JPS62134957A - Semiconductor device - Google Patents

Abstract

PURPOSE:To reduce the cost of a semiconductor device and the size of an electronic device by not bonding a part of a wiring conductor plate to be bonded on an insulating substrate of the semiconductor device to a substrate, and placing it above the substrate by ending to reduce the substrate area for placing a semiconductor element, i.e., the occupying area of the semiconductor device. CONSTITUTION:A wiring pattern having a chip supporting region 11 and a wiring portion 12 is formed of a copper plate 1 on a ceramic substrate 2, electrodes on the chip are connected by aluminum wirings 7 with the wiring portion 12, a laid wiring portion 4 is not bonded to the substrate 2, and extended from the substrate 2. The not bonded wiring portion 4 is erected as shown. Thus, the occupying area of this semiconductor device is reduced by an area for bonding the wiring portion 4.

Description

[Detailed description of the invention] [Technical field to which the invention pertains]

This invention is absolutely &! A metal plate glued onto the board forms the wiring conductor, and its distribution &! The present invention relates to a semiconductor device in which a semiconductor element is mounted in a predetermined region of a conductor. °

[Prior art and its problems]

For example, when configuring a semiconductor device consisting of multiple power transistors, conventionally the transistor element body is fixed on a metal substrate, and the electrodes of the transistors and the terminal conductor, which is also fixed on the substrate via an insulating plate, are connected using conductive wires. It was connected with. However, recently, a structure has been developed in which a copper plate with a thickness of, for example, 0.3 mm is bonded onto a ceramic plate by reaction bonding or adhesive to form a wiring pattern, and a transistor element is fixed in a part of the wiring pattern. has been done. FIG. 2 shows a substrate used for such a semiconductor device, and a ceramic substrate 2
Copper plates 1 of various shapes are bonded on top. However, in such a board, since the terminal 3 is formed at one end, for example, a long wiring portion 4 may have to be routed. The area occupied by such a wiring section 4 cannot be underestimated, and therefore the dimensions of the insulating substrate 2 become large.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks and to provide a semiconductor device that can be made inexpensive by reducing the size of a substrate for mounting a semiconductor element.

[Key points of the invention]

In the semiconductor device according to the present invention, the wiring conductor metal plate bonded on the insulating substrate is continuous with the metal plate part upwardly separated from the substrate surface, so that the area of the insulating substrate for supporting this part is saved. As a result, the substrate size can be reduced and the above objective can be achieved.

[Embodiments of the invention]

FIG. 1 shows an embodiment of the present invention, and the substrate on which two transistor chips 5 and two diode chips 6 are mounted is as shown in FIG. A chip support area 11 and a wiring section 12 are provided on the substrate 2.
A wiring pattern having
connected with. However, unlike the case shown in FIG. 2, the routing wiring section 4 is not bonded to the substrate 2 and protrudes from the substrate 2. This unbonded wiring section 4 is stood up as shown in FIG. 1, so that the area occupied by this semiconductor device is smaller than the area for gluing the wiring section 4, compared to the case where the substrate shown in FIG. 2 is used. becomes smaller. When the copper plate 1 is bonded to the edge 21 of the insulating substrate 2 as shown in FIG. 4, the distance between the insulating lead surface between the copper plate 1 and the support surface of this semiconductor device at the edge of the insulating substrate 2 is small. Therefore, as shown in FIG. 1, it is desirable to make the wiring section 4 stand up at a point where it is retracted from the edge 21 of the insulating substrate. For that purpose, absolutely! [It is effective to attach a material that inhibits adhesion to the insulating substrate near the edge of the plate 2 when adhering the copper plate. However, as shown in FIG. 5, a stepped copper plate 1 may be bonded. Effects of the Invention According to the present invention, a part of the wiring conductor plate to be bonded on the insulating substrate of the semiconductor device is not bonded to the substrate, and by bending and placing it above the substrate, The area, that is, the area occupied by the semiconductor device can be reduced, and the price of the semiconductor device can be reduced. It is useful for downsizing electronic devices, and it is also effective in improving the characteristics of semiconductor devices because a large-sized semiconductor body can be mounted on the same substrate area. Furthermore, during the assembly process, part of the wiring conductor protrudes from the insulating substrate, which makes the direction of the board clear and prevents the board from being inserted into the jig in the wrong direction. It is also effective in making the process easier.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a perspective view of a conventional substrate for mounting a semiconductor element, FIG. 3 is a perspective view of a substrate used in the semiconductor device of FIG. The figure is a perspective view showing points to be noted when implementing the present invention, and FIG. 5 is a perspective view showing main parts of another embodiment of the present invention. 1: W4 board, 2: Ceramic board, 4: Pulling figure 2

Claims (1)

[Claims] 1) In a device in which a metal plate bonded on an insulating substrate forms a wiring conductor and a semiconductor element is mounted in a predetermined area of the wiring conductor, the metal plate for the wiring conductor is separated upward from the surface of the insulating substrate. A semiconductor device characterized by being continuous with a metal plate part.