
から、ステム基板の周縁部上にレンズ付キャップが固定
されて、レーザ光源が形成さる。このレーザ光源はレー
ザディスクの情報書き込みなどに利用されるもので、照
射するレーザ光の軸ずれの許容度は極めて小さくて、レ
ーザ素子を固定するヒートシンクのステム基板上での位
置精度はミクロン単位の高度なものが要求されている。
Conventionally, a laser stem used for a laser light source that irradiates laser light onto a laser disk, etc. is constructed by brazing a heat sink for mounting a laser element onto a stem substrate whose lead wires are sealed in glass. . For this laser stem, a laser element [diode] is attached to the vertical wall of the heat sink.
is fixed, the laser element and the lead wire are electrically connected, and then a cap with a lens is fixed on the peripheral edge of the stem substrate to form a laser light source. This laser light source is used for writing information on laser disks, etc., and the tolerance for axis deviation of the emitted laser beam is extremely small, and the positional accuracy of the heat sink that fixes the laser element on the stem board is on the order of microns. High quality is required.

そこで、上記要求を満たすために、ステム基板上にヒー
トシンク位置決め手段を形成することや、ステム基板上
にヒートシンクをロウ付けする際に使用される治具を工
夫する様々な試みがなされている。この試みの具体的−
例をレーザ用ステムの構造例と共に、第4図乃至第7図
を参照して説明する〔特開昭59−172256号公輻
参照〕。
Therefore, in order to meet the above requirements, various attempts have been made to form heat sink positioning means on the stem substrate and to devise jigs used when brazing the heat sink onto the stem substrate. Specifics of this attempt
An example will be described with reference to FIGS. 4 to 7, together with an example of the structure of a laser stem (see Japanese Patent Application Laid-open No. 172256/1983).

第4図及び第5図のレーザ用ステム(1)において、(
2)はコバール(Fe−Ni −Co合合金中Fe−N
i合金などの円形のステム基板、(3)(3)はステム
基板(2)の2箇所に形成されたり−ド封止孔(4)(
4)に挿通されてガラス(5)(5)にて封止されたリ
ード線、(6)はステム基板(2)の下面に端面溶接さ
れたアース用リード線、(7)はステム基板(,1)上
の定位置にロウ材(8)にて固定された角柱状のfl!
iJのヒートシンクである。ヒートシンク(7)はステ
ム基板(2)上に直線状に形成された垂直段(9)に−
面を当接させることで、ステム基板(2)上に位置決め
されて、ロウ付けされる。
In the laser stem (1) in FIGS. 4 and 5, (
2) Kovar (Fe-N in Fe-Ni-Co alloy)
A circular stem substrate such as i-alloy (3) (3) is formed in two places on the stem substrate (2), and a sealing hole (4) (
(4) is the lead wire inserted into the glass (5) and sealed with glass (5), (6) is the grounding lead wire whose end face is welded to the bottom surface of the stem board (2), and (7) is the stem board ( , 1) A prismatic fl! fixed in position above with brazing material (8)!
This is an iJ heatsink. The heat sink (7) is attached to a vertical step (9) formed linearly on the stem substrate (2).
By bringing the surfaces into contact, it is positioned on the stem substrate (2) and brazed.

このステム(1)には、第5図の鎖線で示すように、ヒ
ートシンク(7)の前面側垂直壁面(ml)にレーザ素
子(lO)が固定され、ステム基板(2)上のレーザ素
子(10)の真下の部分に形成された傾斜面(11)に
モニタ用受光素子(12)が固定され、レーザ素子(1
0)と受光素子(12)をリード線(3)(3)に全屈
細線〔図示せず〕で接続してから、ステム基板(2)の
周縁部上にレンズ付キャップ(13)が固定される。レ
ーザ素子(10)に通電して発光させると、その光の一
部はキャップ(13)のレンズ(14)を透過して、レ
ーザ光として外部に放射され、またレーザ素子(10)
の光の一部は受光素子(12)で受光され、この受光素
子(12)の出力信号にてレーザ素子(10)の発光の
有無がモニタされる。
In this stem (1), a laser element (lO) is fixed to the front vertical wall surface (ml) of the heat sink (7), as shown by the chain line in FIG. A monitor light receiving element (12) is fixed to an inclined surface (11) formed directly below the laser element (10).
0) and the light receiving element (12) are connected to the lead wires (3) (3) with fully bent thin wires (not shown), and then the cap with lens (13) is fixed on the periphery of the stem board (2). be done. When the laser element (10) is energized to emit light, a portion of the light passes through the lens (14) of the cap (13) and is emitted to the outside as a laser beam.
A part of the light is received by a light receiving element (12), and the presence or absence of light emission from the laser element (10) is monitored based on the output signal of this light receiving element (12).

上記ステム基板(2)上でのヒートシンク(7)のロウ
付けは、第6図に示すような3つの治具(15)  (
16)  (17)を使って次のように行われる。但し
、(15)は下治具、(16)は上治具、(17)は睡
治具で、各々はロウ材が付着しないカーボン製治具であ
る。
The heat sink (7) is brazed on the stem board (2) using three jigs (15) (
16) Using (17), it is done as follows. However, (15) is a lower jig, (16) is an upper jig, and (17) is a lower jig, each of which is a carbon jig to which the brazing material does not adhere.

下治具(15)は上面にステム基板(2)が収納される
凹部(18)と、凹部(18)の底面にステム基板(2
)の下面より延びる3本のリード線(3)(3)(6)
が挿入されるリード挿通穴(19)  (19)・・・
を有する。上治具(16)はヒートシンク(7)が充分
に余裕をもって挿入されるガイド穴(20)を有する。
The lower jig (15) has a recess (18) in which the stem board (2) is stored on the upper surface and a stem board (2) in the bottom of the recess (18).
) Three lead wires (3) (3) (6) extending from the bottom of the
Lead insertion hole (19) (19)...
has. The upper jig (16) has a guide hole (20) into which the heat sink (7) is inserted with sufficient margin.

睡治具(17)は下面がテーパ面(n)の断面くさび状
のもので、ガイド穴(20)に上から挿入されて自重で
落下する。
The sleeping jig (17) has a wedge-shaped cross section with a tapered lower surface (n), and is inserted into the guide hole (20) from above and falls under its own weight.

下治具(15)の凹部(18)にステム基板(2)を収
納し、下治具(15)上に上治具(16)を、そのガイ
ド穴(20)がステム基板(2)上のヒートシンク固着
予定部分に対向するよう位置決めして被せる。次に、ガ
イド穴(20)からステム基板(2)のヒートシンク固
着予定部分にロウ材(8)を供給し、次にこのロウ材(
8)上にヒートシンク(7)を供給する。而る後、ガイ
ド穴(20)に錘治具(17)を、その下面のテーパ面
(n)がヒートシンク(7)の上端の前面側稜線に当る
ように挿入する。するとヒートシンク(7)は睡治具(
17)の重力でステム基板(2)上に押圧されると共に
、錘治具(17)の重力のテーパ面(fl)の角度で決
まる水平分力でステム基板(2)上の垂直段(9)へと
押され、垂直段(9)に当接した定位置に保持される。
The stem board (2) is stored in the recess (18) of the lower jig (15), and the upper jig (16) is placed on the lower jig (15) so that its guide hole (20) is on the stem board (2). Position and cover the area where the heat sink is to be fixed. Next, the brazing material (8) is supplied from the guide hole (20) to the portion of the stem board (2) where the heat sink is to be fixed, and then this brazing material (
8) Provide a heat sink (7) on top. After that, insert the weight jig (17) into the guide hole (20) so that the tapered surface (n) of the lower surface of the weight jig (17) touches the front ridgeline of the upper end of the heat sink (7). Then, the heat sink (7) becomes a sleeping jig (
The vertical stage (9) on the stem board (2) is pressed onto the stem board (2) by the gravity of ) and held in place against the vertical step (9).

この状態でロウ材(8)が加熱溶融されて、ヒートシン
ク(7)はステム基板(2)上にロウ付け固定される。
In this state, the brazing material (8) is heated and melted, and the heat sink (7) is brazed and fixed onto the stem substrate (2).

このような治具(15)〜(17)を使ったロウ付け方
法においては、ヒートシンク(7)やステム基板(2)
がロウ付け時の熱で膨張し、ロウ付け後の冷却時に収縮
する変形を生じても、この変形に応じて錘治具(17)
が上下変動して、錘治具(17)はその重力の水平分力
でもって、ヒートシンク(7)をステム基f!(2)上
の垂直段(9)に押し付け、位置決めし続けるので、ヒ
ートシンク(7)をステム基板(2)上に高精度にロウ
付けすることができる。
In the brazing method using such jigs (15) to (17), the heat sink (7) and the stem board (2)
Even if the weight jig (17) expands due to the heat during brazing and contracts when cooled after brazing, the weight jig (17)
moves up and down, and the weight jig (17) uses its horizontal component of gravity to move the heat sink (7) to the stem base f! (2) Since the heat sink (7) is pressed against the upper vertical stage (9) and continues to be positioned, the heat sink (7) can be brazed onto the stem substrate (2) with high precision.

口(°シ゛  る−占 ところで、ステム基板(2)上にヒートシンク位置決め
用垂直段(9)を設け、この垂直段(9)にヒートシン
ク(7)を錘治具(17)の重力の水平分力でもって常
時押圧させるには、ヒートシンク(7)の背面側垂直壁
面(m2)と上治具(6)のガイド穴(20)との間に
若干の隙間(g)を設けておく必要がある。そのため、
ヒートシンク(7)の上端の前面側稜線に錘治具(17
)のテーパ面(n)を押圧すると、上記隙間(g)の分
だけヒートシンク(7)は、第7図の鎖線で示すように
傾く可能性があり、実際、このように傾いたままヒート
シンク(7)がステム基板(2)上にロウ付け固定され
る不都合なことがあった。このようなヒートシンク(7
)の傾きによる位置ずれ量は微少であるが、ミクロン単
位の位置ネn度が要求されるレーザ用ステムにおいては
許容度を超えることが多(て、ヒートシンクロウ付けの
改善策が要望されている。
By the way, a vertical stage (9) for positioning the heat sink is provided on the stem board (2), and the heat sink (7) is placed on this vertical stage (9) by the horizontal component of the gravity of the weight jig (17). In order to press it constantly with force, it is necessary to provide a slight gap (g) between the back vertical wall surface (m2) of the heat sink (7) and the guide hole (20) of the upper jig (6). Yes. Therefore,
A weight jig (17
) When the tapered surface (n) of the heat sink (7) is pressed, there is a possibility that the heat sink (7) will be tilted by the gap (g) as shown by the chain line in FIG. 7) is inconveniently fixed onto the stem substrate (2) by brazing. A heat sink like this (7
Although the amount of positional deviation due to the inclination of the ( .

占  ° るtめの” 本発明は上記要望に応じるもので、基板上の定位置に、
垂直壁面を両側に有するヒートシンクをロウ付けする方
法であって、略水平に位置決め保持された前記基板上に
ロウ材を介して前記ヒートシンクを載置すると共に、こ
のヒートシンクの両側垂直壁面の一方を基板に対して定
位置に保持された第1の治具に対向させ、他の垂直壁面
を基板上に可動に配置された第2の治具に対向させ、こ
の第2の治具を別の錘治具の重力の水平分力でヒートシ
ンク側に押圧して、ヒートシンクを第1.の治具と第2
の治具で挾持させた状態で、前記ロウ材を加熱熔融させ
ることを特徴とするロウ付け方法を提供する。
The present invention satisfies the above-mentioned demand, and is based on a fixed position on a substrate.
A method of brazing a heat sink having vertical wall surfaces on both sides, in which the heat sink is placed on the substrate held in a substantially horizontal position via a brazing material, and one of the vertical wall surfaces on both sides of the heat sink is attached to the substrate. The other vertical wall face is opposed to a first jig held in a fixed position on the substrate, and the other vertical wall face is opposed to a second jig movably arranged on the substrate, and this second jig is connected to another weight. Press the jig against the heat sink using the horizontal component of gravity, and move the heat sink to the first position. jig and the second
The present invention provides a brazing method characterized in that the brazing material is heated and melted while being held between two jigs.

皿 本発明方法において、基板に対して位置決めされた第1
の治具にヒートシンクは、基板に対して可動な第2の治
具で押圧され、第1と第2の治具で挾持された状態で基
板上にロウ付けされるため、第1の治具に高い寸法精度
のものを使用スることで、ヒートシンクは基板上の定位
置に安定して、高精度にロウ付けされる。
In the method of the present invention, a first plate positioned with respect to a substrate is provided.
The heat sink is pressed onto the substrate by a second jig that is movable against the substrate, and is brazed onto the substrate while being held between the first and second jigs. By using a heat sink with high dimensional accuracy, the heat sink can be stably and accurately brazed in a fixed position on the board.

次呈孤 本発明方法を、第1図乃至第3図の具体的実施装置例を
参照して、以下説明する。
Next, the method of the present invention will be explained below with reference to the specific embodiment of the apparatus shown in FIGS. 1 to 3.

第1図及び第2図はレーザ用ステムのステム基板(21
)上の定位置に角形のヒートシンク(22)をロウ付け
する装置の部分平面図及びA−A線断面図を示し、同図
において、(23)は下治具、(24)及び(25)は
ヒートシンク位置決め用の第1の治具及び第2の治具、
(26)は第2の治具(25)に水平方向に荷重を加え
る第1の錘治具、(27)はステ五基扱位置決め用の第
3の治具、(28)は第3の治具(27)に水平方向に
荷重を加える第2の錘治具で、これら各治具(23)〜
(28)はカーボン治具である。
Figures 1 and 2 show the stem substrate (21) of the laser stem.
) shows a partial plan view and a cross-sectional view taken along the line A-A of a device for brazing a rectangular heat sink (22) in a fixed position on the top of the top (23), (24) and (25). are a first jig and a second jig for positioning the heat sink,
(26) is the first weight jig that applies a load in the horizontal direction to the second jig (25), (27) is the third jig for positioning the five-steer system, and (28) is the third jig. A second weight jig that applies a load in the horizontal direction to the jig (27), and each of these jigs (23) to
(28) is a carbon jig.

下治具(23)は、上面に、円形のステム基板(21)
が十分な余裕をもって収納される例えば矩形の凹部(2
9)を有し、この凹部(29)の底面にはステム基板(
21)を貫通してガラス封止された2本のリード! (
30)  (30)と、ステム基板(21)の下面に端
面溶接されたアース用リード線(31)が挿通されるリ
ード挿通穴(32)(32)・・・が形成される。
The lower jig (23) has a circular stem substrate (21) on its upper surface.
For example, a rectangular recess (2
9), and the bottom of this recess (29) has a stem substrate (
21) Two leads passed through and sealed with glass! (
30) (30) and lead insertion holes (32) (32)... are formed into which the grounding lead wire (31) whose end face is welded is inserted into the lower surface of the stem board (21).

第1の治具(24)は凹部(29)の一端部に挿入され
るもので、前面下部にステム基板(21)の周辺一部が
嵌まる段部(33)を有し、この第1の治具(24)の
前面(a)はステム基板(21)から垂直に立ち上る垂
直壁面として形成される。第2の治具(25)は断面が
直角三角形の三角柱で、直交する二面の一方がステム基
板(21)上に載置され、他の一面(b)が第1の治具
(24)の前面(a)に平行に対向させて設置される。
The first jig (24) is inserted into one end of the recess (29), and has a step (33) at the lower front surface into which a part of the periphery of the stem board (21) fits. The front surface (a) of the jig (24) is formed as a vertical wall surface rising vertically from the stem substrate (21). The second jig (25) is a triangular prism with a right triangle cross section, one of its two perpendicular surfaces is placed on the stem substrate (21), and the other surface (b) is placed on the first jig (24). is installed parallel to and facing the front surface (a) of the

この第2の治具(25)の下面にはステム基板(21)
上に突出するリード線(30)  (30)の逃げ溝(
34)  (34)が形成される。第1の錘治具(26
)は、第2の治具(25)のテーパ状背面(c)上に載
置されるテーパ面(d)を下方に向けて有する断面台形
のもので、テーパ面(d)と対向する背面(e)は垂直
壁面である。
A stem board (21) is provided on the bottom surface of this second jig (25).
Lead wire (30) protruding upward (30) relief groove (
34) (34) is formed. First weight jig (26
) has a trapezoidal cross section with the tapered surface (d) facing downward and is placed on the tapered back surface (c) of the second jig (25), and the back surface facing the tapered surface (d) is (e) is a vertical wall surface.

また、第3の治具(27)は凹部(29)に第1の治具
(24)と反対の一端部に挿入されるもので、その前面
(f)は垂直壁面で、前面(f)の下部にステム基板(
21)の周辺一部が嵌まる段部(35)を有し、背面(
h)はテーパ状に成しである。第2の錘治具(28)は
第3の治具(27)のテーパ状背面(h)と凹部(29
)の内壁面との間に挿入されるもので、第3の治具(2
7)のテーバ状背面(h)に接触するテーパ面(i)と
、凹部(29)の内壁面に接触する垂直な背面(j)を
有する。
Further, the third jig (27) is inserted into the recess (29) at one end opposite to the first jig (24), and its front surface (f) is a vertical wall surface. At the bottom of the stem board (
It has a step (35) into which a part of the periphery of the back (
h) has a tapered shape. The second weight jig (28) connects the tapered back surface (h) of the third jig (27) with the recess (29).
) is inserted between the inner wall surface of the third jig (2
It has a tapered surface (i) that contacts the tapered back surface (h) of 7) and a vertical back surface (j) that contacts the inner wall surface of the recess (29).

上記各治具(23)〜(28)を使って、ステム基板(
21)上の定位置に、次の要領でヒートシンク(22)
が精度良(ロウ付けされる。第3図に示すように、下治
具(23)の四部(29)に供給されたステム基板(2
1)上のヒートシンク固着予定部分にロウ材(36)と
ヒートシンク(22)を供給し、このステム基板(21
)の両端部に第1の治具(24)と第3の治具(27)
を嵌め込み、第3の治具〈27)とヒートシンク(22
)の間のステム基板(21)上に第2の治具(25)を
供給する。この状態で、例えば先ず第2の錘治臭(28
)のテーパ面H)を、第3の治具(27)のテーバ状背
面(h)に載置する。すると第2の錘治具(28)の重
力の水平分力で、第3の治具(27)が第3図の図面左
方向に押圧され、これによりステム基板(21)は第1
の治具(24)を凹部(29)の内壁面に押圧した定位
置に位置決め保持される。次に、第2の錘治具(26)
を第2の治具(25)と第3の治具(27)の間に挿入
する。すると第2の錘治具(26)の重力の水平分力で
、第2の治具(25)がヒートシンク(22)に向けて
押圧されて、ヒートシンク(22)を第1の治具(24
)に押し付ける。この状態が第2図に示すもので、この
時、ヒートシンク(22)は、その両側の垂直壁面(m
り(m2)が第1、第2の治具(24)  (25)の
対向する前面(a)(b)で挾持されているのでステム
基板(21)上で傾くことが無く、また、第1の治具(
24)が凹部(2つ)に当接してステム基板(21)に
対して定位置の関係にあるので、第1、第2の治具(2
4)  (25)で挾持されたヒートシンク(22)は
第1の治具(24)の前面(a)で決まる定位置に渫持
され、そのままステム基板(21)上にロウ付けされる
。従って、第1の治具(24)に寸法精度の良いものを
使用すれば、他の治具(25)〜(28)の寸法精度が
多少悪くても、ヒートシンク(22)はステム基板(2
1)上の定位置に、位置ずれや傾斜すること無く、常に
安定した高精度でロウ付けされる。
Using each of the above jigs (23) to (28), use the stem board (
21) Attach the heat sink (22) to the upper position in the following manner.
The stem board (2) supplied to the four parts (29) of the lower jig (23) is
1) Supply the brazing material (36) and the heat sink (22) to the area where the heat sink is to be fixed on the stem board (21).
) at both ends of the first jig (24) and third jig (27).
into the third jig (27) and the heat sink (22).
) A second jig (25) is supplied onto the stem substrate (21) between the two. In this state, for example, first the second weight smell (28
) is placed on the tapered back surface (h) of the third jig (27). Then, the horizontal component of the gravity of the second weight jig (28) pushes the third jig (27) to the left in the drawing of FIG.
The jig (24) is pressed against the inner wall surface of the recess (29) and held at a fixed position. Next, the second weight jig (26)
is inserted between the second jig (25) and the third jig (27). Then, the horizontal component of gravity of the second weight jig (26) presses the second jig (25) toward the heat sink (22), pushing the heat sink (22) towards the first jig (24).
). This state is shown in FIG. 2, and at this time, the heat sink (22)
Since the stem (m2) is held between the opposing front surfaces (a) and (b) of the first and second jigs (24) and (25), it does not tilt on the stem board (21), and the 1 jig (
24) are in contact with the recesses (two) and are in a fixed position relative to the stem board (21), so the first and second jigs (2
4) The heat sink (22) held by (25) is held at a fixed position determined by the front surface (a) of the first jig (24), and brazed onto the stem substrate (21) as it is. Therefore, if the first jig (24) is of good dimensional accuracy, even if the other jigs (25) to (28) have somewhat poor dimensional accuracy, the heat sink (22) can be attached to the stem board (2).
1) Brazing is always performed in a stable position with high accuracy without shifting or tilting.

尚、本発明はレーザ用ステムのステム基板上にヒートシ
ンクをロウ付けする方法に限らず、ヒートシンクがロウ
付けされる基板の形状に応じて、ヒートシンクを挾持す
る治具や、この治具に水平方向の荷重をかける錘治具の
形状は様々に変更され心る。
Note that the present invention is not limited to the method of brazing a heat sink onto the stem substrate of a laser stem, but is also applicable to a jig for holding the heat sink, or a horizontal direction The shape of the weight jig that applies the load has been changed in various ways.

発■夏洟果 本発明によれば、ロウ付け時の基板上のヒートシンクは
、多少の熱膨張や収縮を起しても、固定側第1の治具と
可動側第2の治具で挾持されて傾くこと無く、第1の治
具で正確に位置決めされた状態で基板にロウ付け固定さ
れるので、ヒートシンクロウ付けの位置精度が高度、且
つ安定し、ミクロン単位の精度が要求されるレーザ用ス
テム製造工程などに有効なロウ付け方法が提供できる。
According to the present invention, the heat sink on the board during brazing can be held between the first jig on the fixed side and the second jig on the movable side even if some thermal expansion or contraction occurs. Since the first jig is used to accurately position and braze the heat sink to the substrate without tilting, the positioning accuracy of the heat sink row is highly and stable, and the laser requires micron precision. It is possible to provide a brazing method that is effective for the stem manufacturing process.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明方法の具体的実施装置の一例を示す部分
平面図、第2図及び第3図は第1図のA−A線に沿う各
状態での断面図である。 第4図はレーザ用ステムの平面図、第5図は第4図のB
−B線に沿う断面図である。 第6図及び第7図は従来のロウ付け方法を説明するため
のもので、第6図はロウけけ装置の部分縦断面図、第7
図は第6図の一部拡大図である。 (21) −・基板、    (22) −・ヒートシ
ンク。 (24) −第1の治具、(25) −第2の治具、(
26> −−一−−錘治具。 第1図(平面図2 ! 2vl!(A−A4J’rli図)第3図 (A−
A47・のh*rlj/)*Lu)第4図 第6図 第5図 第7図
FIG. 1 is a partial plan view showing an example of a specific implementation apparatus for the method of the present invention, and FIGS. 2 and 3 are sectional views taken along the line A--A in FIG. 1 in various states. Figure 4 is a plan view of the laser stem, Figure 5 is B of Figure 4.
- It is a sectional view along the B line. 6 and 7 are for explaining the conventional brazing method, and FIG. 6 is a partial vertical sectional view of the brazing device, and FIG.
The figure is a partially enlarged view of FIG. 6. (21) -・Substrate, (22) −・Heat sink. (24) - first jig, (25) - second jig, (
26> --1-- Weight jig. Figure 1 (Plan view 2! 2vl! (A-A4J'rli diagram) Figure 3 (A-
A47・h*rlj/)*Lu)Figure 4Figure 6Figure 5Figure 7

Claims (1)

【特許請求の範囲】[Claims] (1)基板上の定位置に、垂直壁面を両側に有するヒー
トシンクをロウ付けする方法であって、略水平に位置決
め保持された前記基板上にロウ材を介して前記ヒートシ
ンクを載置すると共に、このヒートシンクの両側垂直壁
面の一方を基板に対して定位置に保持された第1の治具
に対向させ、他の垂直壁面を基板上に可動に配置された
第2の治具に対向させ、この第2の治具を別の錘治具の
重力の水平分力でヒートシンク側に押圧して、ヒートシ
ンクを第1の治具と第2の治具で挾持させた状態で、前
記ロウ材を加熱溶融させることを特徴とするロウ付け方
法。
(1) A method of brazing a heat sink having vertical wall surfaces on both sides at a fixed position on a substrate, the heat sink being placed on the substrate positioned and held substantially horizontally via a brazing material, and One of the vertical wall surfaces on both sides of the heat sink is opposed to a first jig held in a fixed position relative to the substrate, and the other vertical wall surface is opposed to a second jig movably arranged on the substrate, This second jig is pressed against the heat sink side by the horizontal component of gravity of another weight jig, and with the heat sink being sandwiched between the first jig and the second jig, the brazing material is A brazing method characterized by heating and melting.
JP61064461A 1986-03-22 1986-03-22 Soldering Pending JPS62219949A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61064461A JPS62219949A (en) 1986-03-22 1986-03-22 Soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61064461A JPS62219949A (en) 1986-03-22 1986-03-22 Soldering

Publications (1)

Publication Number Publication Date
JPS62219949A true JPS62219949A (en) 1987-09-28

Family

ID=13258895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61064461A Pending JPS62219949A (en) 1986-03-22 1986-03-22 Soldering

Country Status (1)

Country Link
JP (1) JPS62219949A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5477081A (en) * 1991-03-29 1995-12-19 Mitsubishi Denki Kabushiki Kaisha Semiconductor device package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5477081A (en) * 1991-03-29 1995-12-19 Mitsubishi Denki Kabushiki Kaisha Semiconductor device package

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