JPS62134556A - Ultrasonic flaw detection equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an ultrasonic flaw detection device, and is particularly suitable for being small and capable of being carried to a flaw detection site with a till amount, and for recording data during manual flaw detection using a computer. The present invention relates to ultrasonic flaw detection equipment.

[Background of the invention]

As a conventional semi-automatic ultrasonic flaw detection device using a microcomputer, there is a 5vRI (USA) 1m Sutus 1 uTiooo series manufactured by Hitachi Construction Machinery Co., Ltd., and the like.

The former is rs of Welding Technology, October 1979, pages 45-46.
lTAR5 (Search unlt Trackin)
As shown in the paper entitled "About the Spark Gap and Recording System", it consists of a control unit, tape recorder, microphone, spark gap, etc. The spark gap is attached to a probe, and the sound waves emitted from the spark gap are received by the microphone. death,
This device calculates the position of the probe from the propagation time and records the position signal and ultrasonic signal on a tape recorder. This device has the feature of being able to measure the probe position using sound waves, but because it uses a spark gap, it requires a high-voltage power source and has problems such as constant spark noise. A replacement semi-automatic ultrasonic flaw detection device is required.6 The latter is described in Hitachi Review VOL 66 h.
Development of “Ultrasonic Measuring Instrument rLIT1000 Series” by Mr. Ogura et al. (1984-11) p65-70”
As described in the document titled, it is equipped with a touch panel, keyboard, printer, liquid crystal display, computer, etc., and the echo height and beam path are captured by the touch panel, and the defect position (however, only the relative position to the probe) is measured. ,
Display defect dimensions and record on printer. In addition, it is equipped with various software, and the operating procedure can be performed while checking each step in an interactive manner. This device is A
VG method, F/BG method, BF/BO method F Z B F
Various measurement methods such as method, scattered wave method, end echo method, 6dB drop method, attenuation measurement method, thin plate evaluation method, distance correction method, thin wall piping method, mode conversion method, JIS 23060 method, surface pressure measurement method, etc. Although it has software, it does not have the function to capture the probe position signal, so although the relative positional relationship between the probe and the defect can be determined, the absolute positional relationship of the defect cannot be determined.
Therefore, it is possible to show a diagram of the relationship between defects and weld lines (for example, in a plane view), to show the distribution of defects in terms of positional relationships in the X-Y plane, and to continuously capture echoes and display them as a cross section or plane. It is difficult to do so.

[Purpose of the invention]

An object of the present invention is to provide an ultrasonic flaw detection apparatus that can automate data recording in manual ultrasonic flaw detection, which is currently the most widely used method, and that can be made smaller and lighter.

[Summary of the Invention] The present invention is characterized by a probe position signal generator, an ultrasonic flaw detector, a microcomputer, and inputting two signals regarding the peak value and path length of the echo signal from the ultrasonic flaw detector. An ultrasonic signal acquisition circuit, a probe position acquisition circuit that inputs each signal from the probe position signal generator, and a data acquisition command display unit that commands data acquisition and displays data acquisition completion. and,
a gain input circuit that is an interface for importing the reading value of the amplification adjustment knob of the ultrasonic flaw detector;
It is equipped with keys for selecting various flaw detection methods, a function key for specifying the data import method for each flaw detection job, a keyboard for setting two conditions for interaction with the microcontroller, and ROM, RAM.
It consists of a storage section that stores flaw detection data, and a display section that displays the output of the microcomputer and data import completion, etc., and a data import command button that corresponds to the data import point for each manual flaw detection method. It is equipped with a data acquisition command panel and a data acquisition command button different from the data acquisition command button described above, and is equipped with a data acquisition command button that is different from the data acquisition command button described above. The point is that it is configured to output.

[Embodiments of the invention]

The present invention will be described below in Figures 1, 2, 7 to 9, and 1.
1, 13, 15, and 17.

Fig. 19, Fig. 21, Fig. 25, Fig. 26, Fig. 32,
Embodiments shown in FIGS. 33, 36, and 37, and FIGS. 3 to 6, 10, 12, 14, and 16.
Figures 18 and 20.

Figures 22 to 24, Figures 27 to 31, Figure 34,
This will be explained in detail using FIG. 35.

FIG. 1 is a block diagram showing an embodiment of the ultrasonic flaw detection apparatus of the present invention. In Fig. 1, 1 is a probe position signal generator, 2 is an ultrasonic flaw detector, 3 is a microcomputer, 4 is an ultrasonic signal acquisition circuit, 5 is a probe position signal acquisition circuit, and 6 is a data acquisition circuit. 7 is a gain input circuit, 8 is a function key, 9 is a keyboard, 10 is a ROM and RAM, 11 is a storage section, 12 is a display section. Orbit direction 1! (X) Signal generator 14°Arm direction position (R) and angle (θ) signal generator (hereinafter referred to as R-θ signal generator) 15. It is composed of an arm 16 and a probe holder 17.

The track 13 is attached to a pipe (subject) 18, for example. The X signal generator 14 is attached to the track 13, can be manually slid in the track direction X, and can be fixed at any position. The R-θ signal generating section 15 is attached to the X signal generating section 14, and the digit 1 of the arm 16 is 1! Convert R and rotation angle θ into electrical signals. In this way, the position of the ultrasound probe 19 is calculated from the three signals X, R, and θ.

The ultrasonic probe 19 is connected to the ultrasonic flaw detector 2 by a cable 20, and is connected to the X signal generator 14 and the R
The signal from the -θ signal generator 15 is connected to the probe position signal acquisition circuit 5 via a cable 21.

The ultrasonic signal acquisition circuit 4 inputs two signals relating to the peak value P of the echo signal output by the ultrasonic flaw detector 2 and the path T of the echo signal.

The probe position signal acquisition circuit 5 receives three signals from the probe position signal generator 1: the orbit direction signal X, the arm direction signal R, and the arm rotation angle signal θ.

The data import command display section 6 displays data import commands and data import completion.
(distance amplitude correction) capture, capture at a constant level of peak value, capture at arbitrary level of peak value, capture at arbitrary position of peak value, capture by X, Y or Y, X scanning, and others. , each has its own characteristics. 22 is a data acquisition command button, 23 is a cable for sending the data to the data acquisition command display section 6, and 24 is a data acquisition command panel.

The manual flaw detection DAC is loaded on the panel shown in FIG. 2, which shows an example of the data import command panel 24 in FIG. When using the I-comparison test piece, press the data import command display buttons 31, 32, and 33 (hereinafter abbreviated as import command buttons) for each step of 1/4.3/4.5/4. Each of the import command buttons 31 to 33 will change to 3 in the figure when import is completed.
It lights up as shown in 4 to notify that the import is complete. D
AC (2) is 1 when using the comparison test piece shown in Figure 4.
31, 32° 33. for each step from /8 to 9/8.
Press the import command buttons 35 and 36 to import the DAC
(3) is when using the comparison test piece shown in Figure 5, and as above, 31, 32 for each step from 1/8 to 5/8.
, 33, and 35 to import the data. D.A.
C(4) is the case where the comparison test piece shown in FIG. 6 is used, and 0.
For each step of steps 5 to 1.5, press the capture command buttons 31 to 33 to capture the data.

The capture of the peak value at some levels is performed using the panel shown in Fig. 7. 41 is the maximum indication capture command button, 42, 43, and 44 are the DAC 10 buttons, respectively.
These are 0%, 50%, and 20% import command buttons. After the capture is completed, each of the capture command buttons 41 to 44 lights up as indicated by 45 in the figure to notify completion of capture.

Figure 8 shows the data acquisition panel for the decibel descent method (also referred to as De method), 51 is the acquisition command button at the maximum value of the indication, 52 is 6 points below the maximum value.
53.54 indicates the acquisition command buttons at positions 12 dB and 24 dB lower than the maximum value, respectively. When capturing data, press the capture command button corresponding to the capture position, for example, 24 dB.
In the case of the descent method, when the import command button 55 is pressed, a light like 56 lights up to notify the completion of data import.

In addition to the decibel descent method, constant level methods, e.g.
There is a C%Cut method (also called the De method for the De method), and the constant level method is performed using the import command button 43 in FIG.

The H, M, and L methods are performed using the panel shown in FIG.

In this method, the comparative test pieces shown in Figures 3 to 6 or the JI
S Z 2348 A 2 type sensitivity standard test piece (STB
-A2. (see Figure 10), but here,
In the case of 5TB-A2, which shows the latter case, it is 61.62.
The 63 import command buttons each have a value of 0.5. 1,1.
53 (skip).

Here, the H line is the line indicated by 64, which indicates the reference sensitivity.
A line 65°66 having a sensitivity difference of 6 dB with respect to the H line is provided, and these are defined as the M line and the H line, and a line 67 is further provided to divide the echo height. In addition, Figure 9 shows the DAC (4) in Figure 2.
is the same as

The F/Ba method is a method that shows the magnitude of defective echo F with respect to B1 (first bottom reflection echo number) of a healthy part.In this method, data is captured using a panel shown in FIG. 71 is the defect echo capture command button;
2 is a bottom echo capture command button of the healthy part. From these, F/B o can be determined (see FIG. 12). Note that BG is a low-plane echo in a healthy area.

The F/B F method is a method that indicates the magnitude of the defect echo F with respect to B1 of the defective part. In this method, data is captured using the panel shown in FIG. Reference numeral 73 is a command button for capturing the bottom echo of the defective part, which allows F/BP to be determined (see FIG. 12).

Fall Note that BP is a top echo of the defective portion.

The edge echo method is a method of determining the depth of a crack by detecting scattered waves of ultrasonic waves generated at the tip of a crack, and is captured by the panel shown in FIG. 13. Reference numeral 75 indicates an echo F reflected back from the corner of the defect.

Echoes (TIP) 76 generated at the tip of the crack appear on the front side of F, so by pressing the capture command buttons 77 and 78 to capture them, the depth of one crack can be determined (see FIG. 14).

In the mode conversion surface wave method, for example, when an ultrasonic wave is applied to the tip of a crack, some of the ultrasonic wave is reflected back (TIP).
, the other part goes around the crack and returns due to mode conversion (MS). Therefore, by measuring the time difference between these two echoes, it is possible to measure the depth of the crack.

In FIG. 15, 81 is an echo (T I P) from the tip or defective part, and 82 is an echo (MS) that has gone around the defect surface by mode conversion. For this reason, 8
3. By capturing both echoes using the capture command button in 84, it becomes possible to measure the depth of the crack (16th
(see figure).

When ultrasonic waves propagate, the attenuation rate is Bl of the bottom echo.
, Bz,..., etc. and their propagation distances, or the ratio between the difference in echoes that propagate through the path 'I''1.''rz by changing the plate thickness and the plate thickness difference, etc. It can be found from In that case, 85 to 89 are the bottom surface multiplex echoes of B1 to BB, which are taken in from the panel shown in FIG. When importing these data, press or press import command buttons 90 to 94 to obtain the attenuation rate. When the attenuation factor is determined by changing the plate thickness, the transmission echoes Tl and T2 are captured using the capture command buttons 95 and 96, and the attenuation factor is determined (see FIG. 18).

The speed of sound is generally determined by finding the time difference between two points and dividing it by the distance traveled. In this case, 101 is a sound wave that is input to the subject or passes between one point, and 102 is a sound wave that passes through the subject or passes through a second point, which are taken in from the panel shown in FIG. Therefore, by using the capture command buttons 103 and 104 to capture the time difference, the sound wave I entering the object and the sound wave O exiting the object are captured, and the speed of sound can be determined by dividing by the thickness of the object or the distance between the two points. (See Figure 20).

Thickness is generally measured by injecting sound waves into the surface of the object.

This is done by receiving reflected waves from the bottom. In this way, when capturing and calculating the bottom echo,
Data can be taken in from the diagram and calculated by multiplying time and the speed of sound.

The AVG method was announced in 1959 by the Krautkremer company in West Germany, and is based on the German distance (A),
It is an acronym for amplitude (■) and defect size (G), and is based on the fact that a sound wave beam hits a circular plane flaw perpendicularly.

The diameter d of the circular plane scratch is given by the following equation (1).

Here, d<D D; Diameter of the transducer F; Peak value of the defect echo B; Peak value λ of the bottom echo of a steel plate with a thickness of 15+ m or less; Wavelength of the ultrasonic wave X; Distance from the surface of the object to the defect Therefore, in the case of the AVG method, 105 is a bottom echo (Bo) from a steel plate with a thickness of 15 m++ or less, and 106 is an echo (F) from a defect in the object, which is captured by the panel shown in FIG. Import these using the import command buttons 107 and 108.

Determine the diameter d of the defect using equation (1) (Fig. 22).

(See Figure 23).

FIG. 24 shows the principle of the 6-tandem method, which is an effective method for detecting vertical defects occurring in a specimen. 2
Using two probes 111 and 112, one probe 111
An ultrasonic beam is input from the probe 112, and the echo 114 reflected by the defect 113 is received by the other probe 112. Regarding data capture using this method, data at the position of the Max point is captured by using the seventh [capture command button 41].

The electronic DAC method electronically adjusts the peak value of the echo to a constant level. The data acquisition method varies depending on the test piece, but in the case of the comparative test pieces shown in Figures 3 to 6, the data acquisition method is as follows:
~ 119 import command button, and the first
In the case of the standard test piece 5TB-A2 shown in Figure 0, the 25th
115 to 118 for each skip depending on the panel shown in the figure.
Import using the import command button. However, when acquiring each data, the operation procedure for selecting individual data using a gate circuit (not shown) of the ultrasonic flaw detector 2 is the same as in the conventional method.

An example of the case where the above-mentioned data import command panel is expressed as one panel is shown in FIG. 26. In the same figure, 2. ．． 7,8,9,11゜13.17,19,2
The reference numbers (31 to 119) of the import command buttons in FIGS. 1 and 25 are shown. These results show that it is possible to capture data from many flaw detection methods with one panel.

Table 1 shows the relationship between the data import command panel described above and various flaw detection methods.

In Table 1, the mark (0) is shown as an example of application of the present invention. In the case of manual flaw detection, it leaves much to the inspector's judgment and has the characteristic of allowing only the necessary signals to be captured. Therefore, once the flaw detection method is determined, the data acquisition method is also determined, and the inspector only acquires data for the required number of points. The number of data acquisition points is equal to the number of acquisition command buttons shown on each data acquisition panel. These buttons can be shared. As shown in FIG. 26, data for Na 1 to 15 in Table 1 can be taken in with one panel. Further, as shown in FIG. 1, when the data import command panel 24 is made remote, the handling efficiency is further improved. Note that the DAC in Table 1 indicates distance amplitude correction and UT ultrasonic flaw detection.

To import data at any level of the peak value (on the X and Y axes), press the data import command button 22° cable 23 in Figure 1.
and the display unit 12. For example, the display section 12 is
It consists of a display section using liquid crystal, etc.

FIG. 27 shows an example of a display of a flaw detection trajectory on a liquid crystal display. In FIG. 27, 120 indicates a welding line, and 121 indicates the position of the maximum value of the indication. Place the probe in the maximum position, turn on the data acquisition command button 22 in Figure 1, and while looking at the 1 display 12, move the probe on the X-axis or Y
The Yl or xl display element on the Y-axis or the X-axis, which scans on the axis and continuously captures data, has an angle of 121°
22.123. ...or 124,125. The data is imported in the order of...The position where the data is imported is
As shown in 121 to 125, the brightness is changed to notify completion of the capture.

The wave height value is captured at an arbitrary position using the display section 12 shown in FIG. 28. 126 is the capture position of the maximum value of the indication. In this case, turn on the data import command button 22 in FIG. 1 to import the data. To capture an arbitrary position (xt, yt) of 127, data is captured by scanning the probe with the data capture command button 22 in FIG. 1 turned on. The location where the data was captured is
As shown at 126° and 127, the brightness is changed to notify the completion of the capture.

If it is desired to capture data using the X-Y scanning method, this is done using the display section 12 shown in FIG. 131 is the position at which the maximum value of the indication is taken.

132 is a data acquisition position by X-Y scanning; 131.
132. . . . Data is taken in sequentially by X-Y scanning, 133 is the beam direction, and P indicates the scanning pitch.

If it is desired to capture data using the Y-X scanning method, this is done using the display section 12 shown in FIG. 135 is the position where the maximum value of the indication is captured.

136 is the data acquisition position by Y-X scanning, 135.
136. Data is taken in sequentially by Y-X scanning as shown in the figure, 137 is the beam direction, and P indicates the scanning pitch.

Although FIGS. 29 and 30 above show the case of flaw detection in the direction perpendicular to the weld line, there is also flaw detection in the weld line direction (or flaw detection in the circumferential direction), and this case is shown in FIG. 31. 1
41 is the maximum value capture position of the indicator, 1
42 is the data acquisition position by X-Y scanning, 141,1
42. . . . Data is taken in sequentially by X-Y scanning.

Reference numeral 143 indicates the beam direction, and P indicates the scanning pitch.

27 to 30 can also be applied to the thickness measurement described above. For thickness measurements, continuous measurements may be required, at any level, at any position.

X-Y scanning, Y-X scanning, etc. are suitable.

Table 2 shows examples of flaw detection using the display unit 12.

Table 2 In Table 2, the mark (0) is shown as an application example of the present invention. In the case of the display unit 12, it is possible to import data at any single peak value and at any position, which is significantly different from the conventional manual flaw detection procedure, and inspection can be performed by simply moving the probe6. It is difficult to interfere with the inspector's judgment and has the characteristic of imparting objectivity to the data.

Subsequently, the gain input circuit 7 in FIG.
This is an interface for importing the reading value of the amplification adjustment knob (not shown) of the flaw detector 2, which allows the inspector to read and set the gain of the flaw detector 2, and import it into the computer.

The function key 8 includes keys for various flaw detection methods shown in Tables 1 and 2, and specifies a data acquisition method for each flaw detection operation.

The keyboard 9 is used to set conditions for interaction with the microcomputer 3 .

The ROM and RAM10 are equipped with software, instructions, data areas, etc. for the various flaw detection methods shown in Tables 1 and 2, and take in flaw detection data in an orderly manner.

The storage unit 11 is made of a semiconductor or magnetic storage medium, and temporarily stores the flaw detection data in a cassette or the like. After the flaw detection is completed, the cassette is set offline in a general-purpose data processing computer located in an office or inspection room, where the data is input, analyzed, processed, organized, and used for creating various charts.

The display unit 12 displays the output of the microcomputer 3, completion of data acquisition, etc. using, for example, a liquid crystal display.

FIG. 32 shows an embodiment of a basic flowchart for manual flaw detection using the apparatus according to the present invention.

First, "selection of flaw detection method" is performed using the function key 8.

Here, for example, it is assumed that the Nα2DAC% method (FIG. 7) in Table 1 is selected. Next, it is necessary to use the keyboard 9 to "set flaw detection conditions" (date, welding number, inspector, probe, flaw detector, etc.) and to create an rDAC curve. Input command buttons 31, 32, 33
A DAC curve is created using the comparison test piece shown in FIG. After creating the DAC curve, "gain value setting" of the gain input circuit 7 is performed, "data recording" is performed using the data acquisition command display section 6, and the "data acquisition display" is lit to complete the process.

An example of the echo distribution in this case is shown in FIG.

FIG. 33 shows the pipe (subject) 18 of FIG. 1 expanded into a flat plate. Here, 150 is the echo distribution in the X-axis direction along the weld line 120.

151 is an echo distribution in the Y-axis direction perpendicular to the weld line 120.

The captured echo is 41-1 (maximum value), 42-1 to 44
-4 (DA0100%), 43-1 to 43-4 (D
AC50%), 44-1 to 44-4 (DAC20%)
This is 13 points. These are imported using the import command button 41 in Figure 7.
, 42 and 44 respectively.

Data acquisition is performed using position signals X and R of the ultrasound probe 19.
, 0, the peak value P of the echo F shown in FIG. 34, and the echo path T shown in FIG.

An example of the format of data stored in the storage unit 11 is shown in FIG. 35.
-4 indicates the captured echo of FIG.

As is clear from FIG. 35, in the case of FIG.

As can be seen from the fact that the capacity of the storage unit 11 for one defect light is 104 bytes, the ultrasonic flaw detection device according to the present invention makes it possible to significantly reduce the amount of data to be captured. .

FIG. 36 shows the ultrasonic signal acquisition circuit 4 of FIG. Probe position acquisition circuit 5. FIG. 6 is a detailed configuration diagram showing an embodiment of the data acquisition command display section 6, the gain input circuit 7, and the function key 9. FIG.

The output signal bone of the ultrasonic flaw detector 2 is divided into a wave height value P and a path length T, and the wave height value P is output from the A/D of the ultrasonic signal acquisition circuit 4.
The converter 201 converts the path T into a digital signal, the counter 202 converts the path T into a digital signal, and these signals are sent to the microcomputer 3 via the input board 203.
will be sent to.

The probe position acquisition circuit 5 converts the output voltages of the X, R, and θ position signal generating potentiometers 204, 205, 206 into digital signals using A/D converters 207, 208, and 209, and converts them into digital signals using the input board 210. The data is sent to the microcomputer 3 via the .

The data retrieval command display section 6 generates an interrupt signal for data retrieval and displays the completion of data retrieval, and is composed of a switch group 211 and a lamp group 212. however,
Some switches and lamps are not shown. Although these are housed in pairs, they are shown separately here. Data import command panel 2 of data import command display section 6
20 can be replaced and made remote, and can be extended close to the probe 19 via a table like the data acquisition command panel 24. A signal from the data acquisition command display section 6 is connected to the microcomputer 3 via an input/output board 213.

The gain input circuit 7 includes a digital switch 214 and an input board 215, and the gain value is set by the inspector.

The function key 8 includes a function selection switch 2162, a selection completion indicator lamp 217. It is composed of an input board 218,
Displays two selections of various flaw detection methods.

In addition, the storage unit 11 stores the captured data on the cassette 2.
Store it in 19th grade. The cassette 219 may be a storage medium such as an IC, a bubble, a floppy disk, or a magnetic tape, and its selection criteria include small size, light weight, and environmental resistance. The data recorded in the cassette 219 is brought from the flaw detection site to an office or inspection room, where it is input into a general-purpose computer for data processing through off-line processing, where it is analyzed, processed, and organized into a plan view, cross-sectional view, and evaluation list. etc., to facilitate defect evaluation.

FIGS. 37(a) to 37(c) are flowcharts showing one embodiment of the operation of the microcomputer 3 shown in FIGS. 1 and 36, and are shown to facilitate understanding of the present invention.

First, in step 230 of FIG. 37(a), one of Ha 2 to 14 in the first table and &1 to 6 in the second table is selected using the selection switch 216 of the function key 8. Next, in step 231, flaw detection conditions are set. The flaw detection conditions are set using the keyboard 92 and display section 12. Detection conditions include date 1 and welding number.

There are inspectors, probes, flaw detectors, etc., and the necessary contents such as analysis of flaw detection results, organization, drawing, filing, filing, etc. are entered in advance.

Then, in step 232, it is determined whether it is necessary to create a DAC,
If necessary, create a DAC in step 233.
C is created in the manner shown in FIGS. 2 and 25.

After creating the DAC, the gain value at that time is set by the digital switch 214 of the gain input circuit 7 in step 234.

With the above, the flaw detection criteria have been completed and flaw detection work begins. The DAC% method in step 240 takes in data according to the flowchart of (2). In step 241, M a
x, take in the value. a indicates the data import command display button in FIG. 26; Completion of data acquisition is indicated by lighting of lamp a in step 242. Next, in step 243, data on the +Y fine axis is imported.b-d indicates the data import command display button in Fig. 26.Data import is completed in step 24.
This is shown by the lighting of lamps b-d at 4. Similarly, on the −Y axis, +
The data on the X axis and the -x axis are captured in steps 245 to 250, and the completion of the data capture is displayed. Here, θ~g+h=, j+k−m respectively indicate data import command buttons in FIG. In step 251, the captured data is transferred to the storage unit 11, lamps and the like are returned to their initial values, and if the captured data is completed in step 252, the process ends.

Step 260 is for the dB descent method, and in this case as well, data is taken in according to the flowchart (2). The same applies to the DAC%Cut method in step 270.

In the case of the HM L, ml method in step 280, data is imported according to the flowchart of ■, steps 281 to 280.
284 imports the Max value and displays the completion of the import.

The F/Ba method 290 takes in data according to the flowchart (2). Steps 291-293 are.

Capture the defect echo and bottom echo, and complete the capture.
nHdg p indicates the data import command button in FIG.

The F/Br method 300 takes in data according to the flowchart shown in (■) in FIG. 37(a).

The edge echo method 310 incorporates data according to the flowchart (■) in FIG. 37(b). Steps 311 to 316 in the flowchart (2) take in the Max value and terminal echo, and complete the taking.

Hereinafter, mode conversion method 320. Attenuation rate 330°Sound speed 340. Measured in thick dots) 350. Each step of the AVG method 360 is shown in the flow sheet ■, ■, in FIG. 37(b).
Input the data by ■, ■, and ■, respectively, where,
Py he g+crystal 1 rj s.

Symbols such as t and n indicate data import command buttons in FIG. 26, respectively.

Step 370 of the tandem method in FIG.
Data is imported according to the flowchart (■) in FIG. 7(a), and in step 380, the data acquisition pitch is set. In step 381, the probe is placed at the Max position and the data acquisition command switch 22 is turned on. Any level (X.

In step 390 of determining the position (on the Y-axis), if it is at an arbitrary level, step 391 determines Max x, ± around the position.
Import data on the X-axis and ±Y-axis.

In this case, the scanning trajectory display in step 392 displays the scanning trajectory of the probe on the display unit 12 to notify completion of data acquisition. In step 393, the captured data is transferred to the storage unit 11, and the scanning locus and the like are set to initial values.In step 394, the next data is captured, and the capturing is completed and the process ends.

In step 400 of determining an arbitrary position (xy plane),
In the case of an arbitrary position, in step 401, data at the arbitrary position is taken in with the Max position as the center.

The scanning locus in this case is displayed in step 392 described above.

Step 410 for determining XY scan (pitch Y) Step 420 for determining YX scan (pitch X) Welding line direction (
In the case of step 430 for determining the circumferential direction (circumferential direction) and step 440 for determining the circumferential direction (circumferential direction), step 411
, 421, 431, and 441, the probe is scanned around the position M a x and data are continuously acquired. In these cases, the scanning locus is displayed in step 392 in the same manner as described above.

According to the embodiment of the present invention described above, the method of data recording in manual ultrasonic flaw detection, which is currently the most widely used method, is to first import the M a x value by pressing a button, and then, for example, , the distribution of echoes on the Y-axis or the X-axis can be captured. In particular, for entrusting scanning, import commands, etc. to humans.

The data recording unit is small and lightweight, making it ideal for manual flaw detection in nuclear power plants, etc., by transporting the data recording unit to the flaw detection site and automatically recording flaw detection data while manually scanning the ultrasonic probe. suitable. Also, the drive device has
When using the -R-θ device, unlike the x-y device which only performs rectangular scanning, arbitrary scanning can be performed, so flaw detection can be performed with a feeling more similar to manual scanning. Furthermore, by using a panel to capture various data necessary for manual flaw detection, it is easy to confirm the data capture and it is possible to capture data reliably. By converting these panels into software, the data import command display section 6 and the display section 12 can be integrated, which can further reduce the size and weight, and can be expected to bring great industrial benefits.

In FIG. 1, an X-R-〇 drive device is used as the position signal generating device 1, but an x-y drive device may be used.

Also, the data import command button 22 in FIG.

If it is a voice input circuit, etc., the buttons need not be pressed by hand, and in addition, although the data acquisition units 4 to 12 using the ultrasonic flaw detector 2 and the microcomputer 3 are shown in different images in Fig. 1, these 2 to 12 may be integrated.

No. 2, 7゜8.9, as flaw detection data import command panel.
Figures 11, 13, 15, 17, 19, 21° 25 show various types of imports, but only the respective operation buttons are shown glossy on the panel in Figure 26, but the workmanship is similar to that of Flame 20. This is possible by making the - panels removable and attaching dedicated panels for each.

In addition, the 271st display unit 12! The data import completion display shown in Figures 1 to 31 is for selecting each flaw detection method using the function key 8 and importing data under those flaw detection conditions. be.

In the present invention, the conventional manual flaw detection method has been described as a panel, but if each panel is converted into software, the data acquisition command display section 6 and the display section 12 shown in FIG. 1 can be integrated to form only the display section 12. This makes it possible to display the data import command and completion on the display unit 12 and import the flaw detection data.

(Effects of the Invention) As explained above, according to the present invention, it is possible to record data by self-tracking in manual ultrasonic flaw detection, which is currently the most widely used method, and to make the device compact and compact. This has the effect of reducing weight.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing an embodiment of the ultrasonic flaw detection device of the present invention, FIG. 2, FIG. 7, FIG. 8, FIG. 9, FIG.
Figures 43, 15, and 17. Figures 19, 21, and 25 are diagrams for each flaw detection method of the data import command panel in Figure 1, and Figures 3 to 6 respectively.
Each figure shows a comparative test piece, Fig. 10 shows a 5TB-A2 test piece, Fig. 12, Fig. 14, Fig. 16, Fig. 18, Fig. 20
11 and 1, respectively.
Figures 3 and 15. Explanatory drawings corresponding to Figs. 17, 19, and 21, 2nd
Figure 4 is a diagram showing the principle of the tandem method, Figure 26 is a diagram showing an example of a collection of cases of each flaw detection method on the data import command panel in Figure 1, and Figures 27 to 31 are diagrams showing the principles of the tandem method. FIG. 32 is a flowchart showing an embodiment of the ultrasonic flaw detection apparatus of the present invention; FIG.
The figure shows an example of echo capture when performing flaw detection using the ultrasonic flaw detection device of the present invention, FIG. 34 is an A scope waveform diagram at each capture point, and FIG. 35 is the storage section of FIG. 1. 36 is a detailed configuration diagram showing an embodiment of the main part of the ultrasonic flaw detection device of the present invention, and FIG. 37 is a diagram showing an example of the format of the flaw detection data stored in 3 is a flowchart showing an example of the operation of FIG. 1... Probe position signal generator, 2... Ultrasonic flaw detector, 3... Microcomputer, 4... Ultrasonic signal acquisition circuit,
5... Probe position signal acquisition circuit, 6... Data acquisition command display section, 7... Gain input circuit, 8... Function key, 9... Keyboard, 10... ROM and R.A.
M, 11...Storage section, 12...Display section, 14...
X signal generation section, 15...R-θ signal generation section, 16...
- Arm, 17... Probe holder, 18... Subject, 19... Ultrasonic probe. 20.21.23...cable, 22...data import service 7 mouth 1st q mouth 10 no 11th trouble 13 contagion 19 mouth 26 mouth 27 mouth fast 28 Figure also 2? I! ] 30th country 31st opening, -11#-r 33rd closing figure 37

Claims (1)

[Claims] 1. An ultrasonic flaw detection device for manual flaw detection that transmits and receives ultrasonic waves to detect defects, thinning, etc. in a test object, and records flaw detection data such as probe position and ultrasonic signals. , a probe position signal generator, an ultrasonic flaw detector, a microcomputer, an ultrasonic signal acquisition circuit that inputs two signals relating to a peak value and a path of an echo signal from the ultrasonic flaw detector; a probe position signal acquisition circuit that inputs each signal from the probe position signal generator; a data acquisition command display unit that issues a data acquisition command and displays the completion of the acquisition; and the ultrasonic flaw detector. It is equipped with a gain input circuit, which is an interface for importing the reading value of the amplification adjustment knob, and keys for selecting various flaw detection methods.A function key is used to specify the data import method for each flaw detection operation, and the above-mentioned Consists of a keyboard for interacting with the microcomputer and setting conditions, ROM, RAM, a storage section for storing flaw detection data, and a display section for displaying the output of the microcomputer and completion of data import, etc., and can be used for various manual flaw detection methods. A data acquisition command panel has a data acquisition command button corresponding to each data acquisition point, and a data acquisition command button different from the data acquisition command button, and a probe position signal,
An ultrasonic flaw detection device characterized by being configured to capture the peak value and path length of an echo signal and at the same time output a signal indicating the completion of capture. 2. The ultrasonic flaw detection apparatus according to claim 1, wherein the probe position signal generating device includes an orbit direction position signal generating section and an arm direction position and angle signal generating section. 3. The data acquisition command display section is configured such that the data acquisition command panel is detachable, and the panel and the display section are connected with a cable, and when the panel is placed near the probe, the data on the panel is displayed. The ultrasonic flaw detection device according to claim 1 or 2, wherein the acquisition command button is operable. 4. The gain input circuit is capable of reading the gain of the ultrasonic flaw detector, setting a gain value of the gain input circuit, and importing the gain value into the microcomputer. The ultrasonic flaw detection device according to item 1 or 3. 5. The display unit is configured to display the scanning locus of the probe, etc. on a liquid crystal display, as claimed in claim 1 or 2.
The ultrasonic flaw detection device according to item 3 or 4. 6. The ultrasonic flaw detector, microcomputer, ultrasonic signal acquisition circuit, contact position signal acquisition circuit, data acquisition command display section, gain input circuit, function keys, keyboard, ROM, RAM
The ultrasonic flaw detection apparatus according to claim 1 or 2 or 3 or 4 or 5, wherein the storage section and the display section are integrated. 7. The data import command panel is configured so that it can be used in common for multiple types of flaw detection methods.
The ultrasonic flaw detection device according to item 6 or item 6.