JPS62192663U - - Google Patents
Info
- Publication number
- JPS62192663U JPS62192663U JP8043686U JP8043686U JPS62192663U JP S62192663 U JPS62192663 U JP S62192663U JP 8043686 U JP8043686 U JP 8043686U JP 8043686 U JP8043686 U JP 8043686U JP S62192663 U JPS62192663 U JP S62192663U
- Authority
- JP
- Japan
- Prior art keywords
- conductive pattern
- electronic component
- external lead
- circuit board
- black
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図〜第２図は何れも本考案の実施例を示し
、第１図は要部組立図であり、第２図は電子部品
を取付ける前の回路基板の要部平面図であり、第
３図は従来例を示す要部組立図である。
１……回路基板、２……導通パターン、３……
パツケージＩＣ、４……外部リード、５……黒色
部。
Figures 1 and 2 all show embodiments of the present invention; Figure 1 is an assembled view of the main parts, Figure 2 is a plan view of the main parts of the circuit board before electronic components are attached, and Figure 2 is a plan view of the main parts of the circuit board before electronic components are attached. FIG. 3 is an assembly diagram of main parts showing a conventional example. 1... Circuit board, 2... Conductive pattern, 3...
Package IC, 4...external lead, 5...black part.
Claims (1)
を有する電子部品を載置し、前記電子部品の外部
リードは前記導電パターンと接触しない部分を黒
色とすると共に、前記外部リード周辺に位置する
前記回路基板上の導電パターン近傍を黒色とした
ことを特徴とする回路基板の電子部品取付構造。 An electronic component having an external lead is placed on a circuit board having a conductive pattern, and the external lead of the electronic component is black in a portion that does not contact the conductive pattern, and a portion of the external lead of the electronic component that does not contact the conductive pattern is black, and a portion of the external lead of the electronic component that does not contact the conductive pattern is placed on the circuit board. An electronic component mounting structure for a circuit board, characterized in that the vicinity of the conductive pattern is black.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8043686U JPS62192663U (en) | 1986-05-28 | 1986-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8043686U JPS62192663U (en) | 1986-05-28 | 1986-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62192663U true JPS62192663U (en) | 1987-12-08 |
Family
ID=30931239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8043686U Pending JPS62192663U (en) | 1986-05-28 | 1986-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62192663U (en) |
-
1986
- 1986-05-28 JP JP8043686U patent/JPS62192663U/ja active Pending
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