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JPS62150685A - Manufacture of panel heater - Google Patents

Manufacture of panel heater

Info

Publication number
JPS62150685A
JPS62150685A JP29536485A JP29536485A JPS62150685A JP S62150685 A JPS62150685 A JP S62150685A JP 29536485 A JP29536485 A JP 29536485A JP 29536485 A JP29536485 A JP 29536485A JP S62150685 A JPS62150685 A JP S62150685A
Authority
JP
Japan
Prior art keywords
heating element
planar heating
base material
slip
conductive powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29536485A
Other languages
Japanese (ja)
Inventor
義孝 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TAIYO KINZOKU KAGAKU KOGYO KK
Original Assignee
TAIYO KINZOKU KAGAKU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TAIYO KINZOKU KAGAKU KOGYO KK filed Critical TAIYO KINZOKU KAGAKU KOGYO KK
Priority to JP29536485A priority Critical patent/JPS62150685A/en
Publication of JPS62150685A publication Critical patent/JPS62150685A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、金属やセラミック等の母材の表面に面状発熱
体を焼付けする面状発熱体の形成方法に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method of forming a sheet heating element by baking the sheet heating element onto the surface of a base material such as metal or ceramic.

〔従来の技術〕[Conventional technology]

従来より多く利用されている面状発熱体は、細いニクロ
ム線等、金^材を面状に形成し、この両面を塩化ビニー
ルなど絶縁性シートで挾持されfc#Jのが、各種暖房
機器や電熱機器に利用されている。
Planar heating elements, which have been widely used in the past, are made by forming a metal material such as thin nichrome wire into a planar shape, and sandwiching both sides of the sheet with an insulating sheet such as vinyl chloride. Used in electric heating equipment.

しかしながら、このような面状発熱体は、単位面積当シ
の抵抗値を自白に設計することができず、ニクロム線の
断線の問題もある上、液中など湿環境下における絶縁不
良の問題など、耐久性に乏しい欠点がある。また機器本
体:C組立てる場合、面状発熱体を別個に作成して、こ
れを本体に挾持して組立てなければなうないので作業性
も悪い。
However, such planar heating elements cannot be designed with the resistance value per unit area taken into account, and there are problems such as disconnection of the nichrome wire, and problems such as poor insulation in wet environments such as submerged in liquid. , it has the disadvantage of poor durability. Furthermore, when assembling the main body of the device, it is necessary to separately prepare a planar heating element and then assemble it by holding it in the main body, which results in poor workability.

このため、ニクロム線に代シ、発熱体としてカーボンコ
ーティング層を用いた面状発熱体も開発されている。こ
れは、電極を取付けたカーボンコーティング層の表面に
塩化ビニールシートやセラミックを取付けて表面絶縁し
ている。
For this reason, a planar heating element using a carbon coating layer as a heating element has been developed instead of a nichrome wire. This involves attaching a vinyl chloride sheet or ceramic to the surface of the carbon coating layer on which the electrodes are attached to insulate the surface.

しかしながら、積層構造であるため、絶縁層とカーボン
コーティング層との密着性、水密性が確実でなく、特に
セラミックを溶射して絶縁層を形成したものは、表面が
多孔質であるので湿環境下で使用することができない。
However, because of the laminated structure, the adhesion and watertightness between the insulating layer and the carbon coating layer are not reliable.In particular, the insulating layer formed by thermal spraying ceramic has a porous surface, so it cannot be used in a humid environment. cannot be used in

また従来の面状発熱体は、形状が平板状であるため、複
雑な曲面に取付けることができず、組込まれる機器も限
定されてしまう問題があっ友。
Furthermore, because conventional planar heating elements have a flat shape, they cannot be installed on complex curved surfaces, and the devices they can be incorporated into are also limited.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

本発明は、かかる従来の問題点に鑑みなされたもので、
取付は位置や形状、抵抗値の設定が容易である上、絶縁
性に優れ、液中でも使用でき、耐久性に優れている上、
機器と一体に形成するので、製造が容易な面状発熱体の
形成方法を提供するものである。
The present invention was made in view of such conventional problems,
In addition to being easy to install, setting the position, shape, and resistance value, it has excellent insulation, can be used in liquids, and has excellent durability.
The present invention provides a method for forming a planar heating element that is easy to manufacture because it is formed integrally with a device.

〔問題点を解決するための手段〕[Means for solving problems]

以下、本発明方法を工程に従って詳細に説明する。 Hereinafter, the method of the present invention will be explained in detail according to the steps.

先ず、母材としては、例えばステンレス会合類、アルミ
ニウム合金類、あるいはホーロ用鋼板等の金属、または
陶磁器、ガラス、セメント耐火物、ファインセラミック
ス等のセラミックが用いられ、これら母材は板状に限ら
ず、容器状など何れの形状のものでも良い。
First, as the base material, metals such as stainless steel aggregates, aluminum alloys, or steel plates for hollow holes, or ceramics such as ceramics, glass, cement refractories, and fine ceramics are used, and these base materials are limited to plate shapes. However, it may be of any shape, such as a container shape.

また母材として金属を用いる場合には、予め絶縁層を表
面に形成する必要がある。この場合、下地絶縁層との密
着性を良くするため、ニッケルやコバルト、マンガン等
を表面に付着させてから、この上に下地絶縁/#(グラ
ンドコート)を形成した後、この上KN面絶縁層(カバ
ーコート)を形成すると良い。これら絶縁層はガラスフ
リットとクレー(粘土)を主成分とするスリップ〔釉薬
)を用い、金属母材の表面に塗布して乾燥させた後、母
材金属よシ低い融点で焼成する。
Further, when using metal as the base material, it is necessary to form an insulating layer on the surface in advance. In this case, in order to improve the adhesion with the base insulating layer, nickel, cobalt, manganese, etc. are attached to the surface, a base insulation/# (ground coat) is formed on this, and then KN surface insulation is formed on this. It is best to form a layer (cover coat). These insulating layers are made using a slip (glaze) mainly composed of glass frit and clay, which is applied to the surface of the metal base material, dried, and then fired at a melting point lower than that of the base metal.

なお、母材がセラミックの場合には、電気絶縁性がある
ので、特に表面に絶縁層を形成しなくても良い。
Note that when the base material is ceramic, it has electrical insulation properties, so there is no particular need to form an insulating layer on the surface.

次に、母材の表面に、面状発熱体となる発熱体スリップ
(混合物)を回路パターンに形成謁。
Next, a heating element slip (mixture) that will become a planar heating element is formed into a circuit pattern on the surface of the base material.

この発熱体スリップとしては、導電性粉末5〜60重量
%、残部がガラススリットからなる混合物を用いる。
As this heating element slip, a mixture consisting of 5 to 60% by weight of conductive powder and the remainder glass slits is used.

前記導電性粉末としては、例えば黒鉛、チタン、ジルコ
ニウム、チタン酸バリウムの粉末の何れか1種以上を単
独、または混合して用いる。
As the conductive powder, for example, one or more of graphite, titanium, zirconium, and barium titanate powders may be used alone or in combination.

黒鉛は安価であるが多量に用いると焼付けした場合のガ
ラスエナメル質との密着性が悪くなもまたチタンは、ガ
ラスエナメル質との密着性に優れているが、高価である
ので、黒鉛と混合して用いると経済的である。
Graphite is cheap, but if used in large quantities it has poor adhesion to glass enamel.Also, titanium has excellent adhesion to glass enamel, but is expensive, so it cannot be mixed with graphite. It is economical to use it.

また導電性粉末の混合物を上記の範囲に限定したのは、
5Nk%未満では、粉末同志の結合が悪く、十分な発熱
量が得られず、また6o重it%を越えて多量に添加す
ると、ガラスエナメル質の絶縁が低下する上、母材表面
から剥離し易くなるからである。なお、黒鉛とチタンを
用いた場合の望ましい範囲は黒鉛粉末2〜40重スフリ
ットが最も効果的である。
In addition, the reason why the conductive powder mixture is limited to the above range is that
If it is less than 5Nk%, the bond between the powders will be poor and sufficient calorific value will not be obtained.If it is added in a large amount exceeding 6Owt%, the insulation of the glass enamel will deteriorate and it will peel off from the surface of the base material. This is because it becomes easier. Note that when using graphite and titanium, the most effective range is 2 to 40-weight graphite powder.

なお混合する導電性粉末の粒度は150メツシュ以上、
特に300〜500メツシユが好ましく、粒度が大きい
と母材金II4盾に接触して、絶縁不良を生ずることが
ある。
The particle size of the conductive powder to be mixed is 150 mesh or more,
In particular, a mesh size of 300 to 500 is preferable; if the particle size is large, it may come into contact with the base metal gold II4 shield, resulting in poor insulation.

また上記組成の発熱体スリップを母材表面に回路パター
ンを画いて形成する方法としては、転写紙などの転写印
刷の他、スクリーン印刷、スプレー噴射等によシ、所望
厚さで所望の回w?<ターンを形成する。゛ 例えば転写紙による場合は、例えば第1図に示すように
、紙/の表面に1発熱体スリップλで回路パターン3を
形成し:た転写紙りを作成する。これを第2図に示すよ
うに1表面に絶縁層、ta、jbを形成した金属母材乙
の上に貼付し、電極端子7.7を取付ける。
In addition, methods for forming a heating element slip having the above composition by drawing a circuit pattern on the surface of the base material include transfer printing using transfer paper, screen printing, spray jetting, etc. ? <Form a turn. For example, in the case of using transfer paper, a circuit pattern 3 is formed on the surface of the paper with one heating element slip λ, as shown in FIG. 1, to create a transfer paper. As shown in FIG. 2, this is pasted onto a metal base material B having an insulating layer, ta, and jb formed on one surface, and an electrode terminal 7.7 is attached.

この後、加熱炉内に入れて母材融点以下の温度で焼付け
を行うと、面状発熱体が形成される。
Thereafter, the sheet heating element is formed by placing it in a heating furnace and baking it at a temperature below the melting point of the base material.

この面状発熱体gは、第3図に示すように、例チタン粉
末10がガラスエナメル層//の表面側に埋設した状態
で、母材金属乙の表面に絶縁層5a、5bを介して形成
された状態となる。
As shown in FIG. 3, this planar heating element g is constructed by placing titanium powder 10 embedded on the surface side of the glass enamel layer // on the surface of the base metal B through insulating layers 5a and 5b. It will be in a formed state.

従って、散在する黒鉛粉末9やチタン粉末10同志の接
触状態によシ、所定の抵抗が得られ、電極端子7.7か
ら通電することにより、発熱することができる。
Therefore, depending on the contact state of the scattered graphite powder 9 and titanium powder 10, a predetermined resistance can be obtained, and heat can be generated by applying electricity from the electrode terminals 7.7.

なお、導電性粉末として、チタン、ジルコニウムを用い
た場合、これらは酸化雰囲気中で焼付けして酸化させな
いと抵抗体とならないので、焼付は温度や時間を最適条
件に設定する必要があるが、予め酸化チタンや、酸化ジ
ルコニウムを用いることによシ焼付温度を低くでき、特
に母材金属が低融点金属の場合に好適である。
Note that when titanium or zirconium is used as conductive powder, it will not become a resistor unless it is baked in an oxidizing atmosphere and oxidized, so it is necessary to set the baking temperature and time to the optimal conditions, but The baking temperature can be lowered by using titanium oxide or zirconium oxide, and this is particularly suitable when the base metal is a low melting point metal.

このように、発熱体スリップコで所望の回路パターン3
を形成した転写紙グを用いて、金属母材乙の表面に面状
発熱体gを形成する方法は、量産性や抵抗値の均一性に
優れている上、母材が曲面状をなす容器等にも広く形成
することができる。
In this way, the desired circuit pattern 3 is created using the heating element slipco.
The method of forming the planar heating element g on the surface of the metal base material B using the transfer paper g formed with the metal base material B is superior in mass production and uniformity of resistance value, and is suitable for containers where the base material has a curved shape. etc., it can be widely formed.

なお、スクリーン印刷による方法は、母材が平板状のも
のに限ら、れるが、抵抗値(発熱量)の調整が容易であ
る。また適当なマスクを当てて発熱体スリップをスプレ
ー噴射して1路パターンを形成する方法は、大型のもの
や少量生産する場合に好適な方法である。
Note that the screen printing method is limited to cases where the base material is flat, but it is easy to adjust the resistance value (heat amount). Furthermore, the method of forming a one-way pattern by spraying the heating element slip while applying an appropriate mask is a suitable method for large-scale products or small-volume production.

また面状発熱体の端子部は、板状に限らず、例えば細線
をより合せた芯線/2を扇状にほぐして第4図に示すよ
うにパラしたものや、第5図に示すようにパンチングメ
タルのもの、あるいは第6図に示すように網状のものな
ど、面状発熱体gとの接触面積が広く採れるものを用い
ると良い。
Furthermore, the terminals of the planar heating element are not limited to plate shapes; for example, the terminals may be formed by unraveling a core wire/2 made of twisted thin wires into a fan shape as shown in Figure 4, or by punching as shown in Figure 5. It is preferable to use a material that has a wide contact area with the planar heating element g, such as a metal material or a net-like material as shown in FIG. 6.

〔実施例〕〔Example〕

以下、本発明の実施例について説明する。 Examples of the present invention will be described below.

縦横200mm、厚さ0.8 romの正方形状をなす
ホーロー用鋼板を、常法に従ってアルカリ洗浄を行って
鋼板表面に付着している油分を除去した後、水洗した。
A square steel plate for enamel having a length and width of 200 mm and a thickness of 0.8 ROM was subjected to alkaline cleaning according to a conventional method to remove oil adhering to the surface of the steel plate, and then washed with water.

この後、15%硫酸水浴液(温度70C)に5分間浸漬
し、この後水洗−更に常法に従ってニッケルフラッシュ
を行って水洗し、中和後、乾燥して前処理を行う。
After that, it is immersed in a 15% sulfuric acid water bath solution (temperature 70C) for 5 minutes, then washed with water, followed by a nickel flash according to a conventional method, washed with water, neutralized, and dried for pretreatment.

次に、グランドスリップ(下−#J)を鋼板の表面にス
プレー塗布して、乾燥後、820Cで5分間焼成を行っ
て、下地絶縁層(グランドコート)を形成する。
Next, ground slip (lower #J) is spray applied to the surface of the steel plate, and after drying, baking is performed at 820C for 5 minutes to form a base insulating layer (ground coat).

更に、この表面にIC用スリップ(上6)をスプレー塗
布して乾燥させた後、820cで4分間焼成を行って、
表面艶RN(カバーコート)を形成する。
Furthermore, after spraying and drying the IC slip (top 6) on this surface, baking was performed at 820c for 4 minutes.
Forms a surface gloss RN (cover coat).

なお、この場合用いたグランドスリップ(下軸)とIC
用スリップ(上知)の組成(寸次の通電である。
In addition, the ground slip (lower shaft) and IC used in this case
Composition of slip (Koichi)

グランドスリップ フリット 100重量部クレー  
  7 〃 含水砂   0.5〃 亜硝酸ソーダ  0.2〃 水        50  〃  。
Ground Slip Frit 100 parts by weight clay
7 Water-containing sand 0.5 Sodium nitrite 0.2 Water 50.

IC用スリップ   フリット 100重fiクレー 
   6 、 塩化カリウム 0.2重量部 水        45  〃 また、これとは別に、第1図に示すように、黒鉛5重量
%、チタン粉末15重量%、残部フリットからなる発熱
体スリップコを、紙/の上に印刷して回路パターン3を
形成した転写紙グを作成しておく。
Slip frit for IC 100 heavy fi clay
6. Potassium chloride 0.2 parts by weight Water 45 Separately, as shown in FIG. A transfer paper sheet on which the circuit pattern 3 is printed is prepared.

この転写紙ヶを第2図に示すように、絶縁層&a、&b
を形成したホーロー用鋼板(母材6)の上に貼布し、端
子7.7を取付けて、ここに発熱体スリップコを塗布し
て密着させ、端子7の酸化防止のためガラスフリットを
吹き付けて乾燥させた後、820Cで3.5分間焼成し
、面状発熱体8を焼付けた。
As shown in Figure 2, this transfer paper is coated with insulating layers
Terminals 7 and 7 are attached to the enamel steel plate (base material 6) on which the terminals 7 and 7 have been formed, and a heating element slipco is applied thereto to make them adhere tightly, and glass frit is sprayed to prevent oxidation of the terminals 7. After drying, the sheet heating element 8 was baked at 820C for 3.5 minutes.

このようにして得られた面状発熱体gの抵抗は50オー
ムであり、更に電気用品取締法試験に基づく試験の結果
は全く異常力でなかった。またこの面状発熱体gを水中
に浸漬して発熱試験を行ったところ、漏電はなく、水を
加熱することができた。
The resistance of the planar heating element g thus obtained was 50 ohms, and the test results based on the Electrical Appliance and Material Control Law showed no abnormal force at all. Further, when a heat generation test was conducted by immersing this planar heating element g in water, there was no electrical leakage and water could be heated.

〔発明の効果〕〔Effect of the invention〕

以上説明した如く、本発明に係る面状発熱体の形成方法
によれば、発熱体を形成する機器の位置や形状、並に抵
抗値の設定が容易である上発熱体粉末がガラスエナメル
層に埋設され、表面がガラスで被覆されているので、絶
縁性に優れ、液中など湿瑞境下でも使用でき、耐久性に
優れている。更に本発明は、機器の表面に一体に焼付は
形成するので、製造が容易であり、化学機器、食品製造
機器や台所用具などに発熱体を形成できる他、床や壁の
暖房、鏡のくもり止め、自動車のリヤウィンドのくもり
止め等、幅広い用途に利用することが可能である。
As explained above, according to the method for forming a planar heating element according to the present invention, it is easy to set the position, shape, and resistance value of the equipment forming the heating element, and the heating element powder is applied to the glass enamel layer. Since it is buried and the surface is covered with glass, it has excellent insulation properties, can be used in wet environments such as in liquid, and has excellent durability. Furthermore, the present invention is easy to manufacture because it is integrally baked onto the surface of the equipment, and can be used as a heating element for chemical equipment, food manufacturing equipment, kitchen utensils, etc., as well as for heating floors and walls, and for preventing fogging of mirrors. It can be used in a wide range of applications, such as for preventing fogging of automobile rear windows.

【図面の簡単な説明】[Brief explanation of drawings]

第1図乃至第3図は本発明の一実施例を示すもので、第
1図は発熱体スリップで回路パターンを形成した転写紙
の斜視図、第2図は母材の表面に転写紙を取付けた状態
を示す斜視図、第3図は面状発熱体の断面図、第4図乃
至第6図は夫々異なる潮干の平面図である。 l・・・紙       コ・・・発熱体スリップ3・
・・回路パターン  q・・・転与紙5a、5b・・・
絶縁層 6・・・母 材7・・・端 子     ざ・
・・面状発熱体9・・・黒鉛粉末    10・・・チ
タン粉末//・・・ガラスエナメル層
Figures 1 to 3 show an embodiment of the present invention. Figure 1 is a perspective view of a transfer paper on which a circuit pattern is formed using heating element slip, and Figure 2 is a perspective view of a transfer paper on which a circuit pattern is formed on the surface of a base material. FIG. 3 is a sectional view of the planar heating element, and FIGS. 4 to 6 are plan views showing different tides. L...paper C...heating element slip 3.
...Circuit pattern q...Transfer paper 5a, 5b...
Insulating layer 6... Base material 7... Terminal...
...Sheet heating element 9...Graphite powder 10...Titanium powder//...Glass enamel layer

Claims (2)

【特許請求の範囲】[Claims] (1)絶縁層を形成した金属またはセラミツクの表面に
導電性粉末を5〜60重量%、残部ガラススリツトから
なる混合物を、転写印刷、スクリーン印刷またはスプレ
ー噴射等により所望の発熱体回路パターンを形成した後
、これを焼付けして導電性粉末がガラスエナメル質に一
体に埋設された面状発熱体を形成することを特徴とする
面状発熱体の形成方法。
(1) A desired heating element circuit pattern was formed on the surface of the metal or ceramic on which the insulating layer was formed using a mixture consisting of 5 to 60% by weight of conductive powder and the remainder glass slits by transfer printing, screen printing, spray injection, etc. A method for forming a planar heating element, characterized in that this is then baked to form a planar heating element in which the conductive powder is integrally embedded in glass enamel.
(2)導電性粉末が、黒鉛、チタン、ジルコニウム、チ
タン酸バリウム等の粉末の何れか1種以上を用いること
を特徴とする特許請求の範囲第1項記載の面状発熱体の
形成方法。
(2) The method for forming a planar heating element according to claim 1, wherein the conductive powder is one or more of graphite, titanium, zirconium, barium titanate, and the like.
JP29536485A 1985-12-24 1985-12-24 Manufacture of panel heater Pending JPS62150685A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29536485A JPS62150685A (en) 1985-12-24 1985-12-24 Manufacture of panel heater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29536485A JPS62150685A (en) 1985-12-24 1985-12-24 Manufacture of panel heater

Publications (1)

Publication Number Publication Date
JPS62150685A true JPS62150685A (en) 1987-07-04

Family

ID=17819666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29536485A Pending JPS62150685A (en) 1985-12-24 1985-12-24 Manufacture of panel heater

Country Status (1)

Country Link
JP (1) JPS62150685A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2698634A1 (en) * 1992-12-01 1994-06-03 Gen Electric Inorganic paint resistant to high temperatures, methods of application and manufacture thereof and spaceship using this paint.

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5034768A (en) * 1973-08-01 1975-04-03
JPS5344692A (en) * 1977-10-24 1978-04-21 Kyowa Hakko Kogyo Co Ltd Preparation of 2,3,-cyclic nucleotide by fermentation process

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5034768A (en) * 1973-08-01 1975-04-03
JPS5344692A (en) * 1977-10-24 1978-04-21 Kyowa Hakko Kogyo Co Ltd Preparation of 2,3,-cyclic nucleotide by fermentation process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2698634A1 (en) * 1992-12-01 1994-06-03 Gen Electric Inorganic paint resistant to high temperatures, methods of application and manufacture thereof and spaceship using this paint.

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