JPS62131534A - Jig for semiconductor wafer handling - Google Patents

Abstract

PURPOSE:To take out wafers without damaging them and also, easily when the wafers are taken out of a carrier by providing the pushing-out control parts which adjust the pushing-out positions of the wafer supporting stands and the pushing-out driving parts which energize the wafer supporting stands in the direction of pushing out. CONSTITUTION:A pushing-out control part (a) which adjusts the pushing-out position of each wafer supporting stand 7 consists of stoppers 10 and stopper stop parts 8 and has an operating element 15 capable of being operated from outside so as to be able to push out the supporting stand 7 to the purposive position or fix it. Each pushinng-out driving part (b) has a spring 9, a spring upper fixing pin 13 and a spring lower fixing pin 14 and a pair of the pushing- out driving parts are arranged on both ends of the wafer supporting stand 7. The wafer supporting stand 7 being fixed on a jig main body 5 by the pushing-out stopper stops 8 and the pushing-out part stoppers 10 is moved by the operating element 15, the pushing-out part stoppers 10 are separated from the pushing-out stopper stops 8 and the wafer supporting stand 7 is made to move to a required position along a slit 12 by the reaction of the spring 9 or manual operation.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor wafer handling jig for pushing wafers out of a wafer storage box called a carrier used in semiconductor manufacturing.

[Conventional technology]

In semiconductor manufacturing, wafers are stored in wafer storage boxes called carriers, and are processed, inspected, and transported. The carrier is made to the minimum necessary size for the purpose of downsizing manufacturing equipment and ease of handling the carrier itself. The carrier has a pair of grooves facing each other on the inner walls of opposite sides of the carrier for storing wafers;
A plurality of pairs of grooves are formed in the number of wafers to be accommodated in the horizontal direction.

As mentioned above, the carrier is made to the minimum necessary size, so the distance between a pair of facing grooves made in the carrier and an adjacent pair of facing grooves is very narrow. It has become.

[Problem that the invention seeks to solve]

Therefore, when taking out a wafer from a carrier as necessary, there is a risk that tweezers, vacuum chucks, etc., which are a type of jigs for taking out the wafer, may damage the wafer, or the wafer to be taken out and the wafer in the stored state may come into contact with each other. Or, it is often the case that one side suffers a loss.
Ndring was required to be cautious.

In addition, when transferring Uni-No- from one carrier to another, there is no simple manual jig, and the carrier containing the wafer and the empty carrier are aligned at the top, and the bottom of the carrier containing the wafer is raised. A common method that does not use large equipment is to transfer wafers by utilizing the wafer's fall due to its own weight. With this method, when raising the bottom of the carrier, a large impact force was applied to the wafer, often resulting in the wafer being chipped or cracked.

The present invention provides a Hunt 9 ring jig that allows a wafer stored in a carrier to be easily removed from the carrier without damaging the wafer.

[Means for solving problems]

The present invention is characterized by having a wafer support that is removably provided in the jig main body, an extrusion control unit that adjusts the extrusion position of the wafer support, and an extrusion drive unit that biases the wafer support in the extrusion direction. This is a semiconductor wafer handling jig.

〔Example〕

Next, an embodiment of the present invention will be described with reference to the drawings. 1 to 3 are schematic diagrams of a jig 1 according to the present invention. The jig 1 of the present invention has a box-shaped jig main body 5, a wafer support stand 7,
A plurality of slits 12 are provided in which the support table 7 accommodated in the slits 12 is provided with a plurality of slits 12 in which the support table 7 is housed in a retractable manner. The main body 5 is provided with an extruder stopper and a stopper 8 for adjusting the extrusion position, and further includes an extrusion drive section that biases the support base 7 in a direction to extrude it out of the main body.

The slots 12 are designed to match the spacing between the wafers stored in the carrier, and a single wafer 3 is pushed out by a single wafer support 7. Reference numeral 6 indicates a strike that regulates the amount by which the support base 7 is pushed.

It's par.

The upper surface of the wafer support stand 7 that supports the wafer has a concave groove 7& to prevent the wafer from slipping and to fix the wafer.

The extrusion control unit that adjusts the extrusion position of the wafer support table 7 is composed of a /''-10 and a stopper 8, so that the support table 7 can be extruded to a desired position or fixed. It has an operator 15 that can be operated from the outside.
, has a lower fixing hole 14, and a wafer support stand 70.
A pair is installed at each end.

The spring 9 is used to automatically move the wafer support stand 7 upward, but when manually moving it upward or downward, the operator 15 is pushed down and pulled up.

In one embodiment, when moving the wafer support stand 7, the wafer support stand 7 fixed to the jig main body 5 is operated by the pusher stopper 9-stop 8 and the pusher stopper 10. Move the pusher 15 to stop the extrusion part t4-IQ
is separated from the extrusion stopper 8, and the wafer support 7 is moved along the slits 12 to a required position by the reaction of the spring 9 or manually. Thereafter, the extrusion part stopper 10 and the extrusion part stopper stopper 8 are joined together, and the wafer support stand 7 is fixed.

FIG. 4 shows an embodiment using the jig 1 according to the present invention. In the figure, a carrier 2 is placed on the top of the jig 1,
Wafer support stand 7 corresponding to the wafer you want to extrude after that
is operated with the operator 15 to pull it upward, and the support base 7 is moved between the extrusion part stopper stopper 8 and the extrusion part stopper/#.
-I Q to fix it in the desired position. By pulling up the support stand 7, only the wafer 3 (or 4) corresponding to the extruded wafer support stand 7 is supported by the support stand 7 and pushed upward.

In FIG. 5, the jig 1 according to the present invention is pushed into the bottom of the carrier 2 in which wafers are stored, and the wafers are transferred to an empty carrier 11. This shows one example.

〔Effect of the invention〕

As explained above, the jig according to the present invention can push out the wafer stored in the carrier placed above the jig according to the present invention to a determined position by moving the wafer extrusion part.・-It is easy to handle and has the effect of preventing damage to the wafer that occurs during wafer handling, and the wafer support mount is pushed out to the leading edge and the upper part is in contact with the fixed state.
By pushing the jig according to the present invention between carriers facing each other from the bottom of one of the carriers in which the wafer is stored, the wafer can be transferred in a short time without damage to the wafer. There is.

Furthermore, the jig according to the present invention has the advantage that it has a simple structure, is small in size and is about the same size as a carrier, can be manufactured at a low cost, is easy to transport, and requires a sufficient amount of installation space.

[Brief explanation of drawings]

Fig. 1 is a schematic diagram of the jig according to the present invention, Fig. 2 is a front view of Fig. 1, Fig. 3 is a side view of Fig. 1, and Figs. 4 and 5 are examples of use of the jig of the present invention. FIG. 1... Jig, 2... Carrier, 3, 4.16...
Wafer, 5... Jig body, 6... Stopper, 7
...Ueno-support stand, 8... Extrusion part stopper, 9... Spring, 10... Extrusion part stopper,
12...Slit, 13...Spring upper fixing pin, 1
4... Spring lower part fixing pin, 15... Operator.

Claims (1)

[Claims] (1) In a jig for taking out a wafer from a carrier, a wafer support stand retractably provided in the jig body;
A semiconductor wafer handling jig comprising: an extrusion control section that adjusts the extrusion position of a wafer support; and an extrusion drive section that urges the wafer support in a direction to extrude.