JPS62160773A - electrical circuit equipment - Google Patents
electrical circuit equipmentInfo
- Publication number
- JPS62160773A JPS62160773A JP61002499A JP249986A JPS62160773A JP S62160773 A JPS62160773 A JP S62160773A JP 61002499 A JP61002499 A JP 61002499A JP 249986 A JP249986 A JP 249986A JP S62160773 A JPS62160773 A JP S62160773A
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- signal processing
- processing device
- output
- electric circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Light Receiving Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電気回路装置に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to an electric circuit device.
本発明の電気回路装置は、各種信号を検知して作動する
装置などとして汎用でき、例えば光を検知して作動する
リモートコントロールレシーバ−に利用することができ
る。The electric circuit device of the present invention can be used for general purposes such as a device that detects various signals and operates, and can be used, for example, as a remote control receiver that detects and operates light.
本発明は、ベア半導体装置からなるセンサと、該センサ
で受信した信号を処理するベア半導体装置からなる信号
処理装置と、出力ピンとの各要素が基板上に形成されて
成る電気回路装置において、上記の要素をセンサ、信号
処理装置、出力ピンの順で配列し、かつ上記センサと、
信号処理装置を同一樹脂でオーバーコートすることによ
って、必要な性能を保証し、生産性及び信頼性の向上を
図ろうとするものである。The present invention provides an electric circuit device in which the following elements are formed on a substrate: a sensor made of a bare semiconductor device, a signal processing device made of a bare semiconductor device that processes a signal received by the sensor, and an output pin. elements are arranged in the order of a sensor, a signal processing device, and an output pin, and the above sensor and
By overcoating the signal processing device with the same resin, it is possible to guarantee the necessary performance and improve productivity and reliability.
従来より、センサと、これが受信した信号を処理する処
理装置とを備えた電気回路装置が各種の分野で用いられ
ている。2. Description of the Related Art Electric circuit devices that include a sensor and a processing device that processes signals received by the sensor have been used in various fields.
このようなものの−例として、赤外線を信号としたリモ
ートコントロールレシーバ−がある。An example of such a device is a remote control receiver that uses infrared rays as a signal.
近年、赤外線リモートコントロール装置搭載の家電機器
などが非常に多くなってきた。これらリモートコントロ
ール装置搭載機器は、その高密度実装化のため、小型化
が要求される。この結果リモートコントロール受光セン
サとしてのＩＣとビンフォトダイオードの一体型モジュ
ールが出現してきた。In recent years, an increasing number of home appliances are equipped with infrared remote control devices. These devices equipped with remote control devices are required to be miniaturized in order to achieve high-density packaging. As a result, an integrated module of an IC and a bin photodiode as a remote control light receiving sensor has appeared.
最小形状のモジュールは、小型部品を使い、半導体をベ
アで搭載することが必要になるが、必要な性能を得るた
めには、下記に示す項目を充分に考慮する必要がある。The smallest module requires the use of small components and bare semiconductor mounting, but in order to obtain the necessary performance, it is necessary to fully consider the following items.
■ 信号処理装置である受信アンプＩＣの入力部のゲイ
ンが非常に高く （例えば８０ ｄＢ）、信号の各配線
間へのクロストークを極力おさえる必要から、入出力を
混在させてはならない。■ The input section of the receiving amplifier IC, which is a signal processing device, has a very high gain (for example, 80 dB), and crosstalk between signal wires must be suppressed as much as possible, so input and output must not be mixed.
■ 基板配線の浮遊容量の影響を小さくするために、出
力配線長は極力短かくする必要がある。■ To reduce the effect of stray capacitance on the board wiring, the output wiring length must be kept as short as possible.
■ センサ（受光素子）としてのピンフォトダイオード
は、受光角度の保証から受光窓真下に配置する必要があ
る。■ The pin photodiode as a sensor (light-receiving element) must be placed directly below the light-receiving window to ensure the light-receiving angle.
■ ビンフォトダイオードには可視光カット特性が必要
である。■ Visible light cut characteristics are required for the bin photodiode.
これらを考慮せずに単純に小型部品を使い、半導体をベ
アで搭載することで小さくしたのみではまったく必要な
性能を得ることはできない。If you simply use small components without taking these into account and reduce the size by mounting bare semiconductors, you will not be able to obtain the required performance at all.
本発明は、上記各項目に揚げられた問題点を充分に考慮
した電気回路装置を提供するものである。The present invention provides an electric circuit device that fully takes into account the problems listed above.
即ち本発明の目的は、必要な性能が確保され、かつ小型
形状であり、生産性、信頼性も良く、かつ可視光カント
などの必要性も容易に達成することが可能な電気回路装
置を提供することにある。That is, an object of the present invention is to provide an electric circuit device that has the necessary performance, is small in size, has good productivity and reliability, and can easily meet the requirements such as visible light cant. It's about doing.
本発明は、基板上に形成されたベア半導体装置からなる
センサと、該センサで受信した信号を処理するベア半導
体装置からなる信号処理装置と、出力ピンとの各要素を
、センサ、信号処理装置、出力ピンの順で配列し、かつ
上記センサと、信号処理装置を同一樹脂でオーバーコー
トしたことを特徴とするものである。The present invention provides a sensor, a signal processing device, a signal processing device, and an output pin. The sensor is arranged in the order of the output pins, and the sensor and the signal processing device are overcoated with the same resin.
上記各要素を上記のように配列した結果、センサと信号
処理装置とは近距離で配置でき、よって両者を同一樹脂
で容易にオーバーコートできる。As a result of arranging the above elements as described above, the sensor and the signal processing device can be placed close to each other, and therefore both can be easily overcoated with the same resin.
またこの樹脂に、必要な可視光カット性などを与えるこ
とができる。このため、生産性、信頼性が向上し、必要
な性能を確保できる。Further, this resin can be given the necessary visible light cutting properties. Therefore, productivity and reliability are improved, and necessary performance can be ensured.
以下本発明の一実施例について説明する。なお当然のこ
とであるが、本発明は以下述べる実施例にのみ限定され
るものではない。An embodiment of the present invention will be described below. It should be noted that, as a matter of course, the present invention is not limited only to the examples described below.
この実施例は、本発明を赤外線リモートコントロールレ
シーバ−に適用したものである。In this embodiment, the present invention is applied to an infrared remote control receiver.
第１図は、本発明の一実施例である上記レシーバ−にお
ける基板１上の配線パターン図である。FIG. 1 is a wiring pattern diagram on a substrate 1 in the receiver according to an embodiment of the present invention.
センサ２であるビンフォトダイオードから、信号処理装
置３をなすベアＩＣへの入力配線はＡ、ＩＣからの出力
配線はＢである。図中、４は基材スルーホール、５は金
線、６はオーバーコート樹脂（破線内）である、出力線
の外部取り出しは、出力配線Ｂのスルーホール部よりリ
ード線を引き出している。The input wiring from the bin photodiode that is the sensor 2 to the bare IC that forms the signal processing device 3 is A, and the output wiring from the IC is B. In the figure, 4 is a base material through hole, 5 is a gold wire, and 6 is an overcoat resin (inside the broken line).The output wire is taken out from the through hole portion of the output wiring B.
以上のように基板１上にセンサ２ （ベアピンフォトダ
イオード）、信号処理装置３（ベアＩＣ）、出力取り出
しピンＢの順で一列に配置し、２つのベア半導体（セン
サ２と信号処理装置３）のオーバーコートを同一樹脂６
によりコーティングしている０本例では樹脂は、可視光
カットの染料入り樹脂を用いている。As described above, the sensor 2 (bare pin photodiode), the signal processing device 3 (bare IC), and the output take-out pin B are arranged in a line on the substrate 1 in this order, and the two bare semiconductors (sensor 2 and signal processing device 3) ) overcoat with the same resin 6
In this example, the resin used is a dye-containing resin that blocks visible light.
本実施例では上記のように最小形状を達成するためにＩ
Ｃとピンダイオードを近距離に配置し、かつこの配置に
よりＩＣとピンダイオードのオーバーコートを同一樹脂
６で同時にコーティングすることが可能となり、生産性
及び信頼性の向上が図られる。In this example, in order to achieve the minimum shape as described above, I
The IC and the pin diode are arranged close to each other, and this arrangement makes it possible to simultaneously overcoat the IC and the pin diode with the same resin 6, thereby improving productivity and reliability.
オーバーコート樹脂６には、可視光カット特性を与える
ことができ、この特性は、樹脂に染料を入れることによ
り得られる。The overcoat resin 6 can be given visible light cutting properties, and this property can be obtained by adding a dye to the resin.
上記構成によれば、最適なベア半導体装置がなされたこ
とにより、必要な性能が確実に保証される。According to the above configuration, necessary performance is reliably guaranteed by creating an optimal bare semiconductor device.
即ち本実施例においては、ベア半導体であるセンサ２（
受光素子）としてのビンフォトダイオードと、信号処理
装置３（受信アンプ）としてのＩＣを基板１の同一面上
に、ビンフォトダイオード、受信アンプＩＣ１出力取り
出しピンＢの順で一列に並べたので、信号の人出力線を
混在させず、かつ配線長をできるだけ短かくすることが
できる。That is, in this embodiment, the sensor 2 (
The bin photodiode (light receiving element) and the IC (signal processing device 3 (receiving amplifier)) are arranged in a row on the same surface of the substrate 1 in the order of the bin photodiode and the output pin B of the receiving amplifier IC 1. The wiring length can be made as short as possible without mixing signal human output lines.
（たとえば基板両面で上下に配置したり、ビンフォトダ
イオードを中心に配置し、受信アンプＩＣ１出力取り出
しビンを左右に配置するなどであると、基板上での配線
すなわち入出力の信号線が混在することになり、必要な
性能は得られない）。(For example, if the wiring on both sides of the board is arranged vertically, or if the bin photodiode is arranged in the center and the receiving amplifier IC 1 output extraction bin is arranged on the left and right sides, the wiring on the board, that is, the input and output signal lines will be mixed. (As a result, the required performance cannot be obtained).
本実施例では上記のようなベア半導体装置により、必要
な性能が保証され、かつオーバーコートを同一樹脂で同
時にコーティングすることが可能となり、生産性及び信
顛性の向上が図られる。In this embodiment, the bare semiconductor device as described above guarantees the necessary performance, and it becomes possible to simultaneously coat the overcoat with the same resin, thereby improving productivity and reliability.
上述の如く、本発明によれば、必要な性能が確保され、
かつ小型形状であり、生産性、信頬性も良く、かつ可視
光カットなどの必要性も容易に達成することが可能な電
気回路装置を提供することができる。As described above, according to the present invention, the necessary performance is ensured,
Moreover, it is possible to provide an electric circuit device that is small in size, has good productivity and reliability, and can easily meet the requirements such as cutting off visible light.
第１図は、本発明の一実施例の配線パターン図である。
１・・・基板、２・・・センサ（受光素子、ビンフォト
ダイオード）、３・・・信号処理装置（ベアＩＣ）、６
・・・オーバコート樹脂。FIG. 1 is a wiring pattern diagram of an embodiment of the present invention. 1... Board, 2... Sensor (light receiving element, bin photodiode), 3... Signal processing device (bare IC), 6
...Overcoat resin.
Claims (1)
した信号を処理するベア半導体装置からなる信号処理装
置と、出力ピンとの各要素が基板上に形成されて成る電
気回路装置において、上記の要素が センサ、信号処理装置、出力ピンの順で配列され、かつ 上記センサと、信号処理装置を同一樹脂でオーバーコー
トしたことを特徴とする電気回路装置。[Claims] 1. An electric circuit in which the following elements are formed on a substrate: a sensor made of a bare semiconductor device, a signal processing device made of a bare semiconductor device that processes signals received by the sensor, and an output pin. An electric circuit device characterized in that the above elements are arranged in the order of a sensor, a signal processing device, and an output pin, and the sensor and the signal processing device are overcoated with the same resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61002499A JP2590811B2 (en) | 1986-01-09 | 1986-01-09 | Electric circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61002499A JP2590811B2 (en) | 1986-01-09 | 1986-01-09 | Electric circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62160773A true JPS62160773A (en) | 1987-07-16 |
| JP2590811B2 JP2590811B2 (en) | 1997-03-12 |
Family
ID=11531051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61002499A Expired - Fee Related JP2590811B2 (en) | 1986-01-09 | 1986-01-09 | Electric circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2590811B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0433742A2 (en) * | 1989-12-18 | 1991-06-26 | TEMIC TELEFUNKEN microelectronic GmbH | Photo module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59197830A (en) * | 1983-04-26 | 1984-11-09 | Nec Corp | Photoelectric converter |
| JPS59200426A (en) * | 1983-04-27 | 1984-11-13 | Copal Co Ltd | Partial sealing method |
-
1986
- 1986-01-09 JP JP61002499A patent/JP2590811B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59197830A (en) * | 1983-04-26 | 1984-11-09 | Nec Corp | Photoelectric converter |
| JPS59200426A (en) * | 1983-04-27 | 1984-11-13 | Copal Co Ltd | Partial sealing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0433742A2 (en) * | 1989-12-18 | 1991-06-26 | TEMIC TELEFUNKEN microelectronic GmbH | Photo module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2590811B2 (en) | 1997-03-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |