[go: up one dir, main page]

JPS62125619U - - Google Patents

Info

Publication number
JPS62125619U
JPS62125619U JP1986013326U JP1332686U JPS62125619U JP S62125619 U JPS62125619 U JP S62125619U JP 1986013326 U JP1986013326 U JP 1986013326U JP 1332686 U JP1332686 U JP 1332686U JP S62125619 U JPS62125619 U JP S62125619U
Authority
JP
Japan
Prior art keywords
display
substrate
light
display board
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986013326U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986013326U priority Critical patent/JPS62125619U/ja
Publication of JPS62125619U publication Critical patent/JPS62125619U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Instrument Panels (AREA)
  • Arrangements Of Lighting Devices For Vehicle Interiors, Mounting And Supporting Thereof, Circuits Therefore (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Description

【図面の簡単な説明】
第１図は表示板の部分斜視図、第２図は表示装
置の断面図、第３図は表示板の部分断面図、第４
図は表示板の他の態様を示す部分断面図、第５図
は表示板が取り付けられた表示装置の正面図、第
６図は従来の表示板の部分斜視図、第７図は従来
の表示装置の断面図、第８図は従来の表示装置の
他の態様を示す断面図、第９図は同様にさらに他
の態様を示す断面図である。 表示層……２、表示板……３、基板……４、表
示部……５ａ、光源……６、光反射層……１１。

Claims (1)

    【実用新案登録請求の範囲】
  1. 透明又は半透明な基板４の表面に表示層２が形
    成された表示板であつて、前記基板４の裏面側に
    設けられた光源６からの光を前記基板４の裏面に
    当てて前記表示層２の文字、図形、記号等の表示
    部５ａを透光させて視認できるようにした表示板
    ３において、前記裏面の最上面に光反射層１１を
    設けたことを特徴とする表示板。
JP1986013326U 1986-01-31 1986-01-31 Pending JPS62125619U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986013326U JPS62125619U (ja) 1986-01-31 1986-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986013326U JPS62125619U (ja) 1986-01-31 1986-01-31

Publications (1)

Publication Number Publication Date
JPS62125619U true JPS62125619U (ja) 1987-08-10

Family

ID=30802281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986013326U Pending JPS62125619U (ja) 1986-01-31 1986-01-31

Country Status (1)

Country Link
JP (1) JPS62125619U (ja)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6871656B2 (en) 1997-05-27 2005-03-29 Tokyo Electron Limited Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process
US6890853B2 (en) 2000-04-25 2005-05-10 Tokyo Electron Limited Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module
US6921456B2 (en) 2000-07-26 2005-07-26 Tokyo Electron Limited High pressure processing chamber for semiconductor substrate
US6926012B2 (en) 1999-11-02 2005-08-09 Tokyo Electron Limited Method for supercritical processing of multiple workpieces
US7001468B1 (en) 2002-02-15 2006-02-21 Tokyo Electron Limited Pressure energized pressure vessel opening and closing device and method of providing therefor
US7021635B2 (en) 2003-02-06 2006-04-04 Tokyo Electron Limited Vacuum chuck utilizing sintered material and method of providing thereof
US7077917B2 (en) 2003-02-10 2006-07-18 Tokyo Electric Limited High-pressure processing chamber for a semiconductor wafer
US7140393B2 (en) 2004-12-22 2006-11-28 Tokyo Electron Limited Non-contact shuttle valve for flow diversion in high pressure systems
US7163380B2 (en) 2003-07-29 2007-01-16 Tokyo Electron Limited Control of fluid flow in the processing of an object with a fluid
US7186093B2 (en) 2004-10-05 2007-03-06 Tokyo Electron Limited Method and apparatus for cooling motor bearings of a high pressure pump
US7225820B2 (en) 2003-02-10 2007-06-05 Tokyo Electron Limited High-pressure processing chamber for a semiconductor wafer
US7250374B2 (en) 2004-06-30 2007-07-31 Tokyo Electron Limited System and method for processing a substrate using supercritical carbon dioxide processing
US7270137B2 (en) 2003-04-28 2007-09-18 Tokyo Electron Limited Apparatus and method of securing a workpiece during high-pressure processing
US7307019B2 (en) 2004-09-29 2007-12-11 Tokyo Electron Limited Method for supercritical carbon dioxide processing of fluoro-carbon films
US7435447B2 (en) 2005-02-15 2008-10-14 Tokyo Electron Limited Method and system for determining flow conditions in a high pressure processing system
US7434590B2 (en) 2004-12-22 2008-10-14 Tokyo Electron Limited Method and apparatus for clamping a substrate in a high pressure processing system
US7491036B2 (en) 2004-11-12 2009-02-17 Tokyo Electron Limited Method and system for cooling a pump
JP2013242487A (ja) * 2012-05-22 2013-12-05 Dainippon Printing Co Ltd カバー部材およびカバー部材を備えた照明装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60252324A (ja) * 1984-05-28 1985-12-13 Nippon Denso Co Ltd 車両用液晶表示装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60252324A (ja) * 1984-05-28 1985-12-13 Nippon Denso Co Ltd 車両用液晶表示装置

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6871656B2 (en) 1997-05-27 2005-03-29 Tokyo Electron Limited Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process
US6926012B2 (en) 1999-11-02 2005-08-09 Tokyo Electron Limited Method for supercritical processing of multiple workpieces
US7208411B2 (en) 2000-04-25 2007-04-24 Tokyo Electron Limited Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module
US6890853B2 (en) 2000-04-25 2005-05-10 Tokyo Electron Limited Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module
US6921456B2 (en) 2000-07-26 2005-07-26 Tokyo Electron Limited High pressure processing chamber for semiconductor substrate
US7255772B2 (en) 2000-07-26 2007-08-14 Tokyo Electron Limited High pressure processing chamber for semiconductor substrate
US7001468B1 (en) 2002-02-15 2006-02-21 Tokyo Electron Limited Pressure energized pressure vessel opening and closing device and method of providing therefor
US7021635B2 (en) 2003-02-06 2006-04-04 Tokyo Electron Limited Vacuum chuck utilizing sintered material and method of providing thereof
US7225820B2 (en) 2003-02-10 2007-06-05 Tokyo Electron Limited High-pressure processing chamber for a semiconductor wafer
US7077917B2 (en) 2003-02-10 2006-07-18 Tokyo Electric Limited High-pressure processing chamber for a semiconductor wafer
US7270137B2 (en) 2003-04-28 2007-09-18 Tokyo Electron Limited Apparatus and method of securing a workpiece during high-pressure processing
US7163380B2 (en) 2003-07-29 2007-01-16 Tokyo Electron Limited Control of fluid flow in the processing of an object with a fluid
US7250374B2 (en) 2004-06-30 2007-07-31 Tokyo Electron Limited System and method for processing a substrate using supercritical carbon dioxide processing
US7307019B2 (en) 2004-09-29 2007-12-11 Tokyo Electron Limited Method for supercritical carbon dioxide processing of fluoro-carbon films
US7186093B2 (en) 2004-10-05 2007-03-06 Tokyo Electron Limited Method and apparatus for cooling motor bearings of a high pressure pump
US7491036B2 (en) 2004-11-12 2009-02-17 Tokyo Electron Limited Method and system for cooling a pump
US7140393B2 (en) 2004-12-22 2006-11-28 Tokyo Electron Limited Non-contact shuttle valve for flow diversion in high pressure systems
US7434590B2 (en) 2004-12-22 2008-10-14 Tokyo Electron Limited Method and apparatus for clamping a substrate in a high pressure processing system
US7435447B2 (en) 2005-02-15 2008-10-14 Tokyo Electron Limited Method and system for determining flow conditions in a high pressure processing system
JP2013242487A (ja) * 2012-05-22 2013-12-05 Dainippon Printing Co Ltd カバー部材およびカバー部材を備えた照明装置

Similar Documents

Publication Publication Date Title
JPS62125619U (ja)
JPS62201786U (ja)
JPS63135112U (ja)
JPS6159461U (ja)
JPS62140567U (ja)
JPH035190U (ja)
JPH0275693U (ja)
JPH01115771U (ja)
JPS62189200U (ja)
JPS6291213U (ja)
JPH036606U (ja)
JPS6417584U (ja)
JPH02119686U (ja)
JPH0380488U (ja)
JPH0331786U (ja)
JPS62162181U (ja)
JPH0358676U (ja)
JPH0192624U (ja)
JPH02104389U (ja)
JPH02107186U (ja)
JPH0470543U (ja)
JPH0192625U (ja)
JPS62187799U (ja)
JPS62193288U (ja)
JPH0192687U (ja)