JPS62156882A - Photocoupler - Google Patents
PhotocouplerInfo
- Publication number
- JPS62156882A JPS62156882A JP60297456A JP29745685A JPS62156882A JP S62156882 A JPS62156882 A JP S62156882A JP 60297456 A JP60297456 A JP 60297456A JP 29745685 A JP29745685 A JP 29745685A JP S62156882 A JPS62156882 A JP S62156882A
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting element
- receiving element
- light emitting
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 229920002050 silicone resin Polymers 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 101100282617 Bovine herpesvirus 1.1 (strain Cooper) gC gene Proteins 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ホトカプラに関し、もっと詳しくは同一平面
内に相互に対向して発光素子と受光素子とが配置される
いわゆる同一平面素子搭載型ホトカプラに関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a photocoupler, and more particularly to a so-called coplanar element-mounted photocoupler in which a light emitting element and a light receiving element are arranged facing each other in the same plane.
第７図は、典型的な先行技術の断面図である。FIG. 7 is a typical prior art cross-sectional view.
ホトカプラ１は、赤外線発光ダイオードなどによって実
現される発光素子２と、この発光素子２と同一平面上に
配置されるホ））ランジスタやホトダイオードなどによ
って実現される受光素子３とを含む６発光素子２は、入
力側のリード端子４ａにグイボンドされ、ボンディング
ワイヤ６によって入力側のリード端子（図示せず）に接
続される。受光素子３は、出力側リード端子４ｂにグイ
ボンドされ、ボンディングワイヤ６によって出力側のリ
ード端子（図示せず）に接続される。発光素子２と受光
素子３とは、透光性でかつ電気絶縁性を有するシリコン
Ｉ（脂などから成る透光層７によって雇われ、この透光
層７によって発）１１；素子２と受光素子３とが光学的
に結合し、発光素子２からの光が受光素子３に到達する
光経路が形成される。この透光Ｍ７は、エポキシ０（脂
から成る遮光Ｍ８によって被覆される。この遮光層８に
よって、発光素子２からの光の漏れや、外乱尤の侵入な
どが防がれる。この上うなりｔ成を有するホトカプラ１
は、素子２．３が同一平面−ヒに搭載されているため、
従来の素子対向型に比べ製造工程が簡単で同相信号除去
比が高い利点を有する。The photocoupler 1 includes six light emitting elements 2 including a light emitting element 2 realized by an infrared light emitting diode or the like, and a light receiving element 3 arranged on the same plane as the light emitting element 2 and e)) realized by a transistor, a photodiode, etc. is firmly bonded to the input side lead terminal 4a and connected to the input side lead terminal (not shown) by a bonding wire 6. The light receiving element 3 is firmly bonded to the output side lead terminal 4b and connected to the output side lead terminal (not shown) by a bonding wire 6. The light-emitting element 2 and the light-receiving element 3 are composed of a silicon I which is transparent and electrically insulating (used by a light-transmitting layer 7 made of fat or the like, and emits light from this light-transmitting layer 7); the element 2 and the light-receiving element 3 are optically coupled to form an optical path through which light from the light emitting element 2 reaches the light receiving element 3. This light-transmitting layer M7 is covered with a light-shielding layer M8 made of epoxy 0 (grease). This light-shielding layer 8 prevents light from leaking from the light-emitting element 2 and interference from external disturbances. A photocoupler 1 having
Since elements 2.3 and 3 are mounted on the same plane,
It has the advantage of a simpler manufacturing process and a higher common-mode signal rejection ratio than the conventional element facing type.
発明が解決しようとする問題点
］二元先行技術では、ホトカプラ１の製造時に発光素子
２と受光素子３間を光学的に結合している゛透光に４７
を、第７図示のように遮光層８との界面の沿面距甜Ｅが
長い形状に形成することは実際士困υＦであり、樹脂の
粘度や硬化条件などによって、形状のばらつきが大きい
。そのため、ホトカプラ１の特性として電流伝達比のば
らつきや、遮光層８と透光層７との界面距離のばらつき
に起因して絶縁耐圧のばらつきが生じる。[Problems to be Solved by the Invention] In the binary prior art, when manufacturing the photocoupler 1, the light emitting element 2 and the light receiving element 3 are optically coupled.
It is actually difficult to form the resin into a shape with a long creepage distance E at the interface with the light-shielding layer 8 as shown in FIG. 7, and the shape varies greatly depending on the viscosity of the resin, curing conditions, etc. Therefore, as a characteristic of the photocoupler 1, variations in the current transfer ratio and variations in the interfacial distance between the light-shielding layer 8 and the light-transmitting layer 7 cause variations in the dielectric strength.
本発明の目的は、−１二述の技術的課題を解決し、発光
素子と受光素子とを光学的に結合する透光層の形状を安
定化させて、電流伝達特性の安定化および高絶縁耐圧を
可能にしたホトカプラを提供することである。The purpose of the present invention is to solve the technical problems mentioned in 1-1 and 2, to stabilize the shape of a light-transmitting layer that optically couples a light-emitting element and a light-receiving element, and to stabilize current transmission characteristics and achieve high insulation. An object of the present invention is to provide a photocoupler that can withstand pressure.
問題点を解決するための手段
本発明は、発光素子と、
発光素子と同一平面内で相互に対向して配置される受光
素子と、
透光性Ｉｆ詣から成るケースであって、発光素子および
受光素子を外囲する枠体と、発光素子と受光素子との間
に介在して枠体に設けられ、枠体よりも前記平面から遠
去かる方向に突出した介在片とを含む、そのようなケー
スと、枠体内の発光素子および受光素子とを被覆し、発
光素子からの范を受光素子に導く光経路を形成する透光
性樹脂から成る透光層とを含むことを特徴とするホトカ
プラである。Means for Solving the Problems The present invention is a case comprising: a light-emitting element; a light-receiving element disposed opposite to each other in the same plane as the light-emitting element; Such a method includes a frame surrounding a light receiving element, and an intervening piece provided on the frame interposed between the light emitting element and the light receiving element and protruding in a direction farther from the plane than the frame. and a light-transmitting layer made of a light-transmitting resin that covers a light-emitting element and a light-receiving element in a frame and forms an optical path that guides light from the light-emitting element to the light-receiving element. It is.
作 用
本発明に従えば、発光素子と受光素子とは、枠体と介在
片とを含むケースによって外囲される。Function According to the present invention, the light emitting element and the light receiving element are surrounded by a case including a frame and an intervening piece.
これによって透光層の形状が安定化する。したがって、
光経路の形状の安定化を図ることができ、電流伝達比が
安定する。また発光素子側と受光素子側の遮光層と透光
層との界面距離が長くかつ安定するため、絶縁耐圧の向
上および安定化を図ることができる。This stabilizes the shape of the light-transmitting layer. therefore,
The shape of the optical path can be stabilized, and the current transfer ratio can be stabilized. Further, since the interface distance between the light-shielding layer and the light-transmitting layer on the light-emitting element side and the light-receiving element side is long and stable, it is possible to improve and stabilize the dielectric strength voltage.
実施例
第１図は本発明の一実施例のホトカプラ１０の縦断面図
であり、ｔｐＩ２図は第１図の切断面線■−■から見た
断面図である。このホトカプラ１０は、発光グイオード
などによって実現される発光素子１１と、発光素子１１
と同一平面内に配ｒＲされホトトランノスタなどによっ
て実現される受光素子１２とを含む。発光素子１１は入
力側リード端子１３ａに搭載され、受光素子１２は出力
側リード端子１３ｂに搭載される。この発光素子１１は
、ボンディングワイヤ１４によって入力側リード端子１
４ａに接続される。受光素子１２は、リード端子１４ｂ
にボンディングワイヤ１４によって接続される。Embodiment FIG. 1 is a longitudinal sectional view of a photocoupler 10 according to an embodiment of the present invention, and FIG. This photocoupler 10 includes a light emitting element 11 realized by a light emitting diode or the like, and a light emitting element 11.
and a light-receiving element 12 which is arranged in the same plane as the phototransmitter and is realized by a phototransnoster or the like. The light emitting element 11 is mounted on the input side lead terminal 13a, and the light receiving element 12 is mounted on the output side lead terminal 13b. This light emitting element 11 is connected to the input side lead terminal 1 by a bonding wire 14.
4a. The light receiving element 12 has a lead terminal 14b.
is connected to by a bonding wire 14.
リード端子１３ａ、１３ｂ；１４ａ、１４ｂには、透光
性樹脂からなるケース１５が取付ちれる。このケース１
５は、第３図に示されるように底板１６と、底板１６に
立設され発光素子１１と受光素子１２を外囲する枠体１
７と、枠体１７を仕切る介在片１８とを含む。枠体１７
には、リード端子１３ ａ、 １３ ｂ； １４ ａ、
１４ ｂの一部分が埋設され、これによって枠体１７
がリード端子１３ａ、１３ｂ：１４ａ、１４ｂに支持さ
、れる。介在片１８は、発光素子１１と受光素子１２間
に介在される。この介在片１８は、枠体１７よりもヒ方
に突出して形成される。これによって後述するように界
面距離を大とすることができ、入力側−出力側間の絶縁
耐圧の向上を図ることができる。A case 15 made of translucent resin is attached to the lead terminals 13a, 13b; 14a, 14b. This case 1
Reference numeral 5 denotes a bottom plate 16 and a frame 1 that stands up on the bottom plate 16 and surrounds the light emitting element 11 and the light receiving element 12, as shown in FIG.
7 and an intervening piece 18 that partitions the frame 17. Frame body 17
Lead terminals 13a, 13b; 14a,
A portion of the frame 14b is buried, thereby making the frame 17
are supported by the lead terminals 13a, 13b: 14a, 14b. The intervening piece 18 is interposed between the light emitting element 11 and the light receiving element 12. This intervening piece 18 is formed to protrude further away from the frame body 17. As a result, as will be described later, the interface distance can be increased, and the dielectric strength between the input side and the output side can be improved.
ケース１５内に配置される発光素子１１と受光素子１２
とは、透光Ｗ４２０によって被覆される。Light emitting element 11 and light receiving element 12 arranged in case 15
is covered with transparent W420.
この透光７ｆｉ？ ２０は、たとえばシリコン（ｊ４脂
などから成り、この透光層２０によって発光素子１１と
受光素子１２とが光学的に結合され、発光素子１１から
の尤が受光素子１２に到達する光経路が形成されるにの
透光Ｒ２０は、エポキシ樹脂などから成る遮光層２１に
よって被覆される。この遮光層２１によって、外乱尤が
遮断され、外部からの湿気などの侵入を防ぐことができ
る。This transparent 7fi? 20 is made of, for example, silicon (J4 resin), and the light-emitting element 11 and the light-receiving element 12 are optically coupled by this light-transmitting layer 20, forming an optical path through which the light from the light-emitting element 11 reaches the light-receiving element 12. The light-transmitting layer R20 is covered with a light-shielding layer 21 made of epoxy resin or the like.This light-shielding layer 21 blocks disturbances and prevents moisture from entering from the outside.
このような構成を有するホトカプラ１０の？ｉ！！遣工
程全工程に示す。第４図（１）で示すように、ケース１
５は、予めリード端子１３’ａ、１３１＋、１４ａ實１
４ｂに取付けられている。このようなケース１５内で、
入力側リード端子１３ａに発光素子１１をグイボンドし
、この発光素子１１をボンディングワイヤ１４によって
入力側リード端子１４ａに接続する。さらに受光素子１
２を出力側リード端子１３Ｉ）にグイボンドし、この受
光素子１２をボンディングワイヤ１４によって出力側リ
ード端Ｔ１４ｂに接続する６次に、第４図（２）に示さ
れるように枠体１６内に透光性樹脂を注入し、発光素子
１１と受光素子１２とを透光Ｍ４２０によってそれぞれ
被覆する。このとき注入される透光性樹脂は枠体１７お
よび介在片１８によって支持されるため、透′Ｊｔ、層
２０の形状が安定化する６次に透光層２０を遮光層２１
によって被覆する。こうして第１図示のホトカプラ１０
が形成される。What about the photocoupler 10 having such a configuration? i! ! This is shown in the entire process. As shown in Figure 4 (1), case 1
5 is the lead terminal 13'a, 131+, 14a fact 1
It is attached to 4b. In such case 15,
A light emitting element 11 is firmly bonded to the input side lead terminal 13a, and this light emitting element 11 is connected to the input side lead terminal 14a by a bonding wire 14. Furthermore, the light receiving element 1
2 to the output side lead terminal 13I), and connect this light receiving element 12 to the output side lead end T14b by the bonding wire 14.6 Next, as shown in FIG. A photoresist is injected, and the light emitting element 11 and the light receiving element 12 are each coated with transparent M420. Since the transparent resin injected at this time is supported by the frame 17 and the intervening piece 18, the shape of the transparent layer 20 is stabilized.
Cover with. In this way, the photocoupler 10 shown in the first diagram
is formed.
このようにして形成されたホトカプラ１０では、介在片
１８が枠体１７よりも一ヒ方に突出しているため、界面
距離を大きくとることができ、したがって、入力側−出
力側間の絶縁耐圧の向１−．を図ることができる。In the photocoupler 10 formed in this manner, since the intervening piece 18 protrudes to one side from the frame body 17, the interface distance can be increased, and therefore the dielectric strength voltage between the input side and the output side can be increased. Direction 1-. can be achieved.
第５図は他の実施例のケース１５ａの斜視図である。こ
の実施例は、前述の実施例に類似し、対応する部分には
同一の参照符を付す。注目すべきはこの実施例では、枠
体１７の四隅にリード＆ａｌ子１３ａ、１３１）：１４
ａ、１４ｂが嵌り込むことができるように、切欠き３０
ａ、３０ｈ、３０ｃ、３０ｄが形成される。FIG. 5 is a perspective view of a case 15a of another embodiment. This embodiment is similar to the previous embodiment, and corresponding parts are provided with the same reference numerals. What should be noted is that in this embodiment, the four corners of the frame body 17 are provided with leads & alcoves 13a, 131): 14
The notch 30 is formed so that the parts a and 14b can fit into it.
a, 30h, 30c, and 30d are formed.
第６図は、ケース１５ａを用いてホトカプラ１０を製造
する場合の製造工程を説明するための図である。まず第
６図（１）で示すように発光素子１１を入力側リード端
子１３ｎにグイボンドし、受光素子１２を出力側リード
端子１３１１にグイボンドする。次にボンディングワイ
ヤ１４によって発光素子１１を入力側リード端子１４ａ
に接続し、受光素子１２を出力側リード６１子１４ｂに
ボンディングワイヤ１４によって接続する。次に第６図
（２）で示すようにケース１５ａをリード端子１３ａ。FIG. 6 is a diagram for explaining the manufacturing process when manufacturing the photocoupler 10 using the case 15a. First, as shown in FIG. 6(1), the light emitting element 11 is firmly bonded to the input side lead terminal 13n, and the light receiving element 12 is firmly bonded to the output side lead terminal 1311. Next, the light emitting element 11 is connected to the input side lead terminal 14a using the bonding wire 14.
The light receiving element 12 is connected to the output side lead 61 element 14b by the bonding wire 14. Next, as shown in FIG. 6(2), the case 15a is connected to the lead terminal 13a.
１３ｂ：１４ａ＋１４ｂの下方から取付け、透光性樹脂
を注入し、発光素子１１および受光素子１２を透光Ｒ２
０によって被覆する。その後、前述の製造方法と同様に
透光ＮＩＪ２０を遮光層２１によってｖｉ、覆し、第１
図に示すホトカプラ１０が形成される。13b: Attach from below 14a+14b, inject translucent resin, and connect light emitting element 11 and light receiving element 12 to translucent R2.
Covered by 0. Thereafter, similarly to the manufacturing method described above, the light-transmitting NIJ 20 is covered with a light-shielding layer 21, and the first
A photocoupler 10 shown in the figure is formed.
ｆｊＳＡ図に示す製造方法では、ケース１５は予めリー
ド端子１３ａ、１３ｂ；１４ａ、１４ｂに取付けられて
いるため、発光素子１１および受光素子１２をリード端
子１３ａ、１３ｂ：１４ａ、１４ｂにグイボンドする際
、またボンディングワイヤ１４によって発光素子１１お
よび受光素子１２をボンディングする際に、ケース１５
が熱変形する恐れがあり、これを防ぐためにグイボンド
の銀（Δｇ）ペーストの硬化や、ボンディング時の温度
を考慮することが必要となる。一方、第６図に示される
製造方法では、ケース１５ａは、発光素子１１および受
光素子１２のグイボンドおよびボンディング後に取付け
られるため、熱の考慮は不要であり、第４図示の製造方
法に比べ作業性を向上することができる。In the manufacturing method shown in FIG. Further, when bonding the light emitting element 11 and the light receiving element 12 with the bonding wire 14, the case 15
In order to prevent this, it is necessary to consider the hardening of Guibond's silver (Δg) paste and the temperature during bonding. On the other hand, in the manufacturing method shown in FIG. 6, the case 15a is attached after bonding and bonding of the light emitting element 11 and the light receiving element 12, so there is no need to consider heat, and the work is easier than in the manufacturing method shown in FIG. can be improved.
効 果
以上のように本発明によれば、 発光素子と受光素子と
を光学的に結合する透光層の形状を安定化させることが
でき、これによって電流伝達特性の安定化を図ることが
できる６また発光素子側と受光素子側の透光層と、遮光
層の界面距離を長くかつ安定化させることができ、これ
によって絶縁耐圧の向上および安定化ならびに同相信号
除去比の向上を図ることができる。Effects As described above, according to the present invention, the shape of the light-transmitting layer that optically couples the light-emitting element and the light-receiving element can be stabilized, thereby stabilizing the current transfer characteristics. 6. Also, the interface distance between the light-transmitting layer and the light-shielding layer on the light-emitting element side and the light-receiving element side can be lengthened and stabilized, thereby improving and stabilizing the dielectric strength voltage and improving the common-mode signal rejection ratio. I can do it.
第１図は本発明の一実施例のホトカプラ１０の縦断面図
、第２図は第１図の切断面線■−■から見た横断面図、
第３図はケース１５付近の斜視図、第４図はホトカプラ
１０の製３ｆｆ工程を説明するための図、第５図は１１
μの実施例のケース１５ａ付近の斜視図、第６図はケー
ス１５ａを用いた場合のホトカプラ１０の製造工程を説
明するだめの図、ｔｊＳ７図は先行技術の断面図である
。
１０・・・ホトカプラ、１１・・・発光素子、１２・・
・受光素子、１３ａ、１３ｂ；１．４ａ、１４ｂ−リー
ド端子、１４・・・ボンディングワイヤ、１５．１５ａ
・・・ケース、１６・・・底板、１７・・・枠体、１８
・・・介在片、２０・・・透ｆ、層、２１・・・遮光層
代理人 井理士 西教 圭一部
図面の浄で（内容に変更なし）
第２図
第３図
第４図
第６図
手続補正書（方式）
％式％
２、発明の名称
ホトカプラ
３、補正をする者
事件との関係 出願人
住所 大阪市阿倍野区長池町２２番２２号名称 （５０
４）シャープ株式会社
代表者 佐 伯 旭
４、代理人
住 所 大阪市西区西本町１丁［？１３番３８号 新興
績ビル国装置ＥＸ ０５２５−５９８５ ＩＮ工へ、
ＰＴＪ国際ＦＡＸ ＧＩＩＩ＆Ｇｎ （０６）５３８−
０２４７５、補正命令の日付
６ 、補正の対象
！Ｖ書および図面
７、補正の内容
願書および図面の浄書（内容に変更なし）。
以 上FIG. 1 is a longitudinal cross-sectional view of a photocoupler 10 according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken from the section line ■-■ in FIG.
3 is a perspective view of the vicinity of the case 15, FIG. 4 is a diagram for explaining the 3FF manufacturing process of the photocoupler 10, and FIG. 5 is a perspective view of the vicinity of the case 15.
FIG. 6 is a perspective view of the vicinity of the case 15a of the μ embodiment, FIG. 6 is a diagram for explaining the manufacturing process of the photocoupler 10 when the case 15a is used, and FIG. tjS7 is a sectional view of the prior art. 10... Photocoupler, 11... Light emitting element, 12...
・Light receiving element, 13a, 13b; 1.4a, 14b-Lead terminal, 14... bonding wire, 15.15a
...Case, 16...Bottom plate, 17...Frame, 18
...Intervening piece, 20...Transparent f, layer, 21...Light-shielding layer agent Rishi I, Kei Saikyo Some of the drawings are shown (no changes to the contents) Fig. 2 Fig. 3 Fig. 4 Fig. 6 Drawing procedure amendment (method) % formula % 2. Name of the invention Photocoupler 3. Relationship with the person making the amendment Applicant address 22-22 Nagaike-cho, Abeno-ku, Osaka Name (50)
4) Sharp Corporation Representative Saeki Asahi 4, Agent address 1-chome Nishihonmachi, Nishi-ku, Osaka [? No. 13-38 New Building Country Equipment EX 0525-5985 To IN Engineering,
PTJ International FAX GIII&Gn (06)538-
02475, Date of amendment order 6, Subject of amendment! Book V and Drawing 7, the application for amendment and the engraving of the drawings (no changes to the contents). that's all
Claims (1)
素子と、 透光性樹脂から成るケースであって、 発光素子および受光素子を外囲する枠体と、発光素子と
受光素子との間に介在して枠体に設けられ、枠体よりも
前記平面から遠去かる方向に突出した介在片とを含む、
そのようなケースと、枠体内の発光素子および受光素子
とを被覆し、発光素子からの光を受光素子に導く光経路
を形成する透光性樹脂から成る透光層とを含むことを特
徴とするホトカプラ。[Claims] A case consisting of a light-emitting element, a light-receiving element disposed opposite to each other in the same plane as the light-emitting element, and a frame surrounding the light-emitting element and the light-receiving element. an intervening piece interposed between the light emitting element and the light receiving element, provided on the frame body, and protruding in a direction farther from the plane than the frame body;
It is characterized by including such a case and a light-transmitting layer made of a light-transmitting resin that covers the light-emitting element and the light-receiving element in the frame and forms an optical path for guiding light from the light-emitting element to the light-receiving element. A photocoupler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60297456A JPS62156882A (en) | 1985-12-28 | 1985-12-28 | Photocoupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60297456A JPS62156882A (en) | 1985-12-28 | 1985-12-28 | Photocoupler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62156882A true JPS62156882A (en) | 1987-07-11 |
Family
ID=17846742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60297456A Pending JPS62156882A (en) | 1985-12-28 | 1985-12-28 | Photocoupler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62156882A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5233208A (en) * | 1990-03-23 | 1993-08-03 | U.S. Philips Corp. | Photocoupler surrounded by transparent and reflective resins in a preformed pin housing |
| US5291038A (en) * | 1990-12-19 | 1994-03-01 | Sharp Kabushiki Kaisha | Reflective type photointerrupter |
| US7009166B2 (en) * | 2002-03-26 | 2006-03-07 | Sharp Kabushiki Kaisha | Photocoupler, method for producing the same, and electronic device equipped with the photocoupler |
| JP2010524260A (en) * | 2007-04-13 | 2010-07-15 | フェアチャイルド セミコンダクター コーポレイション | Optical coupler package |
-
1985
- 1985-12-28 JP JP60297456A patent/JPS62156882A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5233208A (en) * | 1990-03-23 | 1993-08-03 | U.S. Philips Corp. | Photocoupler surrounded by transparent and reflective resins in a preformed pin housing |
| US5291038A (en) * | 1990-12-19 | 1994-03-01 | Sharp Kabushiki Kaisha | Reflective type photointerrupter |
| US7009166B2 (en) * | 2002-03-26 | 2006-03-07 | Sharp Kabushiki Kaisha | Photocoupler, method for producing the same, and electronic device equipped with the photocoupler |
| JP2010524260A (en) * | 2007-04-13 | 2010-07-15 | フェアチャイルド セミコンダクター コーポレイション | Optical coupler package |
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