JPS62157155U - - Google Patents
Info
- Publication number
- JPS62157155U JPS62157155U JP4398286U JP4398286U JPS62157155U JP S62157155 U JPS62157155 U JP S62157155U JP 4398286 U JP4398286 U JP 4398286U JP 4398286 U JP4398286 U JP 4398286U JP S62157155 U JPS62157155 U JP S62157155U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- lead
- semiconductor device
- same plane
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す基板実装をし
た半導体装置の側面図、第２図ａ，ｂはそれぞれ
従来の半導体装置の側面図、底面図である。
１……リード、２……樹脂、３……放熱板、４
，７，４１，４２……配線導体部、５……基板、
６……隙間。
FIG. 1 is a side view of a semiconductor device mounted on a substrate, showing an embodiment of the present invention, and FIGS. 2a and 2b are a side view and a bottom view, respectively, of a conventional semiconductor device. 1... Lead, 2... Resin, 3... Heat sink, 4
, 7, 41, 42... Wiring conductor portion, 5... Board,
6... Gap.
Claims (1)
放熱面をモールド樹脂面より突出させ、リードフ
オーミングした外部リードのリード側面と放熱面
が同一平面内になるように形成したことを特徴と
する半導体装置。 A semiconductor device equipped with a heat sink, characterized in that the heat sink surface of the heat sink protrudes from the molded resin surface, and the lead side surface of the lead-formed external lead and the heat sink surface are formed in the same plane. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986043982U JPH0419798Y2 (en) | 1986-03-27 | 1986-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986043982U JPH0419798Y2 (en) | 1986-03-27 | 1986-03-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62157155U true JPS62157155U (en) | 1987-10-06 |
| JPH0419798Y2 JPH0419798Y2 (en) | 1992-05-06 |
Family
ID=30861359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986043982U Expired JPH0419798Y2 (en) | 1986-03-27 | 1986-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0419798Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6083249U (en) * | 1983-11-15 | 1985-06-08 | 松下電器産業株式会社 | integrated circuit components |
-
1986
- 1986-03-27 JP JP1986043982U patent/JPH0419798Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6083249U (en) * | 1983-11-15 | 1985-06-08 | 松下電器産業株式会社 | integrated circuit components |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0419798Y2 (en) | 1992-05-06 |