JPS62190735A - Mounting method for tape carrier type semiconductor element - Google Patents

Abstract

PURPOSE:To prevent external connecting leads from being deformed by mounting a semiconductor element on a substrate by pressing the leads on the substrate at the beforehand position of a cutout formed on the leads, and then cutting the lead by the cutout portion to disconnect the element from a tape carrier. CONSTITUTION:The outer end of a pressing tool 4 is disposed on the outer connecting leads 21 of a semiconductor element 2, the leads 21 are pressed on a connecting pad 31 on a substrate 3 by the tool 4 to mount the element 2 on the substrate 3. In this case, the outer end of the tool 4 is disposed at the beforehand position of the cutout 22 of the leads 21 to be pressed, thereby generating a lead collapsible portion 24 to be readily disconnected in the boundary of the remaining leads 23 at the tape carrier 1 side and the pressed portion 25. After the element 2 is mounted on the substrate 3, the leads 21 and the pad 31 are pressed by the tool 4, and the carrier 1 is the pulled up in a direction of an arrow A to disconnect the leads 21 at the lead collapsible portion 25, thereby separating the element 2 from the carrier 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for mounting a tape carrier type semiconductor device on a substrate.

[Prior Art] Conventionally, this type of mounting method involves, as shown in FIG. 4, cutting the semiconductor element 2 from the tape carrier 1 in advance, and then crimping the leads 21 of the element 2 to the connection pads 31 of the substrate 3. This was done by connecting with.

[Problems to be Solved by the Invention] In the above-described mounting method, since the semiconductor cord 2 is separated from the tape carrier 1 in advance, troubles such as deformation of the external connection leads 21 occur during the process up to mounting on the board 3. This has the drawback that alignment of the connection lead 21 and the connection pad 31 is difficult.

An object of the present invention is to provide a mounting method that prevents deformation of external connection leads of a semiconductor element.

[Means for Solving the Problems] The present invention provides a method in which a notch is provided in a part of the external connection lead of a semiconductor element formed on a tape carrier, and the external connection lead is crimped to the substrate at a position in front of the notch. This tape carrier type semiconductor device mounting method is characterized in that the semiconductor device is mounted on the substrate using a tape carrier, and then the external connection leads are cut at the cutout portion to separate the semiconductor device from the tape carrier.

[Example] Next, an example of the present invention will be described with reference to the drawings.

FIG. 3 is a plan view showing an embodiment of the present invention, and as shown in FIG. 1 is supported.

In the present invention, a notch 22 is provided in a part of the external connection lead 21 of the semiconductor element 2 on the tape carrier 1.

As shown in FIGS. 1 and 2, the present invention involves positioning the outer end 4a of the crimping tool 4 on the external connection lead 21 of the semiconductor element 2 on the front side of the notch 22, and using the tool 4 to connect the lead 21.
is pressed onto the connection pads 31 on the substrate 3, and the semiconductor element 2 is mounted on the substrate 3. By positioning the outer end 4a of the crimping tool 4 at a position in front of the notch 22 of the lead 21 and crimping, the tape remains on the tape carrier 1 side, or is easily cut at the boundary between the part 23 and the crimping part 25, resulting in a partial breakage. 24 is generated. As shown in FIG. 3, after mounting the semiconductor element 2 on the substrate 3 while still attached to the tape carrier 1,
While the external connection leads 21 and connection pads 31 are still crimped, the tape carrier 1 is pulled up in the direction of the arrow, the external connection leads 21 are cut at the partially broken portion 24, and the semiconductor element 2 is separated from the tape carrier 1.

[Effects of the Invention] As explained above, according to the present invention, a notch is provided in the external connection lead of a semiconductor element, and after the semiconductor element is mounted on a board as a tape carrier, the lead is cut at the notch part. Since the semiconductor element is separated from the tape carrier, there is no need to handle the semiconductor element alone, which simplifies the manufacturing process and improves yield. Furthermore, since the tape carrier can be positioned on the substrate as it is, troubles such as lead deformation are drastically reduced, assembly accuracy is improved, and manufacturing process automation can be easily realized.

[Brief explanation of drawings]

1 and 2 are explanatory diagrams showing a mounting method according to the present invention, FIG. 3 is a plan view showing an example of a semiconductor element according to the present invention, and FIG. 4 is an explanatory diagram showing a conventional mounting method. 1...Tape carrier, 2...Semiconductor element. 3... Board, 4... Crimping tool. 21, 23... Semiconductor external connection leads. 22...notch. 24...Broken part of external connection lead. 25...Crimp part

Claims (1)

[Claims] (1) A notch is provided in a part of the external connection lead of the semiconductor element formed on the tape carrier, and the external connection lead is crimped to the substrate at a position in front of the notch to mount the semiconductor element on the substrate. . A method for mounting a semiconductor device on a tape carrier, characterized in that the semiconductor device is separated from the tape carrier by cutting the external connection lead at the cutout portion.