JPS62154700A - Parts mounting - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for mounting electronic components, and more particularly to a method for mounting terminals of flat electronic components on a printed circuit board.

2. Description of the Related Art Conventionally, flat electronic components are generally mounted as shown in FIG. 4 by placing a flat electronic component 2 on an intermediate positioning unit 1, positioning it by chucking I@3, and then printing It was transferred to a predetermined position rf15 on the board 4, and mounting was performed. However, when the level of high-density mounting of electronic components increases and the pitch between the lead terminals 6 becomes narrower, electronic components may not be mounted using the conventional mounting method using the chucking mechanism 3. are becoming more common.

Therefore, as a mounting method for this type of electronic component, as shown in FIG. Many were offered. That is, the output of the mounted component recognition unit 8 is processed to detect the position information of the flat electronic component 2, and the output of the pattern recognition unit 9 is processed to detect the position information of the flat electronic component 2.
Detects the position information, corrects the relative positional deviation, and implements it.

Problems to be Solved by the Invention However, in the conventional component mounting method described above, the intermediate positioning unit 1 or the mounted component recognition section 8 is required between the component supply section and the component mounting section, which makes the device The overall size is large. Also, the combination Vi degree is also high.
There have been problems in that it is difficult to increase the tJ degree and it is difficult to increase the speed of component mounting.

The present invention solves the above-mentioned conventional problems.
The purpose is to provide a simple and high-speed component mounting method.

Means for Solving the Problems In order to solve the above problems, the component mounting method of the present invention includes:
a plurality of pairs of tin arranged on the same plane with predetermined adjacent spacing;
When positioning an electronic component having a terminal so as to face a predetermined position corresponding to the terminal on the printed circuit board, at least a part of the surface of the electronic component held by the holding means and a surface of the predetermined position on the printed circuit board. layer imaging means focused on both sides of at least a portion of the image plane and capturing the image within the same field of view, and processing the output of the image stage f to determine the deviation between the electronic component and the predetermined position on the printed circuit board. A signal processing means for detecting the difference in position and a stop means for calculating a positional deviation correction value from the detected positional deviation are used to determine the positional deviation correction value before mounting the terminal on the printed circuit board. Accordingly, the relative positional deviation between the electronic component held by the holding means and the predetermined position on the printed circuit board is corrected and mounted.

In addition, as a means for correcting the relative positional deviation between the electronic component held by the holding means and the printed circuit board using the positional deviation correction value, for example, as a positional deviation correction value, If the holding means includes an angular deviation correction value indicating an angular deviation in , the holding means may include means for rotating the electronic component within the plane by the angular deviation correction value. In addition, when the positional deviation correction value includes positional deviation correction values in the X direction and Y direction in the reference XY plane including the printed circuit board, the holding means is
It is possible to include a means for moving by the direction deviation correction value.

According to the method described above, the electronic components placed and transferred are directly placed near a predetermined position on the printed circuit board without requiring a component positioning mechanism or a position recognition unit during the journey from the component supply section to the component mounting section. By correcting the positional deviation and implementing it,
High-precision component mounting work can be performed at high speed using a component mounting device with a simple configuration.

EXAMPLE An example of the present invention will be described below with reference to FIGS. 1 to 3.

FIG. 1 is an external perspective view of the main parts of a component mounting apparatus used in a component mounting method according to an embodiment of the present invention. The operator head 13 is disposed vertically below the layer imaging means 11, and the holding means 12, which holds and transfers the flat type electronic component 14 from the component supply section, is placed at a predetermined position 16 on the printed U board 15. It reaches vertically upward and then descends.

FIG. 2 is an explanatory diagram of a relative positional deviation correction situation in a component mounting method according to an embodiment of the present invention, in which the lowering of the holding means 12 is
The image carrier 11 stops when the distance shown in FIG. , capture image information as shown in FIG. The image information output from the image carrier 11 passes through a signal processing means and an itching means (not shown), and then is transferred to a plurality of pairs of lead terminals 1 arranged on the same plane at predetermined adjacent intervals.
The binary image information of land 15a and the 2fa image information of land 15a are selected, positional deviation is detected, and relative positional deviation correction values X and Y are output.

If it is not possible to mount the component with high precision using the above output, the angular deviation correction value θ is also output.

By moving the holding means 12 by the positional deviation correction value X, Y or further by θ, the flat electronic component 1 is moved to face a predetermined position 16 on the printed circuit board 15.
4 can be implemented at high speed and with high precision.

As described above, according to this embodiment, by using a single image conveying means 11, the cost of the apparatus is lower than that of a conventional apparatus having the same function. Furthermore, since positioning is performed using a single imaging means 11, the combination errors of conventional methods can be ignored, and since it can be implemented with a single correction operation using a single device, the required implementation time is shortened and speeding up is possible. In addition, the device occupies a smaller area than conventional devices with equivalent functions.In addition, post-installation inspection, which was difficult with conventional methods, can be easily accomplished.

Effects of the Invention As described above, according to the present invention, high-speed mounting of a flat electronic component having multiple pairs of lead terminals arranged at minute pitch intervals, which was the most difficult point in the conventional method, is facilitated, and mounting is facilitated. Accuracy can be improved, and the entire component mounting apparatus can be downsized.

[Brief explanation of drawings]

FIG. 1 is an external perspective view of the main parts of a component mounting apparatus used in a component mounting method according to an embodiment of the present invention, FIG. FIGS. 4 and 5 are explanatory diagrams of images captured by the working means, respectively, and are explanatory diagrams of conventional component mounting methods. 11... Imaging means, 12... Holding means, 13...
Component suction head, 14...Flat type electronic component, 14
a... Lead terminal, 15... Printed circuit board, 15a
... Land, 16... Predetermined position agent Yoshihiro Moriki Fig. 1 16... -1 Agency C1, I L, 1 Fig. 2 %/=t... Lead Kangenabai... Land Figure 3 Figure 4

Claims (1)

[Claims] 1. When positioning an electronic component having a plurality of pairs of terminals arranged on the same plane at predetermined adjacent intervals so as to face predetermined positions corresponding to the terminals on the printed circuit board, the electronic component held by the holding means an imaging means that is focused on both sides of at least a part of the surface of the electronic component and at least a part of the surface of the predetermined position on the printed circuit board and takes images within the same field of view; The terminal is placed on the printed circuit board using a signal processing means that detects the amount of deviation between the component and the predetermined position on the printed circuit board, and a calculation means that calculates a position deviation correction value from the detected position deviation. A component mounting method in which, prior to mounting, a relative positional deviation between an electronic component held by the holding means and the predetermined position on the printed circuit board is corrected and mounted using the positional deviation correction value.