JPS6214665Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a multilayer capacitor having a composite capacitance that can be positioned and attached to a printed circuit board, an assembled board, etc. (hereinafter referred to as a board) with good workability.

Fig. 1 shows a typical example of a conventional multilayer capacitor 1 having a composite capacitance, in which a plurality of multilayer capacitors with internal electrodes 2a and 2b alternately led out from opposite end faces are arranged in parallel and integrated. It is composed of
In the figure, 3a and 3b are the internal electrodes 2a and 2.
b and an external electrode provided so as to be electrically conductively connected to the lead-out end surface thereof.

Figure 2 shows the multilayer capacitor 1 shown in Figure 1 on a substrate 4.
FIG. 3 is a side sectional view showing a state where the device is attached to the device by face bonding. The specific means of attaching this are:
Generally, the multilayer capacitor 1 is placed at a predetermined position on the substrate 4,
That is, each external electrode 3a, 3b is connected to each circuit electrode 5.
a, 5b, and fix with adhesive 6, and then solder 7 is immersed in each external electrode 3.
a, 3b and each circuit electrode 5a, 5b were conductively fixed. However, this method requires two separate steps: temporarily fixing the multilayer capacitor 1 with the adhesive 6 and permanently fixing it with the solder 7, which has the disadvantage of poor workability. In addition, in this conventional type, since the adhesive 6 is attached to the multilayer capacitor 1, various types of deterioration (carbonization, etc.) may occur in that part.
It also had the disadvantage that it was easy to cause problems and it was difficult to obtain stable characteristics. Furthermore, this conventional type has external electrodes 3a, 3b and circuit electrodes 5a, 5b of the multilayer capacitor 1.
There was also a concern that so-called air pockets were likely to occur during soldering for final fixing at the abutment bases A and A, and that sufficient solder adhesion could not be achieved. Also, in this conventional type, the external electrode 3 of the multilayer capacitor 1
Since the solder a, 3b is directly fixed to the substrate 4 by solder, the condensation force when the solder 7 solidifies is applied to the external electrode 3a, 3.
b directly, causing peeling of the external electrodes 3a and 3b,
Another disadvantage was that the multilayer capacitor 1 was cracked or chipped. Further, in this conventional device, since temporary fixation is performed using adhesive 6, there is a drawback that positional deviation is likely to occur and positioning accuracy is not sufficient. Therefore, there were concerns that it would be difficult to mount automatically using an automatic mounter or the like, and that it would not be suitable for mass production. Note that the multilayer capacitor shown in FIG. 1 is not currently in practical use due to the above-mentioned points.

The present invention has been made in view of the above-mentioned conventional points, and consists of a metal plate having positioning tongues protruding from at least one pair of external electrodes of a multilayer capacitor having a composite capacitance to be inserted into a through hole in a substrate. The gist is that the material is conductively fixed.

Embodiments of the present invention will be described below with reference to the drawings.

What is shown in FIG. 3 is a perspective view showing one embodiment of the multilayer capacitor 1 having a composite capacitance according to the present invention. It is the same as the conventional one shown in , and the same parts are designated by the same numbers. In the figure, 12a and 12b are integrally formed protruding positioning tongues 13a (not shown) and 13b that are fitted to the ends of the multilayer capacitor 1 to which the external electrodes 3a and 3b are attached, respectively. This is a metal plate with a U-shaped cross section, and its shape is clearly shown in Figure 4. As can be seen from FIG. 4, these metal bodies 12a and 12b have a U-shaped cross section with continuous cuts made in the upper and side parts, and the portions existing between the cuts are raised and bent downward to protrude. The tongue pieces 13a and 13b are used for use. In this case, the conductive connection between the metal plates 12a, 12b and the external electrodes 3a, 3b of the multilayer capacitor 1 is as follows.
Although it is sufficient to simply fit them together, it can be done more reliably by using solder or the like.

FIG. 5 is a side sectional view showing the state in which the multilayer capacitor 1 shown in FIG. 3 is attached to the substrate 14. This substrate 14 has a large number of circuit electrodes 1 on its surface.
5a, 15b are provided, and these circuit electrodes 15a,
Through holes 16a and 16b are drilled at predetermined positions, that is, arranged side by side, into which the tongue pieces 13a and 13b of the metal plates 12a and 12b of the multilayer capacitor 1 placed across the multilayer capacitor 15b are inserted (press fit is also possible). There is. 17 is a through hole 16 on this substrate 14, tongue pieces 13a, 13b.
Each metal plate 12a, 12b (external electrode 3
This is solder for conductively connecting and fixing the circuit electrodes 15a, 3b) and the circuit electrodes 15a, 15b.

In this way, the multilayer capacitor having the composite capacitance of the present invention has protruding tongue pieces 13a, 1 which are inserted into the through holes 16a, 16b of the substrate 14 and positioned.
Since the metal plates 12a and 12b have the metal plates 12a and 12b having 3b, positioning and temporary fixing in the lateral direction can be performed simply by placing it on the board 14, and the soldering process can be performed well without using adhesive or the like. This is possible. Therefore, the conventional process of applying an adhesive is completely unnecessary, and the workability is greatly improved, and there is an effect that the adverse effect of the adhesive on the capacitor can be completely eliminated. In addition, in the present invention, since the tongue pieces 13a and 13b are used for positioning, a through hole is formed in the board 14, and this also acts as an air vent hole during soldering, making the soldering extremely easy. Can be performed well. Furthermore, if the metal plate having the tongue pieces 13a and 13b is shaped to cover the external electrodes 3a and 3b of the multilayer capacitor 1, respectively, as shown in the third figure, the melting that occurs when the solder is fixed to the substrate 14 can be prevented. This has the effect that electrode peeling or cracking or chipping of the multilayer capacitor 1 due to solder condensation does not occur at all.

In addition, the multilayer capacitor of the above embodiment can have the same shape as a dual in-line component,
It can be easily handled. In particular, it becomes possible to store them side by side in, for example, a long magazine, and to automatically assemble them together with other parts using an automatic machine.

Note that the metal plate used in the multilayer capacitor with the composite capacitance of the present invention is not limited to the above-mentioned embodiments, and in short, when the multilayer capacitor is placed on the substrate,
Any device may be used as long as it has a protruding tongue piece that can be positioned, and for example, devices such as those shown in FIGS. 6 to 8 may be used. Fig. 6 shows a multilayer capacitor in which tongues 13a and 13b are provided on a metal plate attached only to each lead-out end face of the internal electrode, and Fig. 7 shows the attachment portion and the tongue piece to the lead-out end face of the internal electrode. Figure 8 shows a metal plate that is conductively connected to an external electrode on either the upper or lower surface when each external electrode of a multilayer capacitor is provided on the upper and lower surfaces. It has a tongue piece attached to it,
Various other modifications may be made without departing from the spirit of the present invention. In short, it is sufficient that the positioning tongue piece is formed protruding from a metal plate and is inserted into a through hole formed at a corresponding position of a substrate to which an external electrode of a multilayer capacitor is attached. In addition, each of the above examples shows one tongue piece formed protruding from the metal plate, but it is also possible to divide these tongue pieces as necessary.
Sufficient positioning can be achieved by providing at least one pair of metal plates having tongues. Furthermore, the length of the tongue piece should be at least as long as it can be positioned on the board, but it should be long enough to easily conductive fixation when circuit electrodes are provided on the back side of the board, for example. If kept, it can also be used as a fixing means other than for face bonding. Moreover, the acquisition of composite capacitance is not limited to each one being independent, but may also be capacitance-coupled.
Similarly, each tongue piece may be electrically coupled.

[Brief explanation of the drawing]

Figure 1 is a perspective view showing an example of the shape of a conventional multilayer capacitor with composite capacitance, Figure 2 is a side sectional view showing the state in which it is attached to a substrate, and Figure 3 is a multilayer capacitor with composite capacitance according to the present invention. FIG. 4 is a perspective view showing an example of the shape of a metal plate used in the present invention, FIG. 5 is a side sectional view showing the multilayer capacitor of the present invention attached to a substrate, and FIG. 8 are perspective views showing other examples of shapes of metal plates used in the present invention. 1... Multilayer capacitor, 2a, 2b... Internal electrode, 3a, 3b... External electrode, 12a, 12b...
...metal plate, 13a, 13b... tongue piece, 14... substrate, 16a, 16b... through hole.

Claims (1)

[Claims for Utility Model Registration] A plurality of laminated capacitors each having internal electrodes alternately led out from opposing end surfaces are arranged in parallel and are integrally constructed, and at least an external electrode is provided to each leading end surface of each internal electrode. In the multilayer capacitor having a composite capacitance, the at least one pair of parallel external electrodes 3
a, 3b, protruding positioning tongue pieces 13a, 1
The metal plates 12a and 12b having the metal plates 12a and 12b having the metal plates 12a and 12b are attached in a conductive manner, and the positioning tongue pieces are formed in through holes 16 formed at corresponding positions of the substrate 14 to which the external electrodes to which the metal plates are attached are attached.
A multilayer capacitor, characterized in that it is inserted into the capacitors a and 16b.