JPS62160726A - Laser trimming apparatus for optical device - Google Patents

Abstract

PURPOSE:To increase working efficiency, by setting the wavelength of a light for measurement in a region wherein the effective quantum efficiency of a photo semiconductor element to be worked is high, and setting the wavelength of a laser beam in the region wherein the effective quantum efficiency of a photo semiconductor element to be worked is very low. CONSTITUTION:The center wavelength of a light for measurement lambda1, is selected at a point where the effective quantum efficiency is high, and the wavelength of a laser beam, lambda2, is selected at a point wherein the effective quantum efficiency is very low. A laser trimming operation is performed by radiating simultaneously the light for measurement from a measuring light source 4 and the laser beam from a laser oscillator 3, and measurement is available at any time. Trimming and measurement can be performed, if necessary, at the same time. The wavelength of a laser beam for trimming is thus selected at a point wherein the effective quantum efficiency of an element to be worked is very low, so that the measurement can be performed at any time independently of the trimming operation. The element-stabilizing time until measurement after trimming is, of course, unnecessitated, and operation efficiency is increased.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an improvement of a laser trimming device for an optical semiconductor element (optical device). optical device laser)
A schematic configuration diagram showing an IJ mining device, (1) shows an optical semiconductor element to be processed (processed element), (2) shows an element mounting table,
(3) is a laser oscillator that generates a laser beam for processing;
(4) is a measurement light source that supplies light for measuring the characteristics of the processed element (1); (5) and (6) are mirrors that respectively direct the laser beam and measurement light to the processed element (1) K; (7) is an objective lens.

This device is used to manufacture an optical semiconductor device (1).
) is partially heated and removed by the laser beam from the laser oscillator (3) to bring the function of the element (1) into the desired state, thereby correctly reaching the target value. Since the processed element (1) is an optical device, its characteristics cannot be measured during the trimming process using a laser beam. Figure 4 is a diagram showing the sequence of a conventional laser IJ trimming operation, in which the beam wavelength from the laser oscillator (3) used for trimming is not aligned and the processed element (1) is sensitive to this. During this period, the characteristics cannot be measured using the measurement light source (4).

Therefore, the measurement period and the trimming period were temporally serial.

[Problem that the invention seeks to solve]

As mentioned above, in conventional laser trimming equipment for optical devices, trimming and characteristic measurement of the processed element must be performed with a time lag.Furthermore, since the laser beam has high energy, even if trimming is stopped, Immediately after that, the device to be processed is disturbed, and the measurement must be performed after a certain period of stabilization time, resulting in a problem of poor work efficiency.

The present invention has been made to solve these problems, and an object of the present invention is to provide a laser trimming apparatus that can measure characteristics as necessary while laser trimming an optical device.

[Means for solving problems]

In the laser trimming apparatus for an optical device according to the present invention, the wavelength of the trimming laser beam is set to a wavelength outside the sensitivity range of the processed element (optical device).

[Effect]

In this invention, since the operation of the optical device is not affected by the laser beam for trimming the optical device, it is possible to measure the characteristics at any time while performing laser trimming.

〔Example〕

The illustrated configuration itself of an embodiment of the present invention is the same as the conventional one shown in FIG. Figure 2 is a diagram showing the relationship between the effective quantum efficiency of the processed element, the laser beam wavelength, and the measurement light wavelength, where λ1 is the center wavelength of the measurement light, and λ2
is the wavelength of the laser beam, and the center wavelength λ1 of the measurement light is naturally selected at a point with high effective quantum efficiency, but the laser beam wavelength λ
2 is selected as the point where the effective quantum efficiency is extremely low. For example, if the device to be processed is a silicon photodiode, the measurement light wavelength λ1
is selected to be the center of its large quantum efficiency curve, 0.7 ) trn, and a YAG laser device that emits a beam with a wavelength (λ2) of 1.06 mem is used as the laser.

FIG. 3 is a diagram showing the sequence of laser trimming operations according to this embodiment, in which irradiation of measurement light from the measurement light source (4) and laser beam irradiation from the laser oscillator (3) are performed at the same time to make measurements as needed. It is also possible to perform trimming and measurement at the same time if necessary.

〔Effect of the invention〕

As explained above, in this invention, the wavelength of the laser beam for trimming is selected at a point where the effective quantum efficiency of the processed element is extremely low, so measurements can be performed at any time regardless of the trimming operation, and of course, measurements can be made after trimming using conventional equipment. There is no need for any element stabilization time, which greatly improves operational efficiency and simplifies operation.

[Brief explanation of drawings]

FIG. 1 is a schematic configuration diagram showing a conventional laser trimming device to which the present invention can be applied, and FIG. 2 is a diagram showing the effective quantum efficiency of a processed element, laser beam wavelength, and measurement light wavelength in an embodiment of the present invention. FIG. 3 is a sequence diagram showing the leather trimming operation according to this embodiment, and FIG. 4 is a can diagram. In the figure, (1) is an element to be processed, (3) is a laser oscillator, (4) is a measurement light source, λ is a measurement light wavelength, and λ2 is a laser beam wavelength.

Claims (1)

[Claims] (1) In an apparatus that trims an optical semiconductor element to be processed using a laser beam and measures the characteristics of the optical semiconductor element to be processed using measurement light at each required stage of the trimming process, The wavelength of the light is set in a region where the effective quantum efficiency of the optical semiconductor device to be processed is high, and the wavelength of the laser beam is set in a region where the effective quantum efficiency of the optical semiconductor device to be processed is extremely low. Device laser trimming equipment.