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JPS62147249A - Clean room - Google Patents

Clean room

Info

Publication number
JPS62147249A
JPS62147249A JP60286571A JP28657185A JPS62147249A JP S62147249 A JPS62147249 A JP S62147249A JP 60286571 A JP60286571 A JP 60286571A JP 28657185 A JP28657185 A JP 28657185A JP S62147249 A JPS62147249 A JP S62147249A
Authority
JP
Japan
Prior art keywords
area
equipment
air
clean
air supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60286571A
Other languages
Japanese (ja)
Other versions
JPH0535326B2 (en
Inventor
Yoshinobu Suzuki
良延 鈴木
Mitsufusa Manabe
真鍋 充房
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimizu Construction Co Ltd
Original Assignee
Shimizu Construction Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimizu Construction Co Ltd filed Critical Shimizu Construction Co Ltd
Priority to JP60286571A priority Critical patent/JPS62147249A/en
Priority to US07/057,525 priority patent/US4838150A/en
Priority to EP86906948A priority patent/EP0250596B1/en
Priority to DE8686906948T priority patent/DE3683492D1/en
Priority to PCT/JP1986/000603 priority patent/WO1987003356A1/en
Priority to CA000525873A priority patent/CA1280929C/en
Priority to KR870700365A priority patent/KR880700218A/en
Publication of JPS62147249A publication Critical patent/JPS62147249A/en
Publication of JPH0535326B2 publication Critical patent/JPH0535326B2/ja
Granted legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/16Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
    • F24F3/167Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Ventilation (AREA)

Abstract

PURPOSE:To keep the area of equipment in an ultra clean degree and facilitate the maintenance of the equipment as well as the carrying of material into and out of the area of equipment by a method wherein a plurality of ventilating holes are provided between the area of equipment and the area of passages while a partitioning member, movable into left-and-right or up-and-down, is provided therebetween. CONSTITUTION:A plurality of front surface panels 37, 37..., divided so that the side ends thereof are superposed mutually, is attached as a partitioning member which defines the area A of equipment from the area B of passages. A plurality of ventilating holes 38, 38 are formed on a transparent rectangular plates so as to be arranged uniformly on the whole of the surface substantially while running wheels 39a, 39a are attached to the upper part thereof so as to be moveable on rails 39, 39. Further, predetermined clearance is provided between the lower end of the plate and the upper surface of a floor 28 to form a ventilating port 40, through which air in the area A of equipment flows out into the area B of passages. The ventilating holes 38 are made so as to be a bell-type opening, for example, in order to reduce the resistance of air and prevent the generation of eddies.

Description

【発明の詳細な説明】 「産業上の利用分野」 この発明は、超LSI、rc等の製造分野で、製造する
環境を超清浄に維持したい場合に必要なりリーンルーム
に関する。
DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a lean room, which is necessary in the field of manufacturing ultra-LSI, RC, etc., when it is desired to maintain a manufacturing environment ultra-clean.

「従来の技術」 一般に半導体装置の製造工程、とりわけ半導体ウェーハ
上に回路素子を形成する前工程では塵埃は大数であり、
作業雰囲気における清浄度がそのまま製品歩留り7こ結
び付く。このため、この種の半導体装置の作業雰囲気の
高清浄化を図るためにクリーンルームが使用されており
、例えば第5図に示すクリーンルームが知られている。
"Prior Art" In general, there is a large amount of dust in the manufacturing process of semiconductor devices, especially in the pre-process of forming circuit elements on semiconductor wafers.
The cleanliness of the working atmosphere is directly linked to the product yield. For this reason, clean rooms are used to maintain a highly clean working atmosphere for this type of semiconductor device, and for example, a clean room shown in FIG. 5 is known.

図において、符号にはクリーンルームであり、全体を外
隔壁1によって外界と区画されている。
In the figure, the reference numeral indicates a clean room, and the entire room is separated from the outside world by an outer partition wall 1.

そして、この区画内の中央に作業者域2を、その両外側
に高清浄度域3.3を、更にその両外側に装置保全域4
.4をそれぞれ構成しており、特に高清浄度域3.3は
その外側に配設した内隔壁5゜5と、内側に配設したス
クリーン6.6とによってそれぞれ装置保全域4.4と
作業者域2とに区画される。なお、内隔壁5.5とスク
リーン6.6とは、高清浄度域3.3の床7上に設置さ
れる半導体製造装置8の上でワークが処理される位置よ
り低いところまでその下端が延在されろような状態で吊
り下げた構成とし、したがって、その下側には床7との
間に隙間が形成される。
There is a worker area 2 in the center of this compartment, a high cleanliness area 3.3 on both sides of the area, and an equipment maintenance area 4 on both sides.
.. In particular, the high cleanliness area 3.3 is separated from the equipment maintenance area 4.4 and the work area by an internal partition wall 5.5 placed on the outside and a screen 6.6 placed on the inside. The area is divided into two areas. Note that the inner partition wall 5.5 and the screen 6.6 have their lower ends lower than the position where workpieces are processed on the semiconductor manufacturing equipment 8 installed on the floor 7 of the high cleanliness area 3.3. The structure is such that it is suspended in an extended state, and therefore a gap is formed between it and the floor 7 below.

そして、前記高清浄度域3,3の天井にそれぞれ高性能
フィルタ9.9を設置するとともに、これを上部におい
てダクトIOに接続する。一方、作業者域2の天井には
プレフィルタ11を設けて前記ダクト10に連通させ、
また装置保全域4゜4の天井にもプレフィルタ12.1
2を設けて前記高性能フィルタ9.9に連通させる。な
お、図中131ニスクリーン6に設けた作業用の窓であ
り、作業者域2にいる作業者14はこの作業用窓13を
通して半導体製造装置8を操作する。
A high performance filter 9.9 is installed on the ceiling of each of the high cleanliness areas 3, 3, and is connected to the duct IO at the upper part. On the other hand, a pre-filter 11 is provided on the ceiling of the worker area 2 and communicated with the duct 10,
Also, the pre-filter 12.1 is installed on the ceiling of the equipment maintenance area 4°4.
2 is provided and communicates with the high performance filter 9.9. Note that 131 in the figure is a working window provided in the second screen 6, and the worker 14 in the worker area 2 operates the semiconductor manufacturing equipment 8 through this working window 13.

この構成によれば、清浄空気は高性能フィルタ9.9か
ら矢印のように下側に向けて高清浄度域3.3を満たし
ここを清浄化する。清浄空気は更に半導体製造装置8と
内隔壁5及びスクリーン6との隙間を通ってそれぞれ装
置保全域4.4と作業者域2に流れ込む。また、一部は
作業用窓13を通して作業者域2に流れ込む。そして、
装置保全域4の空気は上向きに流れ、プレフィルタ12
に吸い込まれ、直接に前記高性能フィルタ9に戻り前述
のように循環する。一方、作業者域2の空気も上向きに
流れプレフィルタ11からダクトIOを通って高性能フ
ィルタ9に戻り前述のように循環する。
According to this configuration, clean air flows downward from the high-performance filter 9.9 as shown by the arrow, filling the high-cleanliness area 3.3 and cleaning this area. The clean air further flows into the equipment maintenance area 4.4 and the operator area 2 through gaps between the semiconductor manufacturing equipment 8, the inner partition wall 5, and the screen 6, respectively. A portion also flows into the worker area 2 through the work window 13. and,
The air in the device maintenance area 4 flows upward and passes through the prefilter 12.
and directly returned to the high performance filter 9 and circulated as described above. Meanwhile, the air in the worker area 2 also flows upward from the prefilter 11 through the duct IO and back to the high performance filter 9 where it is circulated as described above.

したがって、このクリーンルームKにおいては、高清浄
度域3.3が陽圧になる一方、作業者域2や装置保全域
4.4は陰圧となり、これにより高清浄度域3.3を所
望の清浄度にするとともに、作業者域2からの空気の巻
き込みを防止して高清浄度を安定に保持することができ
ること、また、高性能フィルタ9.9を高清浄度域3,
3に設けるだけでよいので、設備のイニシャルコストを
低減できるとともに、空気の供給量を減少させて電力の
ランニングコストを低減することができること等多くの
効果を得ることができる。
Therefore, in this clean room K, the high cleanliness area 3.3 is under positive pressure, while the operator area 2 and equipment maintenance area 4.4 are under negative pressure. In addition to improving cleanliness, it is possible to stably maintain a high level of cleanliness by preventing air from being drawn in from the worker area 2.
3, the initial cost of the equipment can be reduced, and many effects can be obtained, such as reducing the amount of air supplied and reducing the running cost of electric power.

「発明が解決しようとする問題点」 ところが、°前記従来のクリーンルームにおいては、次
に挙げるような問題点があった。
"Problems to be Solved by the Invention" However, the conventional clean room described above had the following problems.

(+)  スクリーンが固定して設けられているため、
頻繁に行なわれる半導体製造装置のメンテナンス及び装
置部領域への物の搬出入の際、スクリーンが障害物とな
り前記作業を円滑に行うことが困難である。
(+) Since the screen is fixed,
When maintenance of semiconductor manufacturing equipment is frequently performed and objects are carried in and out of the equipment area, the screen becomes an obstacle, making it difficult to perform the work smoothly.

(2)高清浄度域に供給された空気の大半が、スクリー
ンの下部からのみ排気されるため、床方向へ向かう気流
の流速が大きなものとなり、床での気流の跳ね返り現象
が生じ、床に堆積している塵埃が作業者域へ舞い上がり
、作業者域を高清浄に維持するために不都合である。
(2) Most of the air supplied to the high cleanliness area is exhausted only from the bottom of the screen, so the velocity of the airflow toward the floor becomes high, causing the airflow to rebound on the floor, causing The accumulated dust flies up into the worker's area, which is inconvenient for maintaining the worker's area at a high level of cleanliness.

(3)作業者域に而するスクリーン表面付近(前記第5
図中の斜線部S)では、空気の渦が生じており、ここに
塵埃が流入すると速やかに排出され難く、作業者領域を
高清浄度に維持するための障害となる。
(3) Near the screen surface in the worker area (the fifth section above)
In the shaded area S) in the figure, an air vortex is generated, and when dust enters there, it is difficult to quickly discharge it, which becomes an obstacle to maintaining a high level of cleanliness in the worker's area.

本発明は、前記問題に鑑みてなされたものであり、高清
浄度域を超清浄度にするとともに、作業者域からの空気
の巻き込みを防止して超清浄度を安定に保持し、また、
空気の供給量を低減して電力のランニングコストを低減
させるとともに、設備のイニシャルコストを低減させ、
さらに、作業者域を高清浄度に維持するとともに、半導
体製造装置のメンテナンスや装置部領域への物の搬出入
を容易に行うことのできるクリーンルームを提供するこ
とを目的としている。
The present invention has been made in view of the above-mentioned problems, and it makes the high cleanliness area super clean, prevents air from being drawn in from the worker area, and stably maintains the super cleanliness.
This reduces the amount of air supplied, reduces the running cost of electricity, and reduces the initial cost of equipment.
Furthermore, it is an object of the present invention to provide a clean room in which a worker area can be maintained at a high level of cleanliness, and in which maintenance of semiconductor manufacturing equipment and carrying of items into and out of the equipment area can be easily performed.

「問題点を解決するための手段」 本発明は、前記問題点を解決するために室内を、超清浄
度が要求される装置部領域と、高清浄度が要求される通
路部領域とに区分するとともに、前記装置部領域の天井
に清浄空気を吹き出す空気供給部を設け、さらに通路部
領域の上部には前記空気供給部と隣接し、この空気供給
部から吹き出す前記清浄空気を還気させる天井排気部を
設けたクリーンルームにおいて、前記装置部領域と通路
部領域との間にその全面にほぼ均一に複数の通気孔を何
し、かつ左右若しくは上下方向に移動自在な仕切部材を
設けたことを特徴としている。
``Means for Solving the Problems'' In order to solve the above-mentioned problems, the present invention divides the interior of the room into an equipment area where ultra-cleanliness is required and a passage area where high cleanliness is required. At the same time, an air supply unit for blowing out clean air is provided on the ceiling of the device area, and further, an air supply unit is provided above the passage area, adjacent to the air supply unit, and for returning the clean air blown from the air supply unit. In a clean room equipped with an exhaust section, a plurality of ventilation holes are provided almost uniformly over the entire surface between the device section area and the passage section area, and a partition member that is movable left and right or up and down is provided. It is a feature.

「作用 」 超清浄度が要求される装置部領域は通路部領域と仕切部
材によって区画されているため、供給された清浄空気は
拡散することなく所定の流速で装置部領域を流れるため
、少量の清浄空気を供給するだけで装置部領域の清浄度
を維持することが可能となるとともに、通路部領域から
の塵埃の拡散や流入が完全に阻止される。また、仕切部
材には全面に複数の通気孔が形成されているため、仕切
部材の全面からほぼ均一に通路部領域に空気が吹き出し
、通路部領域側に面する仕切部材表面近傍に渦を発生さ
せることがないとともに、通気孔の内径や数を調節する
ことにより他の排気口から排気される空気の流滑や流速
が制御される。
``Function'' The equipment area that requires ultra-cleanliness is divided by the passage area and the partition member, so the supplied clean air flows through the equipment area at a predetermined flow rate without being diffused. It is possible to maintain the cleanliness of the device area simply by supplying clean air, and the diffusion and inflow of dust from the passage area is completely prevented. In addition, since multiple ventilation holes are formed on the entire surface of the partition member, air is blown out almost uniformly from the entire surface of the partition member into the passage area, creating a vortex near the surface of the partition member facing the passage area. In addition, by adjusting the inner diameter and number of the ventilation holes, the flow and velocity of air exhausted from other exhaust ports can be controlled.

「実施例」 以下、第1図ないし第4図をもちいてこの発明の詳細な
説明する。第1図はクリーンルームの要部を示すもので
あり、図において、符号にはクリーンルーム、2Iは天
井板、22は床版である。
"Embodiments" Hereinafter, the present invention will be described in detail with reference to FIGS. 1 to 4. FIG. 1 shows the main parts of the clean room, and in the figure, the reference numerals are the clean room, 2I is the ceiling board, and 22 is the floor slab.

天井板2■と床版22との間の室内には、天井部分に天
井板23が設けられており、天井板23の上部には主空
調機(図示せず)から空気を送風するための給気ダクト
24.24が配設されている。
A ceiling board 23 is provided in the ceiling part of the room between the ceiling board 2■ and the floor slab 22, and a ceiling board 23 is provided above the ceiling board 23 for blowing air from a main air conditioner (not shown). An air supply duct 24.24 is arranged.

また、天井板23の下部には、中央部に天井排気部25
形成されており、それを挾んで両側(紙面にむかって左
右)に隣接して空気供給部である給気チャンバ26.2
6が設けられている。この給気ヂャンバ26.26は、
それぞれ上方の給気ダクト24.24と連通されるとと
もに、給気ヂャンバ26.26の下部に設けられたUL
PAフィルタ(又はI(E P Aフィルタ)27.2
7を介して下方の空間部と連通されている。
In addition, a ceiling exhaust part 25 is provided at the center of the lower part of the ceiling board 23.
Air supply chambers 26.2, which are air supply units, are located adjacent to each other on both sides (left and right when facing the page).
6 is provided. This air supply chamber 26.26 is
ULs connected to the upper air supply ducts 24, 24 and provided at the lower part of the air supply chamber 26, 26, respectively.
PA filter (or I (E P A filter) 27.2
It communicates with the space below via 7.

一方、室内の床部分には、床版22の上方に開口部を有
する床部28が設置されており、それらの間には床下フ
リーアクセスフロア28aが形成されている。さらに、
室内は給気チャンバ26゜26の円外側部と床部28と
の間に立設されたバックパネル29.29によって、作
業室30とユーティリティ室31.31とに区画されて
いる。
On the other hand, a floor part 28 having an opening above the floor slab 22 is installed in the floor part of the room, and an underfloor free access floor 28a is formed between them. moreover,
The interior of the room is divided into a work room 30 and a utility room 31.31 by a back panel 29.29 erected between the outer circumference of the air supply chamber 26.26 and the floor 28.

バックパネル29.29の下部付近には、半導体等の製
造装置32..32が配設されており、バックパネル2
9の下端部にはバックパネル排気口33.33が形成さ
れている。製造装置32が長くユーティリティ室31に
はみ出す場合は、製造装置32の上部と接する付近のバ
ックパネル29にダンパー付きのガラリを設け、製造装
置32が作業室30に納まる場合には、床部28の上部
と接する付近のバックパネル29にダンパー付きのガラ
リを設けることによりバックパネル排気口33を構成し
ている。
Near the bottom of the back panel 29.29 is a semiconductor manufacturing equipment 32. .. 32 is arranged, and the back panel 2
A back panel exhaust port 33, 33 is formed at the lower end of the back panel 9. If the manufacturing equipment 32 protrudes into the utility room 31 for a long time, a louver with a damper will be provided on the back panel 29 near the top of the manufacturing equipment 32, and if the manufacturing equipment 32 will fit into the work room 30, a louver with a damper will be installed on the back panel 29 near the top of the manufacturing equipment 32. A back panel exhaust port 33 is formed by providing a louver with a damper on the back panel 29 near the top.

前記、作業室30の空間部は、製造装置32゜32の上
方の装置部領域A、Aと、作業室30のほぼ中央部で作
業者34が行動する通路部領域Bとに区分されており、
前記給気ヂャンバ26.26は装置部領域A、Aの上部
に、また天井排気部25は通路部領域Bの上部に位置し
て0る。
The space of the work room 30 is divided into equipment areas A, A above the manufacturing equipment 32 32, and a passage area B where the worker 34 moves approximately in the center of the work room 30. ,
The air supply chambers 26, 26 are located above the device areas A, and the ceiling exhaust section 25 is located above the passage area B.

また、前記給気チャンバ26.26には、ユーティリテ
ィ室31.31側にファン内蔵型の空調機35.35が
設けられており、天井排気部25の下部両側には、照明
装置36.36が給気チャンバ26.26の側面に固定
されて設けられているとともに、照明装置36.36の
下部には、装置部領域Aと通路部領域Bとを区画する仕
切部材であり、互いに側端部が重なり合うように分割し
て設けられた複数枚の前面パネル37,37.・・・が
取り付けられている。
Further, in the air supply chamber 26.26, an air conditioner 35.35 with a built-in fan is provided on the utility room 31.31 side, and lighting devices 36.36 are installed on both sides of the lower part of the ceiling exhaust section 25. A partition member is provided fixed to the side surface of the air supply chamber 26.26, and at the bottom of the illumination device 36.36 is a partition member that partitions the device area A and the passage area B. A plurality of front panels 37, 37 . ... is installed.

この前面パネル37は、第2図に示すように、透明な矩
形の板に複数の通気孔38,38.・・・を全面に渡っ
てほぼ均一に配置、形成したものであり、パネル37の
上部には、照明装置36の下部に横方向(紙面に対して
直交する方向)に固定された二本のレール39.39上
をパネル37が移動可能なように、走行車輪39a、3
9aが取り付けられている。さらに、パネル37は、そ
の下端部が床部28の上面との間に所定の隙間を形成す
るような形状とされており、その隙間は、装置部領域A
内の空気が通路部領域Bへ流出するための通気口40と
なっている。また、パネル37に形成された通気孔38
は、第3図に示すように、そこを通過する空気の抵抗を
軽減させるとともに、その前後において渦の発生を防止
するために、孔の両側端部が曲線を描いて次第に広がり
ながらパネル37の表面と連続する、ベル型開[1部と
なっており、通気孔38の内径及び数を変化させること
により、通路部領域Bへ流出する空気の流量を制御する
ことが可能なように構成とされている。
As shown in FIG. 2, this front panel 37 is a transparent rectangular plate with a plurality of ventilation holes 38, 38. ... are arranged and formed almost uniformly over the entire surface, and at the top of the panel 37, there are two lights fixed horizontally (perpendicular to the plane of the paper) at the bottom of the lighting device 36. Running wheels 39a, 3 are provided so that the panel 37 can move on the rails 39.39.
9a is attached. Further, the panel 37 is shaped such that a predetermined gap is formed between its lower end and the upper surface of the floor section 28, and the gap is formed in the device area A.
It serves as a vent hole 40 through which the air inside flows out to the passage area B. In addition, a ventilation hole 38 formed in the panel 37
As shown in FIG. 3, in order to reduce the resistance of the air passing through the hole and to prevent the generation of vortices in front and behind the hole, the panel 37 is formed so that both ends of the hole draw a curve and gradually widen. It has a bell-shaped opening [1 part] that is continuous with the surface, and is configured so that the flow rate of air flowing out to the passage area B can be controlled by changing the inner diameter and number of the ventilation holes 38. has been done.

さらに、パネル37の所定の場所には、作業者34が製
造装置32を操作するための作業用窓(図示せず)が設
けられている。
Furthermore, a working window (not shown) is provided at a predetermined location on the panel 37 for the operator 34 to operate the manufacturing device 32 .

また、第1図に示すように、天井排気部25には、その
下部付近で給気チャンバ26.26間にダンパー付きの
ガラリ4Iが架設されており、その上方には給気チャン
バ26.26の側面に付設された排気ファン42.42
が設けられている。
Further, as shown in FIG. 1, a louver 4I with a damper is installed near the bottom of the ceiling exhaust part 25 between the air supply chambers 26.26, and above the louver 4I, the air supply chambers 26.26 Exhaust fan attached to the side of 42.42
is provided.

一方、床部28は、開口部としてグレーチングまたはパ
ンチングメタル等の有孔床43,43.・・・が設置さ
れるとともに、製造装置32.32や通路部領域Bの床
部にはコンクリートの固定床44.44が設けられた構
成とされている。
On the other hand, the floor portion 28 has perforated floors 43, 43. ... are installed, and concrete fixed floors 44, 44 are provided on the manufacturing equipment 32, 32 and the floor of the passage area B.

つぎに、前記の構成のクリーンルームにの作用について
説明する。
Next, the operation of the clean room having the above configuration will be explained.

まず、主空調機から給気ダクト24.24を通りて送ら
れた空気が、天井に設けられた左右の給気ヂャンバ26
.26へ供給される。給気ヂャンバ26.26へ供給さ
れた空気は、ULPA(又はr(EPA)フィルタ27
.27を通過して清浄化され、装置部領域A内へ吹き出
される。吹き出された清浄空気は、主に3種類の流路を
通って、再び、給気ヂャンバ26.26へ還気される。
First, air sent from the main air conditioner through the air supply ducts 24 and 24 is sent to the left and right air supply chambers 26 installed on the ceiling.
.. 26. The air supplied to the supply air chamber 26.26 is passed through a ULPA (or r(EPA) filter 27
.. 27 to be cleaned and blown into the device area A. The blown clean air passes mainly through three types of flow paths and is returned to the air supply chamber 26, 26 again.

まず、第1の流路■は、給気チャンバ26から吹き出さ
れた清浄空気が製造装置32の上面に当たった後、バッ
クパネル排気口33を通過してユーティリティ室31に
達し、次いで空調機35を経て給気チャンバ26へ還気
する流路。つぎに、第2の流路■は、給気チャンバ26
から吹き出された清浄空気が製造装置32の上面に当た
った後、有孔床43から床下フリーアクセスフロア28
aを通過してユーティリティ室31に達し、次いで空調
機35を経て給気チャンバ26へ還気する流路。さらに
、第3の流路■は、給気チャンバ26から吹き出した清
浄空気が製造装置32に当たらず能面パネル37の通気
孔38,38.・・・及びその下部の通気口40をa過
して通路部領域Bへ流出した後、上昇してその上部に設
けられた天井ガラリ41から天井排気部25に達し、次
いで、排気ファン42により給気チャンバ26へ還気す
る流路である。
First, in the first flow path (2), clean air blown from the air supply chamber 26 hits the top surface of the manufacturing equipment 32, passes through the back panel exhaust port 33, reaches the utility room 31, and then passes through the air conditioner 35. A flow path for returning air to the air supply chamber 26 through the air. Next, the second flow path ■ is connected to the air supply chamber 26
After the clean air blown from the air hits the top surface of the manufacturing equipment 32, it passes from the perforated floor 43 to the underfloor free access floor 28.
a, reaches the utility room 31, and then returns air to the air supply chamber 26 via the air conditioner 35. Furthermore, the third flow path {circle around (2)} prevents the clean air blown from the air supply chamber 26 from hitting the manufacturing apparatus 32 and the ventilation holes 38, 38 . ...and flows out into the passage area B through the vent 40 at the bottom, rises and reaches the ceiling exhaust section 25 from the ceiling louver 41 provided above, and then is discharged by the exhaust fan 42. This is a flow path for returning air to the air supply chamber 26.

この流路■を流れる空気は、通路部領域Bへ流出する際
、前面パネル37に無数に形成された通気孔38,38
.・・・を通過して前面パネルの全面から均一に流出す
るため、前面パネル37の通路部領域側の表面付近に空
気の渦を生じることが少ない。また、前面パネルの通気
孔38.38.・・・の数と内径の大きさを変えること
により、前面パネル37面からの空気の流出量を制御す
ることができるとともに、前面パネル下部の通気口40
からの空気の流mを制御することが可能となる。
When the air flowing through this flow path (3) flows out to the passage area B, the air flows through the numerous ventilation holes 38, 38 formed in the front panel 37.
.. ... and flows out uniformly from the entire surface of the front panel, so air vortices are less likely to be generated near the surface of the front panel 37 on the passage area side. Also, the front panel ventilation holes 38.38. By changing the number and the size of the inner diameter, it is possible to control the amount of air flowing out from the front panel 37, and also to control the amount of air flowing out from the front panel 37.
It becomes possible to control the air flow m from the

したがって、この通気口40からの空気の流量を適切に
調節すること(こ上り、ここを流れる気流によって床部
28に堆積した塵埃の舞い上がりを確実に防止すること
ができる。
Therefore, by appropriately adjusting the flow rate of air from this vent 40, it is possible to reliably prevent the dust deposited on the floor 28 from flying up due to the airflow flowing through it.

なお、室外への排気を必要とする装置(図示せず)がク
リーンルームに内に設置されている場合には、流路■■
を流れるいずれかの空気が装置内へ取り込まれ、装置内
部を通過した後、排気ダクト(図示せず)を通じて建物
外へ排出される。
Note that if equipment (not shown) that requires exhaust to the outside is installed inside the clean room, the flow path
Any air flowing through the building is drawn into the device, passes through the device, and is then exhausted to the outside of the building through an exhaust duct (not shown).

ここで、クリーンルームの必要清浄度は、半導体の製造
が行なわれる装置部領域Aでクラス10(対象粒子径≧
0.1μm)1作業音34が移動する通路部領域Bでク
ラス100(対象粒子径≧0゜1μm)であり、装置部
領域Aでは超清浄度が通路部領域Bでは高清浄度が維持
される必要がある。
Here, the required cleanliness of the clean room is class 10 (target particle size ≧
0.1 μm) 1 The working sound 34 is class 100 (target particle size ≧ 0°1 μm) in the passage area B where it moves, and ultra cleanliness is maintained in the equipment area A and high cleanliness is maintained in the passage area B. It is necessary to

また、装置部領域Aの清浄空気は、通路部領域Cの清浄
空気に比べて清浄度が高く、装置部領域Aから流れ出る
清浄空気を用いて通路部領域Bを清浄化することができ
る。
Further, the clean air in the device region A has a higher degree of cleanliness than the clean air in the passage region C, and the passage region B can be cleaned using the clean air flowing out from the device region A.

したがって、このクリーンルームKにおいては、装置部
領域Aがバックパネル29及び前面パネル37によって
囲われているため、超清浄度域である装置部領域Aが陽
圧になる一方、高清浄度域である通路部領域Bやユーテ
ィリティ室31は防圧となり、少量の清浄空気を供給す
るだけで(本実施例においては、装置部領域の清浄空気
の流速を0.2m/s以下とすることができる)装置部
領域Aを所望の清浄度にするとともに、通路部領域Bか
らの塵埃の拡散、流入が完全に防止され、超清浄度を安
定に保持することができる。
Therefore, in this clean room K, since the equipment area A is surrounded by the back panel 29 and the front panel 37, the equipment area A, which is an ultra-clean area, is under positive pressure, while the equipment area A is a high-clean area. The passage area B and the utility room 31 are pressure-proofed, and only by supplying a small amount of clean air (in this embodiment, the flow velocity of clean air in the device area can be reduced to 0.2 m/s or less). In addition to bringing the device area A to a desired level of cleanliness, the diffusion and inflow of dust from the passage area B is completely prevented, and ultra-cleanliness can be stably maintained.

また、空気供給部である給気チャン)<26.26が装
置部領域A、Aの上部にしか設けられておらず、天井の
全面から清浄空気が吹き出すことがないので、空気の絶
対供給量を減少させることが可能になるとともに、UL
PAフィルタ27は供給チャンバ26.26に設けるだ
けでよいので、ファンの駆動動力等電力のランニングコ
ストを低減できるとともに、設備のイニシャルコストを
低減できる。
In addition, since the air supply channel (air supply channel) <26.26 which is the air supply section is provided only at the top of the device area A, A, clean air is not blown out from the entire surface of the ceiling, so the absolute amount of air supplied is It becomes possible to reduce the UL
Since the PA filter 27 only needs to be provided in the supply chamber 26, 26, the running cost of electric power such as driving power of the fan can be reduced, and the initial cost of the equipment can be reduced.

また、前面パネル37はレール39に沿って左右に移動
させることができるので、製造装置32のメンテナンス
や装置部領域Aへの物の搬出入を容易に行うことが可能
である。
Further, since the front panel 37 can be moved left and right along the rails 39, maintenance of the manufacturing equipment 32 and carrying of items into and out of the equipment area A can be easily performed.

さらに、装置部領域Aに供給された空気を3種類の流路
から排気することができるので、床部28の全面を有孔
床43とする必要がなくなり、装置部領域Aと通路部領
域Bの境界面付近の直下に僅かな開口部を設けるだけで
、通路部領域Bと製造装置32.32の直下は固定床4
4とすることができる。その結果、作業者34は歩行時
に通路部領域Bの固定床44を歩くことにより、また、
通路部領域Bの固定床44と製造装置32.32の固定
床44とが分離していることにより、歩行時に振動が発
生するのを押さえ、振動が製造装置32.32へ伝わる
のを防止することがきるとともに、歩行時の作業者34
に、全面グレーチング床を歩く時に感じられる不快感を
与えることがない。
Furthermore, since the air supplied to the device area A can be exhausted from three types of channels, there is no need to make the entire surface of the floor 28 a perforated floor 43, and the device area A and the passage area B By simply providing a small opening just below the interface between the passage area B and the manufacturing equipment 32.
It can be set to 4. As a result, when the worker 34 walks, by walking on the fixed floor 44 in the passage area B,
By separating the fixed bed 44 of the passage area B and the fixed bed 44 of the manufacturing device 32.32, vibrations generated during walking are suppressed and vibrations are prevented from being transmitted to the manufacturing device 32.32. Worker 34 is able to walk while walking.
In addition, there is no discomfort felt when walking on a fully grating floor.

次に、第4図を用いて第2の実施例を説明する。Next, a second embodiment will be described using FIG. 4.

この第2の実施例は、前記第1の実施例のクリーンルー
ムKにおける、前面パネル37を次のように構成したも
のである。第4図において、第1図ないし第3図に示し
た第1の実施例と同一の構成要素については同一符号を
付し、その説明を省略する。
In this second embodiment, the front panel 37 in the clean room K of the first embodiment is configured as follows. In FIG. 4, the same components as those in the first embodiment shown in FIGS. 1 to 3 are designated by the same reference numerals, and their explanations will be omitted.

図において、符号45はスクリーンであり、装置部領域
Aと通路部領域Bとの境界面に設けられている。スクリ
ーン45の全面には多数の微細な通気孔(図示せず)が
形成されており、スクリーン45はその上端部に設けら
れた回転機構を有した巻き取り棒46によって上下方向
に移動自在とされた状態で照明装置36の下部に固定さ
れている。
In the figure, the reference numeral 45 denotes a screen, which is provided at the interface between the device region A and the passage region B. A large number of fine ventilation holes (not shown) are formed on the entire surface of the screen 45, and the screen 45 can be moved vertically by a winding rod 46 having a rotation mechanism provided at the upper end thereof. It is fixed to the lower part of the illumination device 36 in a state where it is held in place.

さらに、スクリーン45の下端部には、スクリーン45
の弛みや揺れを防止するための重り47が取り付けられ
ており、その下端部と床部28との間には隙間40が形
成されている。また、スクリーン45の所定の場所には
作業者34が製造装置32を操作するための作業用窓(
図示せず)が設けられている。なお、床部28にはスク
リーン45の上部の回転機構を自動的に制御してスクリ
ーン45を上下に開閉させる足踏みスイッチ48を設け
ておいてもよい。その他については、前記第1の実施例
と同様の構成とされている。
Furthermore, a screen 45 is provided at the lower end of the screen 45.
A weight 47 is attached to prevent loosening or shaking, and a gap 40 is formed between the lower end of the weight 47 and the floor 28. Further, at a predetermined location of the screen 45, there is a work window (
(not shown) is provided. Note that a foot switch 48 may be provided on the floor 28 to automatically control the rotation mechanism at the top of the screen 45 to open and close the screen 45 up and down. In other respects, the configuration is the same as that of the first embodiment.

したがって、このように構成されたクリーンルームにお
いては、流路■を流れる気流は、通路部領域Bへ流出す
る際、スクリーン45に多数形成された通気孔を通過し
てスクリーン45の全面から均一に流出するため、スク
リーン45の通路部領域側の表面付近に空気の渦を生じ
ることがないとともに、スクリーン45に形成された通
気孔の径や数を変えることにより、通気孔40から排気
される空気の流量や流速を制御することが可能である。
Therefore, in the clean room configured in this way, when the airflow flowing through the flow path (3) flows out to the passage area B, it passes through the many ventilation holes formed in the screen 45 and flows out uniformly from the entire surface of the screen 45. Therefore, air vortices are not generated near the surface of the screen 45 on the passage area side, and by changing the diameter and number of the ventilation holes formed in the screen 45, the air exhausted from the ventilation holes 40 can be reduced. It is possible to control the flow rate and flow rate.

また、スクリーン45は施工が簡単であり、開閉作業が
容易に行えるものとなっている。その他の作用、効果に
ついては、前記第1の実施例と同様である。
Furthermore, the screen 45 is easy to construct and can be opened and closed easily. Other functions and effects are the same as those of the first embodiment.

「発明の効果」 以上説明したように本発明は、室内を超清浄度が要求さ
れる装置部領域と、高清浄度が要求される通路部領域と
に区分するとともに、前記装置部領域の天井に清浄空気
を吹き出す空気供給部を設け、さらに通路部領域の上部
には前記空気供給部と隣接し、この空気供給部から吹き
出す前記清浄空気を還気させる天井排気部を設けたクリ
ーンルームにおいて、前記装置部領域と通路部領域との
間にその全面にほぼ均一に複数の通気孔を有し、かつ左
右若しくは上下方向に移動自在な仕切部材を設けたもの
であるので、超清浄度域である装置部領域が陽圧になる
一方、高清浄度域である通路部領域は防圧となり、少量
の清浄空気を供給するだけで装置部領域を所望の清浄度
にできること、また、通路部領域からの塵埃の侵入を完
全に無くして超清浄度を安定に保持することができるこ
と、また、空気供給部が装置部領域の上部にしか設けら
れておらず、天井の全面から清浄空気が吹き出すことが
ないので、空気の絶対供給量を減少させることができる
とともに、ULPAフィルタは空気供給部に設けるだけ
でよいので、ファンの駆動動力等電力のランニングコス
トを低減できるとともに、設備のイニシャルコストを低
減できる。
"Effects of the Invention" As explained above, the present invention divides a room into an equipment area where ultra-cleanliness is required and a passage area where high cleanliness is required, and a ceiling in the equipment area. In a clean room, an air supply section for blowing out clean air is provided, and a ceiling exhaust section is provided above the passage area, adjacent to the air supply section, and for returning the clean air blown from the air supply section. It has a plurality of ventilation holes almost uniformly over the entire surface between the device area and the passage area, and is provided with a partition member that is movable left and right or up and down, so it is an ultra-clean area. While the equipment area is under positive pressure, the passage area, which is a high cleanliness area, is pressure-proof, making it possible to achieve the desired level of cleanliness in the equipment area by simply supplying a small amount of clean air. It is possible to completely eliminate the intrusion of dust and maintain ultra-cleanliness stably, and the air supply section is only installed above the equipment area, making it possible to blow clean air from the entire surface of the ceiling. Since there is no ULPA filter, it is possible to reduce the absolute amount of air supplied, and since the ULPA filter only needs to be installed in the air supply section, it is possible to reduce the running cost of electric power such as fan drive power, and the initial cost of the equipment. .

さらに、本発明においては、仕切部材が移動可能に構成
されているため、製造装置のメンテナンスや装置部領域
への物の搬出入を容易におこなうことができる。また、
仕切部材の表面全体に渡って均一に通気孔が形成されて
いるため、仕切部材の通路部領域側の表面付近に空気の
渦を発生させることが少なく、さらに、通気孔の内径や
数を調節することにより仕切部材の下部の通気口から流
出する空気の流速を制御し、床部に堆積している塵埃の
舞い上がりを防止し、通路部領域の高清浄度を維持する
ことができる。
Furthermore, in the present invention, since the partition member is configured to be movable, it is possible to easily maintain the manufacturing equipment and carry objects in and out of the equipment area. Also,
Since ventilation holes are formed uniformly over the entire surface of the partition member, air vortices are less likely to be generated near the surface of the partition member on the passage area side, and the inner diameter and number of ventilation holes can be adjusted. By doing so, it is possible to control the flow rate of air flowing out from the vent at the bottom of the partition member, prevent dust accumulated on the floor from flying up, and maintain high cleanliness in the passage area.

【図面の簡単な説明】 第1図ないし第4図は本発明の実施例を示すものであり
、第1図は第1の実施例を示しクリーンルームの側断面
図、第2図は第1図におけるクリーンルームの前面パネ
ルの一部斜視図、第3図は第2図の前面パネルの通気孔
部分を断面した側面図、第4図は第2の実施例を示しク
リーンルームの一部分の側断面図、第5図は従来の技術
を示しクリーンルームの側断面図である。 A・・・・・・装置部領域、B・・・・・・通路部領域
、25・・・・・・天井排気部、26・・・・・・給気
チャンバ(空気供給部)、37・・・・・・前面パネル
(仕切部材)、38・・・・・・通気孔、45・・・・
・スクリーン(仕切部材)第1図
[BRIEF DESCRIPTION OF THE DRAWINGS] Figures 1 to 4 show embodiments of the present invention. Figure 1 shows the first embodiment and is a side sectional view of a clean room, and Figure 2 is a side sectional view of the clean room. FIG. 3 is a cross-sectional side view of the ventilation hole portion of the front panel of FIG. 2; FIG. 4 is a side sectional view of a portion of the clean room showing the second embodiment; FIG. 5 shows a conventional technique and is a side sectional view of a clean room. A... Device area, B... Passage area, 25... Ceiling exhaust section, 26... Air supply chamber (air supply section), 37 ...Front panel (partition member), 38...Vent hole, 45...
・Screen (partition member) Figure 1

Claims (1)

【特許請求の範囲】[Claims] 室内を、超清浄度が要求される装置部領域と、高清浄度
が要求される通路部領域とに区分するとともに、前記装
置部領域の天井に清浄空気を吹き出す空気供給部を設け
、さらに通路部領域の上部には前記空気供給部と隣接し
、この空気供給部から吹き出す前記清浄空気を還気させ
る天井排気部を設けたクリーンルームにおいて、前記装
置部領域と通路部領域との間にその全面にほぼ均一に複
数の通気孔を有し、かつ左右若しくは上下方向に移動自
在な仕切部材を設けたことを特徴とするクリーンルーム
The room is divided into an equipment area that requires ultra-cleanliness and a passage area that requires high cleanliness, and an air supply unit that blows clean air is installed on the ceiling of the equipment area, and In a clean room in which a ceiling exhaust section is provided in the upper part of the section area adjacent to the air supply section and returns the clean air blown out from the air supply section, the entire surface area is provided between the equipment section area and the passage section area. 1. A clean room characterized by having a plurality of ventilation holes substantially uniformly arranged therein, and provided with a partition member that is movable left and right or up and down.
JP60286571A 1985-11-26 1985-12-19 Clean room Granted JPS62147249A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP60286571A JPS62147249A (en) 1985-12-19 1985-12-19 Clean room
US07/057,525 US4838150A (en) 1985-11-26 1986-11-26 Clean room
EP86906948A EP0250596B1 (en) 1985-11-26 1986-11-26 Clean room
DE8686906948T DE3683492D1 (en) 1985-11-26 1986-11-26 CLEANROOM.
PCT/JP1986/000603 WO1987003356A1 (en) 1985-11-26 1986-11-26 Clean room
CA000525873A CA1280929C (en) 1985-12-19 1986-12-19 Clean room
KR870700365A KR880700218A (en) 1985-11-26 1987-04-27 Clean Room

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60286571A JPS62147249A (en) 1985-12-19 1985-12-19 Clean room

Publications (2)

Publication Number Publication Date
JPS62147249A true JPS62147249A (en) 1987-07-01
JPH0535326B2 JPH0535326B2 (en) 1993-05-26

Family

ID=17706131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60286571A Granted JPS62147249A (en) 1985-11-26 1985-12-19 Clean room

Country Status (1)

Country Link
JP (1) JPS62147249A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62201330U (en) * 1986-06-11 1987-12-22
US5549512A (en) * 1994-11-30 1996-08-27 Lucent Technologies Inc. Minienvironment for hazardous process tools
JPH0989329A (en) * 1995-09-26 1997-04-04 Benitsukusu Kk Partition structure for clean room
JPH0989328A (en) * 1995-09-26 1997-04-04 Benitsukusu Kk Partition structure of clean room
US6264550B1 (en) * 1997-07-11 2001-07-24 Nippon Steel Semiconductor Corporation Clean room and method of remodeling clean room
US6347990B1 (en) * 1999-04-03 2002-02-19 Samsung Electronics Co., Ltd. Microelectronic fabrication system cleaning methods and systems that maintain higher air pressure in a process area than in a transfer area

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62201330U (en) * 1986-06-11 1987-12-22
US5549512A (en) * 1994-11-30 1996-08-27 Lucent Technologies Inc. Minienvironment for hazardous process tools
JPH0989329A (en) * 1995-09-26 1997-04-04 Benitsukusu Kk Partition structure for clean room
JPH0989328A (en) * 1995-09-26 1997-04-04 Benitsukusu Kk Partition structure of clean room
US6264550B1 (en) * 1997-07-11 2001-07-24 Nippon Steel Semiconductor Corporation Clean room and method of remodeling clean room
US6347990B1 (en) * 1999-04-03 2002-02-19 Samsung Electronics Co., Ltd. Microelectronic fabrication system cleaning methods and systems that maintain higher air pressure in a process area than in a transfer area

Also Published As

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