JPS62204513A - Manufacture of wound ceramic capacitor - Google Patents
Manufacture of wound ceramic capacitorInfo
- Publication number
- JPS62204513A JPS62204513A JP61047934A JP4793486A JPS62204513A JP S62204513 A JPS62204513 A JP S62204513A JP 61047934 A JP61047934 A JP 61047934A JP 4793486 A JP4793486 A JP 4793486A JP S62204513 A JPS62204513 A JP S62204513A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic capacitor
- wound
- margin
- winding
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
[発明の技術分野]
本発明は巻回形セラミックコンデンザの製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method of manufacturing a wound ceramic capacitor.
[発明の技術的背景とその問題点1
民生用、産業用機器の小形・軽量化および電子化が進み
、部品集積度の向上が要求されるなかで、チップ構造で
小形大容量化に応えた積層セラミックコンデンサの需要
の伸びは目覚ましく飛躍的な成長を続けている。従来積
層セラミックコンデンサの製造方法としては第6図に示
すように内部電極11を印刷した誘電体生シート12を
複数枚積層し、第7図に示すように構成したセラミック
積層体13を第8図に示すように下金型14と上金型1
5からなるヒータ入り金型プレス16などの熱圧着装置
により加熱圧着して一体成形し、第9図に示すようにセ
ラミック成形体17を形成した後、該ヒラミック成形体
17の点線に冶って1,71断ししかる後脱脂−焼成し
第10図に示ずように形成した単位体18両端面に外部
電極19を形成し積層セラミックコンデンザとしてなる
ものである。[Technical background of the invention and its problems 1 As consumer and industrial equipment becomes smaller, lighter, and more electronic, and there is a demand for improved component integration, we have responded to the need for smaller size and larger capacity with a chip structure. Demand for multilayer ceramic capacitors continues to grow rapidly. A conventional method for manufacturing a multilayer ceramic capacitor is to laminate a plurality of dielectric green sheets 12 on which internal electrodes 11 are printed as shown in FIG. 6, and to produce a ceramic laminate 13 constructed as shown in FIG. As shown in the figure, the lower mold 14 and the upper mold 1
9, the ceramic molded body 17 is formed as shown in FIG. After cutting 1,71 and degreasing and firing, external electrodes 19 are formed on both end faces of the unit body 18 formed as shown in FIG. 10 to form a multilayer ceramic capacitor.
しかしながら前記セラミック成形体17の形成手段は下
金型14と上金型15に挟み熱圧着1゛る方法であるた
め圧着時の圧力分布は均一とならず、前記セラミック成
形体17における圧力分布にバラツキが生じ易かった。However, since the ceramic molded body 17 is formed by thermocompression bonding between the lower mold 14 and the upper mold 15, the pressure distribution during compression is not uniform, and the pressure distribution in the ceramic molded body 17 is Variations were likely to occur.
圧力分布のバラツキは前記セラミック成形体17を切断
し形成したコンデンサ素子18を焼成する際の収縮率に
違いを生ずる。収縮率の違いは焼成中の素子の内部応力
のaいとなってソリや曲りなどの変形が生じデラミネー
ション(層間剥111[)の原因となり、加えて前記セ
ラミック積層体13を構成する誘電体シート12聞にト
ラップされた空気が逃げにクク、焼成時デラミネーショ
ンをさらに促進する結果となっていた。そしてデラミネ
ーションは歩留、?tHQ性、信頼性の低下を招く重大
欠点と言える。しかして上記欠点は誘電体生シート12
の積層枚数が多いほど顕著であり、上記製法に適用でき
るv4層枚数にもJ3のずと制限が加えられ、結果とし
てヒーター入り金型プレスマシン16ににつで得られる
積層セラミックコンデンサの最大容量を限定される状況
にあった。The variation in pressure distribution causes a difference in the shrinkage rate when the capacitor element 18 formed by cutting the ceramic molded body 17 is fired. The difference in shrinkage rate causes internal stress in the element during firing, causing deformation such as warpage and bending, causing delamination (layer delamination 111 [)]. The air trapped in the 12th hole was forced to escape, further promoting delamination during firing. And delamination is yield? This can be said to be a serious drawback that leads to a decrease in tHQ performance and reliability. However, the above drawback is that the dielectric raw sheet 12
This is more noticeable as the number of laminated layers increases, and J3 limits are naturally imposed on the number of V4 layers that can be applied to the above manufacturing method. was in a situation where it was limited.
また、上記構成によって1qられた積層セラミックコン
デソリ−は第11図で明らかなように三方に内部型J4
i11を形成せずコンデンサ容ωに寄与しない余白部2
0が存在する構造であり、この容量に寄与しない余白部
20の全体にしめる割合を考えるとき、小形化をはだす
うえで大きなネックとなっていた。Furthermore, as is clear from FIG. 11, the multilayer ceramic compactor made by 1q with the above structure has internal molds J4 on three sides.
Margin part 2 that does not form i11 and does not contribute to capacitor capacity ω
0 exists, and when considering the proportion of the blank space 20 that does not contribute to the capacity, it has become a major bottleneck in miniaturization.
[発明の目的]
本発明は上記の点に鑑みてなされたもので、特性良好に
して大幅な容量アップでかつ大幅に小形化できる新規な
構成を有する巻回形セラミックコンデンサの製造方法を
提供することを目的とするものである。[Object of the Invention] The present invention has been made in view of the above points, and provides a method for manufacturing a wound ceramic capacitor having a novel configuration that has good characteristics, significantly increases capacity, and can be significantly reduced in size. The purpose is to
[発明の概要]
本発明の巻回形セラミックコンデソリの製造方法は、幅
方向一端部を余白部とし内部電極を形成した帯状セラミ
ック誘電体生シート一対を余白部それぞれを反対側にし
て積層し剥離剤を塗布した巻芯に巻回し巻回体を形成す
る手段と、該巻回体を耐水性袋に入れ内部の空気を吸引
して真空包装し静水圧プレスマシンで加熱圧着する手段
と、該手段の後前記巻芯を除去し脱脂−焼成し、しかる
侵両端面に外部電極を形成する手段とを具備したことを
特徴とするものである。[Summary of the Invention] The method for manufacturing a rolled ceramic compact of the present invention involves laminating a pair of strip-shaped ceramic dielectric green sheets each having one end in the width direction as a margin and forming an internal electrode, with the margins facing opposite sides. A means for forming a wound body by winding it around a core coated with a release agent, a means for placing the wound body in a water-resistant bag, sucking out the air inside it, vacuum packaging it, and heat-pressing it with a hydrostatic press machine; After said means, said winding core is removed, degreased and fired, and external electrodes are formed on both correspondingly eroded end surfaces.
[発明の実施例]
以下本発明の一実施例につき詳述する。すなわち第1図
に示すようにPb、Ba、Ti、Fe。[Embodiment of the Invention] An embodiment of the present invention will be described in detail below. That is, as shown in FIG. 1, Pb, Ba, Ti, and Fe.
Nb、W、MO,Sr、Znなトカラなルヘロフスカイ
ト型結晶構造を有する強W1体材料を用い、バインダー
としてアクリル系樹脂、ポリビニルブチラル系樹脂など
の熱可塑性樹脂を使用し、押出法またはドクターブレー
ド法などで成形し幅方向一端部を余白部1としAに1−
Pd、Pd、Pt。A strong W1-body material with a strong luherovskite crystal structure such as Nb, W, MO, Sr, and Zn is used, and a thermoplastic resin such as acrylic resin or polyvinyl butyral resin is used as a binder, and extrusion method or doctor blade is used. Form it by a method etc., and make one end in the width direction the margin part 1, and make it 1- to A.
Pd, Pd, Pt.
Au、Niなどからなる電極ペーストを印刷塗布するか
または前記電極材を蒸着し内部電極2を形成した帯状セ
ラミック誘電体シート3一対を用い、前記余白部1それ
ぞれを反対側にして前記誘電体シート3一対を積層し、
表面にワックス、シリコンなどの剥離剤を塗布した巻芯
4を用い必要数巻回し巻回体5を形成する。つぎに第2
図に示すように該巻回体5をゴム、樹脂などからなる耐
水性袋6に収納し、該耐水性袋6内部の空気を吸引し真
空包装した後温度40〜80℃、圧力100〜1000
/(グ/ crj 、時間5〜12.0分に設定した静
水圧プレスマシン7を用い加熱圧着する。つぎに前記耐
水性袋6から取り出した巻回体5から巻芯4を抜取り、
脱脂工程にてバインダーをとばし950〜1150℃に
て焼成を行い、しかる後第3図に示すように巻回体5両
端部にAQからなる電極ペーストを塗布し外部電極8を
形成し巻回形セラミックコンデンサを得るようにしてな
るものである。第1図中9は巻き終り余白部である。Using a pair of strip-shaped ceramic dielectric sheets 3 on which internal electrodes 2 are formed by printing and applying an electrode paste made of Au, Ni, etc. or by vapor-depositing the electrode material, the dielectric sheets are prepared with the blank portions 1 on opposite sides. 3 pairs are stacked,
Using a winding core 4 whose surface is coated with a release agent such as wax or silicone, the core 4 is wound a necessary number of times to form a winding body 5. Then the second
As shown in the figure, the rolled body 5 is housed in a water-resistant bag 6 made of rubber, resin, etc., and the air inside the water-resistant bag 6 is sucked and packaged under vacuum.
/(g/crj) and heat and press using a hydrostatic press machine 7 set at a time of 5 to 12.0 minutes.Next, the core 4 is extracted from the rolled body 5 taken out from the water-resistant bag 6,
In the degreasing process, the binder is blown off and firing is performed at 950 to 1150°C, and then, as shown in FIG. This is how a ceramic capacitor is obtained. 9 in FIG. 1 is a margin at the end of the winding.
以上のように構成してなる巻回形セラミックコンデンサ
の製造方法によれば、静水圧プレスマシン7を用いた加
熱圧着であるため巻回体5の全周囲に均一な矢印方向の
圧力分布となり、従来方法の金型プレスを用いたものの
ようにデラミネーションの原因は排除でき歩留の向上は
もとより特性劣化のないすぐれた効果を有する。また静
水圧プレスマシン7を用いた加熱圧着であるため金型プ
レスを用いる加熱圧着では不可能であった巻回型セラミ
ックコンデンザを容易に19ることができ、よって容量
に寄与しない余白部1を帯状Lラミック誘電体シート3
の幅方向一端部に設けるのみであるため、内部電極2の
三方に容量に寄与しない余白部を必要とする第10図に
示ず従来構造としての積層セラミックコンデンサと比較
して同一容量で比較した場合大幅に小形化できる。さら
に静水圧プレスマシン7を用いた加熱圧着で金型プレス
によるものと比較し巻回体5の全周囲に均一な圧力分布
となるため巻回数を増したとしても圧力分布が均一であ
り、金型プレスによって得られるgi層セラミックコン
デン1ノの限度を越えた大官埴のセラミックコンデンサ
を得ることができるなど多くの利点を有する。According to the method for manufacturing the wound ceramic capacitor configured as described above, since the hot press bonding is performed using the hydrostatic press machine 7, the pressure distribution is uniform around the entire circumference of the wound body 5 in the direction of the arrow. Unlike the conventional method using a mold press, the cause of delamination can be eliminated, and it not only improves yield but also has excellent effects without deterioration of characteristics. In addition, since it is a hot press bonding process using a hydrostatic press machine 7, it is possible to easily form a wound ceramic capacitor 19, which was not possible with a hot press bonding process using a mold press. Strip-shaped L ramic dielectric sheet 3
Since it is only provided at one end in the width direction of the internal electrode 2, it requires blank areas on three sides of the internal electrode 2 that do not contribute to the capacitance. The size can be significantly reduced. Furthermore, the pressure bonding using the isostatic press machine 7 results in a more uniform pressure distribution around the entire circumference of the wound body 5 compared to that using a mold press, so even if the number of turns is increased, the pressure distribution is uniform, and the This method has many advantages, such as the ability to obtain a ceramic capacitor of high quality that exceeds the limits of GI layer ceramic capacitors obtained by mold pressing.
つぎに第3図に示す構成からなる本発明の実施例Aと従
来の製法によって得られた第10図に示す参考例Bの積
層セラミックコンデンサとの比較の一例について述べる
。Next, an example of a comparison between Example A of the present invention having the configuration shown in FIG. 3 and the multilayer ceramic capacitor of Reference Example B shown in FIG. 10 obtained by a conventional manufacturing method will be described.
実施例A ■誘電体材料 pb系組成にバインダーとしてアクリル系樹脂を添加。Example A ■Dielectric material Acrylic resin is added as a binder to the PB composition.
■シート形成□ ドクターブレード法■シー1−1法
・全白部寸法□厚さ50μm。■Sheet formation□Doctor blade method■Seal 1-1 method・All white area dimensions□Thickness 50μm.
長さ150ya、幅6M、余白部0.5M(なお巻き始
め15m巻き終り30s+を余白部とした。)
■内部電極□AQ−Pdペースト印刷
■静水圧プレスマシン条件□温度65°C2内圧300
K9 / ci 、時間10分間■焼成湿度・時間□
1050℃−4時間■外部電極□AQベース1〜焼付
参考例B
■誘電体材料□実施例へと同じ
■シート形成□
■シート厚さ・焼成簡素子8!1層体寸法・余白部シー
ト厚さ50μm、積層体寸法5.4M×4.0mX2m
、余白部三方にそれぞれ0.4m
■内部電極□実施例Aと同じ
■金型プレスマシン条件□温度65℃、圧力300 K
’l / cri 、時間10分■焼成温度・時間□1
050℃−4時間■外部電極□実施例Aと同じ
なお、上記A、Bとも定格は50WV1.2μFである
。しかして上記本発明の実施例Aと従来の参考例Bそれ
ぞれ30個の各特性および体積比較を調べた結果下表に
示すようになった。表に示す数値は、平均値である。Length 150ya, Width 6M, Margin 0.5M (The margin is 15m at the start of winding and 30s+ at the end of winding.) ■ Internal electrode □ AQ-Pd paste printing ■ Hydrostatic press machine conditions □ Temperature 65°C 2 Internal pressure 300
K9/ci, time 10 minutes ■Baking humidity/time□
1050℃ - 4 hours ■ External electrode □ AQ base 1 to Baking reference example B ■ Dielectric material □ Same as Example ■ Sheet formation □ ■ Sheet thickness / Firing simple 8! 1 layer dimensions / Margin sheet thickness Size: 50μm, laminate size: 5.4M x 4.0m x 2m
, 0.4 m each on three sides of the margin ■ Internal electrode □ Same as Example A ■ Mold press machine conditions □ Temperature 65°C, pressure 300 K
'l/cri, time 10 minutes■Baking temperature/time□1
050° C. for 4 hours ■ External electrode □ Same as Example A Note that both A and B have a rating of 50 WV and 1.2 μF. The results of comparing the characteristics and volume of 30 examples of Example A of the present invention and the conventional reference example B were as shown in the table below. The numerical values shown in the table are average values.
以 下 余 白
上表から明らかなように実施例Aは参考例Bと比較し各
特性ともわずかながらすぐれており、実施例△は参考例
]3ど比較し体積比で約70%、体積当りの容量比で約
1.5倍で大幅な小形化が可能であり、参考例Bと同一
体積であれば大幅な大容量化が可能である点を実証した
。Below Margin As is clear from the table above, Example A is slightly superior in each characteristic compared to Reference Example B, and Example A is the reference example. It was demonstrated that a large reduction in size is possible with a capacity ratio of about 1.5 times, and that a large capacity increase is possible with the same volume as Reference Example B.
なお上記実施例では巻回体5の形状として円筒形のもの
を例示して説明したが第4図および第5図に示すような
形状からなる巻芯10を用い巻回体形状を該巻芯10形
状に沿ったものとしたものでも静水圧プレスマシンによ
る加熱圧着手段による全周囲への均一圧力分布となるた
め適用できることは勿論である。また内部型極月として
Niなどの卑金属を用いた場合雰囲気焼成をすることは
当然である。In the above embodiment, the shape of the wound body 5 was exemplified as a cylindrical shape. 10 shape is also applicable since it results in uniform pressure distribution over the entire periphery by the hot pressing means using the isostatic press machine. Furthermore, when a base metal such as Ni is used for the internal mold, it is natural to perform atmospheric firing.
[発明の効果]
本発明によれば静水圧プレスマシンによる加熱圧着によ
って巻回体の全周囲に圧力を均一に分布できることによ
って特性良好で小形化および大容量化を可能とした実用
的価値の高い巻回形セラミックコンデンサの製造方法を
(qることができる。[Effects of the Invention] According to the present invention, pressure can be uniformly distributed around the entire circumference of the wound body by heat-pressing using an isostatic press machine, which has good characteristics and has high practical value, making it possible to downsize and increase capacity. A method for manufacturing a wound ceramic capacitor can be described (q).
第1図〜第3図は本発明の一実施例に係る巻回形セラミ
ックコンデンサの製造方法を説明するためのもので、第
1図は巻回体の一部展開斜視図、第2図は静水圧プレス
マシンによる加熱圧着方法を示ず概略図、第3図は巻回
形セラミックコンデンサを示す斜視図、第4図および第
5図は本発明の他の実施例に係る巻芯それぞれを示す斜
視図、第6図〜第11図は従来の参考例に係る積層セラ
ミックコンデンサの製造方法を説明づるためのもので第
6図は銹電体生シートを示す斜視図、第7図はセラミッ
ク積層体を示す斜視図、第8図は金型ブレスによる加熱
圧着方法を示ず概略図、第9図はセラミック成形体を示
す斜視図、第10図は積層セラミックコンデンサを示す
斜視図、第11図は第10図に示すコンデンサに外部電
極を形成する前の単位体の一部展開斜視図である。
1・・・・・・余白部 2・・・・・・内部電
極3・・・・・・帯状セラミック誘電体シート4・・・
・・・巻芯 5・・・・・・巻回体6・・・・
・・耐水性袋 7・・・・・・静水圧プレスマシン
8・・・・・・外部電極 9・・・・・・巻き終り
余白部10・・・・・・巻芯
特 許 出 願 人
マルコン電子株式会社
巻回形セラミックコンデンサの斜視図
第3図
第す図
第8図
第11図
第7図
第10図
第9図FIGS. 1 to 3 are for explaining a method of manufacturing a wound ceramic capacitor according to an embodiment of the present invention. FIG. 1 is a partially exploded perspective view of a wound body, and FIG. FIG. 3 is a perspective view showing a wound ceramic capacitor, and FIGS. 4 and 5 show winding cores according to other embodiments of the present invention. The perspective views, FIGS. 6 to 11, are for explaining the manufacturing method of a multilayer ceramic capacitor according to a conventional reference example. FIG. 6 is a perspective view showing a ceramic laminated sheet, and FIG. FIG. 8 is a schematic diagram showing the heat-pressing method using a mold press, FIG. 9 is a perspective view showing a ceramic molded product, FIG. 10 is a perspective view showing a multilayer ceramic capacitor, and FIG. 11 10 is a partially exploded perspective view of the unit before forming external electrodes on the capacitor shown in FIG. 10. FIG. 1... Margin area 2... Internal electrode 3... Band-shaped ceramic dielectric sheet 4...
... Winding core 5 ... Winding body 6 ...
... Waterproof bag 7 ... Hydrostatic press machine 8 ... External electrode 9 ... Margin at end of winding 10 ... Winding core patent applicant Perspective view of wound ceramic capacitor by Marukon Electronics Co., Ltd. Figure 3 Figure 8 Figure 11 Figure 7 Figure 10 Figure 9
Claims (1)
ラミック誘電体生シート一対を余白部それぞれを反対側
にして積層し剥離剤を塗布した巻芯に巻回し巻回体を形
成する手段と、該巻回体を耐水性袋に入れ内部の空気を
吸引して真空包装し静水圧プレスマシンで加熱圧着する
手段と、該手段の後前記巻芯を除去し脱脂−焼成ししか
る後両端面に外部電極を形成する手段とを具備したこと
を特徴とする巻回形セラミックコンデンサの製造方法。means for forming a wound body by stacking a pair of band-shaped raw ceramic dielectric sheets with one end in the width direction as a margin and forming internal electrodes, with the margins facing opposite sides, and winding the sheets around a core coated with a release agent; The wound body is placed in a water-resistant bag, vacuum-packaged by suctioning the air inside, and heat-pressed using a hydrostatic press machine. After the means, the core is removed, degreased and baked, and then both end surfaces are sealed. 1. A method for manufacturing a wound ceramic capacitor, comprising: means for forming an external electrode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61047934A JPS62204513A (en) | 1986-03-04 | 1986-03-04 | Manufacture of wound ceramic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61047934A JPS62204513A (en) | 1986-03-04 | 1986-03-04 | Manufacture of wound ceramic capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62204513A true JPS62204513A (en) | 1987-09-09 |
Family
ID=12789202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61047934A Pending JPS62204513A (en) | 1986-03-04 | 1986-03-04 | Manufacture of wound ceramic capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62204513A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6428644B1 (en) * | 1998-02-19 | 2002-08-06 | Teijin Limited | Process and apparatus for producing a laminate for electronic parts |
JP2003188046A (en) * | 2001-12-19 | 2003-07-04 | Shizuki Electric Co Inc | Metallized film capacitor |
-
1986
- 1986-03-04 JP JP61047934A patent/JPS62204513A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6428644B1 (en) * | 1998-02-19 | 2002-08-06 | Teijin Limited | Process and apparatus for producing a laminate for electronic parts |
JP2003188046A (en) * | 2001-12-19 | 2003-07-04 | Shizuki Electric Co Inc | Metallized film capacitor |
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