JPS62187143A - Method for processing glass - Google Patents

Abstract

PURPOSE:To form a pattern having high dimensional precision on the glass surface with high productivity by forming a two-dimensional pattern on a photosensitive film provided on the glass surface, removing the photosensitive film on the pattern part, and then etching the film. CONSTITUTION:One or plural two-dimensional patterns are compositely formed on the photosensitive film provided on the glass surface, and exposed by a photomagnetic method to form the desired two-dimensional pattern. As the photomagnetic method, a photomask is arranged by a contact or proximity method, and UV light or Deep UV light is irradiated. An amorphous chalcogenide vapor-deposited film having 0.01-0.3mum thickness is appropriately used as the photosensitive film. Subsequently, when the photosensitive film is of positive type, the pattern forming part is removed by etching, etc., or the non-photosensitized part is removed when the film is of negative type. Then the obtained exposed part of glass is etched by RIE, plasma etching, etc. Consequently, a pattern of micron order or below is formed on the glass surface.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a glass processing method, particularly to a manufacturing technique for grooved substrates for optical disks or magneto-optical disks.

[Conventional technology] Group method and 2F (photopolymer) are used for grooved substrates.
There are two ways with the law. In the case of a positive resist, the group method involves coating two glass plates with a 7-photoresist (hereinafter referred to as resist), drawing a spiral or concentric circle pattern as a series of dots with a laser beam, and then exposing the resist to light using a method such as etching. Remove the non-photosensitive parts (in the case of a negative resist) to expose the glass. Thereafter, the exposed portion of the glass is etched using a method such as RIE (reactive ion etching) to obtain a predetermined pattern. The 2P method is a method in which a photosensitive resin is used to build up an uneven film surface on a glass surface, and is fundamentally different from the group method in which glass is removed.

[Problems to be Solved by the Invention] The groove pattern is usually 0.8 μm in diameter, 1.6 μm in pitch, 0.07 μm in depth, and has a disc diameter of 3.5 inches (inches) to 5.5 inches. It is 25″. It takes about 20 minutes to draw this pattern with a laser beam, and this process determines the manufacturing speed of the glass grooved substrate, making it inefficient.Also, in the case of the 2P method, which aims at the same function, polymer is applied to the glass surface. Due to the presence of , the recording film is unreliable in terms of durability and the material cost is high.Furthermore, the plastic grooved substrate made by injection molding has problems in terms of reliability and dimensional accuracy. , the stability is far inferior to that of glass.

[Means for solving the problem] In order to form a pattern with minute dimensions on the order of microns or smaller on a glass surface, a desired pattern is formed by using one two-dimensional pattern or a combination of a plurality of two-dimensional patterns. A photosensitive film is formed on the glass surface using an electromagnetic optical method, and then etched or other methods are used to remove this part in the case of a positive resist or remove the non-photosensitive part in the case of a negative resist. The exposed surface of the glass is then etched using a method such as RIE.

As the electromagnetic optical method, irradiation with UV light (ultraviolet light, wavelength of about 300 to 400 nm) or deep UV light (far ultraviolet light, wavelength of about 200 to 300 nm) can be employed.

[Example 1 Example 1 Exposure device: Canon PLA-5213 Mask arrangement mode: Soft contact Light source: SOOW high pressure mercury lamp, ON = 29hm Mask:
DNP resolution chart 4″ (0.5°0.75.1
．． Glass: Soda lime glass, plate thickness 2■■Resist (photosensitive II): 0DUR1000 manufactured by Tokyo Ohka, 0.4μ
Layer thickness exposure: 49.58.113. f19 (J/c)
2) Development: 23°C, 2m using Tokyo Ohka 1010 developer
1n.

Rinse Ni Tokyo Ohka Rinser, 23°C, 11n.

To form a pattern with a line width of 0.5 mm, it takes 53 mJ.
Observation using an optical microscope revealed that the exposure of /c shoulder 2 was optimal. The glass patterned under these conditions was subjected to RIE equipment to form a pattern of the same size on the glass surface. RIE processing of glass was performed in the following manner.

RIE device: Canon GIR-280 Etching conditions: Gas 02F630 cm3/5inHe 80
// Pressure 100 Pa Power 30〇1 hour 1 layer in.

As a result, a pattern with the same line width as the mask and a depth of 700 people could be formed on the glass surface.

Example 2 Exposure device: Canon MPA-500FA Mask Coordination mode: Soft contact Light source: 500W high pressure mercury lamp On = 290mm Mask: DNP resolution chart 4'' (0.5° 0.75.
(With 1.0μ layer positive and negative pattern) Glass: Soda lime glass, ° board thickness 2■■Resist (
Photosensitive film): As2S3.0. IJAll thick fog light: 100 mJ/crn' Development: NaOH and Na2HPO4 aqueous solution (PH
= 11.8), 23°C, 2++in.

A pattern with a line width of 0.5 μm was formed, and this glass was
The RIE processing conditions were as in Example 1, and a pattern of the same size could be formed on the glass surface to a depth of 700 mm using the IE device.
Same as .

[Effects of the Invention] 1. According to the present invention, a pattern can be formed on a glass surface by simultaneous exposure of the entire surface with one two-dimensional pattern or by composite self-synthesis of a plurality of two-dimensional patterns, thereby improving the dimensional accuracy of the pattern. In the case of direct writing using laser light in the group method or 2P method, which has extremely high However, the method of the present invention is highly advantageous.

2. According to the present invention, the resist film applied to the glass surface can be exposed to light in a short time of several seconds by using a mask. On the other hand, since direct drawing using the laser beam described above requires several tens of minutes, the method of the present invention is extremely superior in productivity.

Claims (3)

[Claims] (1) In a method of forming a pattern with minute dimensions on the order of microns or smaller on a glass surface, a desired two-dimensional pattern is formed on the glass surface by one two-dimensional pattern or a combination of multiple two-dimensional patterns. After forming the provided photosensitive film by exposing it to light using an electromagnetic optical method, (a) if the photosensitive film is a positive photosensitive film, remove the portion where the desired pattern is formed by a method such as etching; or (b) if the photosensitive film is a negative photosensitive film, remove the photosensitive film portion other than the desired pattern forming portion to create an exposed portion of glass, and then apply RI to the exposed portion.
A glass processing method characterized by etching using methods such as E (reactive ion etching) and plasma etching. (2) When forming the desired pattern on the photosensitive film by exposing it to light using an electromagnetic optical method, a photomask is arranged by a contact or proximity method, and UV light or deep UV light (far ultraviolet light) is applied. A glass processing method according to claim 1, characterized in that the glass processing method is used. (3) Processing of glass according to claim 1, characterized in that the photosensitive film is a vapor-deposited film of amorphous chalcogenide with a thickness in the range of 0.01 to 0.3 μm. Method.