JPS6214701Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a structure for mounting a semiconductor device on a printed board having studs.

In order to prevent characteristic deterioration due to heat generation, ordinary semiconductor elements generally radiate heat using a thermal conductor. Conventionally, there is a processing method in which the device is mounted on a printed circuit board and a stud is soldered to a heat sink, thereby serving both as grounding and heat dissipation. As another method, as shown in the front view of FIG. 1, the integrated circuit board 2 is formed by coating signal patterns and ground patterns on a ceramic substrate, and providing stud through holes for semiconductor elements. This integrated circuit board 2 is screwed and fixed to a printed board 4 via a mounting bracket 3 which also serves as a heat dissipation block, so that the integrated circuit board 2 and each pattern of the printed board 4 are connected to each other. A semiconductor element 1 is mounted on an integrated circuit board 2, and its stud 5 projects from the bottom surface of the integrated circuit board 2 through the aforementioned through hole. The tip of the stud 5 contacts the heat sink 6 and is fixed by soldering. Further, the heat sink 6 is sandwiched between the integrated circuit board 2 and the mounting bracket 3 at both ends thereof, thereby enhancing the heat dissipation effect. The printed board 4 with the semiconductor element 1 mounted in this way is attached to the mounting board 7 via the mounting bracket 3.
It is fixed with screws. The semiconductor element 1 is fixed at only one place by soldering the stud 5 to the heat sink 6, and although cushioning materials 3a are provided at both ends of the integrated circuit board 2 as a vibration-proof structure, stress on the soldered part due to external impact etc. It is easy to be damaged by soldering, resulting in unreliable soldering, and the grounding effect and heat dissipation effect are both insufficient due to the small cross-sectional area of the mounting portion. Also, the structure is complicated and workability is poor.

In view of the above-mentioned drawbacks, the present invention aims to provide an effective mounting structure to enhance the heat dissipation effect and the grounding effect, as well as to improve workability.

In order to achieve the above object, the present invention provides a method for mounting a semiconductor element having studs on a ceramic substrate which is fixed to a printed circuit board by a support fitting which also serves as a heat dissipation block. The semiconductor device is characterized in that the stud of the semiconductor device is inserted into a sleeve having an axial notch and is elastically held therein.

Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings. FIG. 2 is a perspective view of a holding sleeve that is an embodiment of the present invention. FIG. 3 is a front view showing a mounting structure according to an embodiment of the present invention. In Fig. 2, the cylindrical sleeve 9 is
The holding sleeve 8 is formed by welding or the like by being embedded in the holding sleeve 8, and the sleeve 9 is made of an electrically conductive spring material, such as beryllium copper or phosphor bronze. The upper tip has a plurality of cut pieces 11 which protrude outward. This is a means for making it easier to insert the stud 5, and the slit 12 extends to the lower part to provide flexibility. FIG. 3 is a front view showing a configuration in which the holding sleeve 8 is attached to the mounting bracket 31 and the stud 5 of the semiconductor element 1 is inserted into the holding sleeve 8. It is fitted and fixed against the end surface 31a. The stud 5 of the semiconductor element 1 is inserted into the sleeve 9 and held by its spring properties. In this way, it is possible to create a vibration-proof structure that is easy to install and is not easily affected by external stress, and even if the heat sink (see 6 in Figure 1) is omitted, the heat dissipation effect is achieved by the mounting bracket that forms the heat dissipation block. This is further improved because it can be installed directly. FIG. 4 is a front view showing another embodiment. As shown in the figure, a method of embedding the sleeve 81 in a mounting fitting and fixing it by soldering is shown, and an example is shown in which a threaded portion is not used.

As explained above, by using the semiconductor element mounting structure of the present invention, the stud portion is directly connected to the heat radiation block, which improves heat radiation, provides a more stable grounding structure, and also provides a vibration isolation structure. The work is easy and economical, and its practical effects are remarkable.

[Brief explanation of the drawing]

Figure 1 is a front view showing the mounting structure of a conventional example;
The figure is a perspective view of a holding sleeve which is an embodiment of the present invention, FIG. 3 is a front view showing a mounting structure which is an embodiment of the present invention, and FIG. 4 is a front view showing another embodiment of the present invention. . In the figure, 1 is a semiconductor element, 2 is an integrated circuit board, 3 and 31 are mounting brackets, 4 is a printed board, 5 is a stud, 6 is a heat sink, 7 is a mounting board, and 8
81 and 9 are sleeves, 10 is a screw, 11 is a cut piece, 12 is a slit, and 31a is an abutting end surface.

Claims (1)

[Scope of utility model registration request] When a semiconductor element having a stud is attached to a ceramic substrate which is secured to a printed circuit board by a mounting bracket that also serves as a heat dissipation block, a plurality of axial cut pieces are provided at the top end of the semiconductor chip, which are fixed to the mounting bracket in advance. A mounting structure for a semiconductor element, characterized in that a stud of the semiconductor element is inserted into a sleeve and held elastically therein.