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JPS62160552U - - Google Patents

Info

Publication number
JPS62160552U
JPS62160552U JP4859986U JP4859986U JPS62160552U JP S62160552 U JPS62160552 U JP S62160552U JP 4859986 U JP4859986 U JP 4859986U JP 4859986 U JP4859986 U JP 4859986U JP S62160552 U JPS62160552 U JP S62160552U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor
plate
mounting structure
sub heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4859986U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4859986U priority Critical patent/JPS62160552U/ja
Publication of JPS62160552U publication Critical patent/JPS62160552U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例による半導体の取付
構造を示す斜視図、第２図は本実施例の主要部品
を示す斜視図、第３図は半導体を取付ける際の組
立構成図、第４図サブ放熱板と押さえ板とを主放
熱板に接続した状態を示す立面図、第５図は従来
の放熱器を有する半導体の取付構造の一例を示す
図である。 １，１０……プリント基板、２，１４……サブ
放熱板、４，１１，１２……半導体、５，１３…
…押さえ板、６，１５……主放熱板。 FIG. 1 is a perspective view showing a semiconductor mounting structure according to an embodiment of the present invention, FIG. 2 is a perspective view showing the main components of this embodiment, FIG. 3 is an assembly configuration diagram when mounting a semiconductor, and FIG. FIG. 5 is an elevational view showing a state in which a sub heat sink and a holding plate are connected to a main heat sink, and FIG. 5 is a diagram showing an example of a mounting structure for a semiconductor having a conventional heat sink. 1, 10... Printed circuit board, 2, 14... Sub heat sink, 4, 11, 12... Semiconductor, 5, 13...
...Press plate, 6,15...Main heat sink.

Claims (1)

【実用新案登録請求の範囲】 放熱器に基板上の半導体を取付ける半導体の取
付構造であつて、 半導体の押さえ部と係合突起を有する弾性部材
から成る押さえ板と、 前記押さえ板の係合突起と係合する開口部を有
し半導体を介して前記押さえ板と接続される弾性
部材から成るサブ放熱板と、 前記サブ放熱板及び前記押さえ板を連結部材に
より固定し前記サブ放熱板を密着させる主放熱板
と、を有することを特徴とする半導体取付構造。[Claims for Utility Model Registration] A semiconductor mounting structure for attaching a semiconductor on a substrate to a heat sink, comprising: a holding plate made of an elastic member having a holding portion of the semiconductor and an engaging protrusion; and an engaging protrusion of the holding plate. a sub heat sink made of an elastic member having an opening that engages with the press plate and connected to the presser plate through a semiconductor, and fixing the sub heat sink and the press plate with a connecting member to bring the sub heat sink into close contact with each other. A semiconductor mounting structure characterized by having a main heat sink.
JP4859986U 1986-03-31 1986-03-31 Pending JPS62160552U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4859986U JPS62160552U (en) 1986-03-31 1986-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4859986U JPS62160552U (en) 1986-03-31 1986-03-31

Publications (1)

Publication Number Publication Date
JPS62160552U true JPS62160552U (en) 1987-10-13

Family

ID=30870279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4859986U Pending JPS62160552U (en) 1986-03-31 1986-03-31

Country Status (1)

Country Link
JP (1) JPS62160552U (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007166820A (en) * 2005-12-15 2007-06-28 Denso Corp Power conversion equipment
JP2008245472A (en) * 2007-03-28 2008-10-09 Denso Corp Power conversion apparatus
JP2012182224A (en) * 2011-02-28 2012-09-20 Tdk Corp Fixing spring tool of electronic component and heat radiation structure
JP2013021083A (en) * 2011-07-08 2013-01-31 Tdk Corp Spring tool for fixing electronic component, and heat dissipation structure
CN103429046A (en) * 2012-05-21 2013-12-04 株式会社安川电机 Electronic component mounting module and power conversion apparatus
KR20150001206U (en) * 2013-09-12 2015-03-20 엘에스산전 주식회사 Power converter
CN113497015A (en) * 2020-04-01 2021-10-12 阿特拉斯·科普柯(无锡)压缩机有限公司 Power module

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007166820A (en) * 2005-12-15 2007-06-28 Denso Corp Power conversion equipment
JP4525582B2 (en) * 2005-12-15 2010-08-18 株式会社デンソー Power converter
JP2008245472A (en) * 2007-03-28 2008-10-09 Denso Corp Power conversion apparatus
JP4600413B2 (en) * 2007-03-28 2010-12-15 株式会社デンソー Power converter
JP2012182224A (en) * 2011-02-28 2012-09-20 Tdk Corp Fixing spring tool of electronic component and heat radiation structure
JP2013021083A (en) * 2011-07-08 2013-01-31 Tdk Corp Spring tool for fixing electronic component, and heat dissipation structure
CN103429046A (en) * 2012-05-21 2013-12-04 株式会社安川电机 Electronic component mounting module and power conversion apparatus
JP2013243264A (en) * 2012-05-21 2013-12-05 Yaskawa Electric Corp Electronic component attachment module and electric power conversion apparatus
KR20150001206U (en) * 2013-09-12 2015-03-20 엘에스산전 주식회사 Power converter
CN113497015A (en) * 2020-04-01 2021-10-12 阿特拉斯·科普柯(无锡)压缩机有限公司 Power module

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