JPS62122300A - Electromagnetic shielding molded product - Google Patents
Electromagnetic shielding molded productInfo
- Publication number
- JPS62122300A JPS62122300A JP60261461A JP26146185A JPS62122300A JP S62122300 A JPS62122300 A JP S62122300A JP 60261461 A JP60261461 A JP 60261461A JP 26146185 A JP26146185 A JP 26146185A JP S62122300 A JPS62122300 A JP S62122300A
- Authority
- JP
- Japan
- Prior art keywords
- molded product
- electromagnetic shielding
- shielding molded
- resin
- fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 11
- 239000004917 carbon fiber Substances 0.000 claims description 11
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- 239000004745 nonwoven fabric Substances 0.000 claims description 6
- 229920002430 Fibre-reinforced plastic Polymers 0.000 claims description 5
- 239000011151 fibre-reinforced plastic Substances 0.000 claims description 5
- 239000002657 fibrous material Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 description 9
- 229920003023 plastic Polymers 0.000 description 9
- 239000004744 fabric Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 239000007924 injection Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000792 Monel Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、電磁波シールド性のみならず耐熱性と吸音性
とを兼備した電磁波シールド成形品に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an electromagnetic shielding molded product that has not only electromagnetic shielding properties but also heat resistance and sound absorption properties.
近年、電子技術の進歩に伴って、コンピュータ、通信機
器、プリンターなどの電子機器や事務機器が多数使用さ
れるようになり、成形加工性、軽量化およびコストダウ
ン等の面で優れていることからこれらの機器にプラスチ
ック製のハウジングが多用されるようになってきた。し
かし、プラスチックは上記利点を有する反面、静電気障
害、電磁波障害などの新たな問題が生じてきた。In recent years, with the advancement of electronic technology, a large number of electronic devices and office equipment such as computers, communication equipment, and printers have come into use. Plastic housings are increasingly being used for these devices. However, although plastics have the above-mentioned advantages, new problems have arisen such as static electricity interference and electromagnetic interference.
また一方、自動車業界においても、軽量化とエレクトロ
ニクス化が急ピンチで進んでおり、電子燃料噴射装置や
センサー、ＩＣを組み込んだ各種の制御装置が出ている
が、これらの電子部品も電波障害に弱く、必然的にシー
ルドが要求されている。さらに、近年、自動車も軽量化
のために、プラスチック化が進んでおり、プラスチック
の導電化が必要となっている。On the other hand, in the automobile industry, weight reduction and electronicization are rapidly progressing, and various control devices incorporating electronic fuel injection devices, sensors, and ICs are being produced, but these electronic components are also susceptible to radio wave interference. It is weak and requires a shield. Furthermore, in recent years, automobiles have increasingly been made of plastic in order to reduce their weight, and it has become necessary to make plastics conductive.
従来、これらの問題を解決するため、プラスチックに導
電性フィラーを添加する方法が検討されているが、プラ
スチックに多量の導電性フィラーを均一に混入しなけれ
ば良好な導電性、電磁波シールド性が得られないという
欠点がある。しかし、多量に導電材料を混入すると、プ
ラスチックの基本特性が損なわれ、強度が低下したり、
外観が悪くなるというような問題がある。In order to solve these problems, methods of adding conductive filler to plastic have been considered, but good conductivity and electromagnetic shielding properties cannot be obtained unless a large amount of conductive filler is evenly mixed into the plastic. The disadvantage is that it cannot be used. However, when a large amount of conductive material is mixed in, the basic properties of plastic are impaired, the strength is reduced,
There are problems such as poor appearance.
これらの問題点を改善するために、導電性材料のマット
やクロス等と補強用の非導電性材料のマット、クロス等
を積層させ、ポリマーを含浸又は注型して成形した電磁
波シールド成形品が検討されているが、従来のシールド
成形品は、耐熱性と吸音性の両特性を共に満足するよう
なものはなかった。In order to improve these problems, electromagnetic shielding molded products are made by laminating conductive material mats, cloth, etc. and non-conductive material mats, cloth, etc. for reinforcement, and then impregnating or casting with polymer. Although this has been studied, there has been no conventional shield molded product that satisfies both heat resistance and sound absorption properties.
本発明は、このような事情にかんがみなされたものであ
って、電子計算機や、プリンターおよび通信機類等の電
子機器並びに事務機器や自動車の電子燃料噴射装置、セ
ンサー、ｒｃを組み込んだ制御装置などから漏れる電磁
波を有効にシールドし、かつまた誤動作を防止すると共
に、耐熱性と吸音性とに優れた電磁波シールド成形品を
提供することを目的とする。The present invention was conceived in view of the above circumstances, and is applicable to computers, electronic devices such as printers and communication devices, electronic fuel injection devices for office equipment and automobiles, sensors, control devices incorporating RC, etc. The purpose of the present invention is to provide an electromagnetic wave shielding molded product that effectively shields electromagnetic waves leaking from the device, prevents malfunctions, and has excellent heat resistance and sound absorption properties.
このため、本発明は、導電性の繊維材料に樹脂を含浸さ
せて形成した少なくとも１層の繊維補強プラスチック層
の外側に熱可塑性樹脂からなる外層を、前記繊維補強プ
ラスチック層の内側に炭素繊維不織布からなる内層を積
層した積層体からなることを特徴とする電磁波シールド
成形品を要旨とするものである。For this reason, the present invention provides an outer layer made of a thermoplastic resin on the outside of at least one fiber-reinforced plastic layer formed by impregnating a conductive fiber material with a resin, and an outer layer made of a thermoplastic resin on the inside of the fiber-reinforced plastic layer. The gist of this invention is an electromagnetic shielding molded product characterized by being made of a laminate having an inner layer laminated thereon.
以下、図を参照して本発明の構成について詳しく説明す
る。Hereinafter, the configuration of the present invention will be explained in detail with reference to the drawings.
第１図は、本発明の電磁波シールド成形品の一例のプラ
スチック製ハウジングの断面図である。第１図において
、２は繊維補強プラスチック層（以下、ＦＲＰＦという
）である。このＦＲＰ層２は、少なくとも１層配置され
ている。FIG. 1 is a sectional view of a plastic housing that is an example of the electromagnetic shielding molded product of the present invention. In FIG. 1, 2 is a fiber reinforced plastic layer (hereinafter referred to as FRPF). At least one FRP layer 2 is arranged.
ＦＲＰ層２は、導電性の繊維材料に樹脂を含浸させてな
るものである。導電性の繊維材料としては、例えば、金
属繊維、炭素繊維が挙げられる。金属繊維としては、Ｆ
ｅｚ Ｃｕ−、Ｎｓ−、Ａ （１、プラス、ステンレス
、モネル、錫被覆鋼、錫銅被覆鋼からなる織布もしくは
編物が好適である。The FRP layer 2 is made of a conductive fiber material impregnated with resin. Examples of the conductive fiber material include metal fibers and carbon fibers. As a metal fiber, F
ez Cu-, Ns-, A (1, plus, woven or knitted fabrics made of stainless steel, Monel, tin-coated steel, and tin-copper-coated steel are suitable.
炭素繊維は、２０００℃以上で焼成した黒鉛質のカーボ
ン繊維である。樹脂は、例えば、エポキシ樹脂、不飽和
ポリエステル樹脂等の液状樹脂である。ＦＲＰ層２とし
ては、例えば、これらの金属繊維又は炭素繊維の織布も
しくは編物に樹脂を含浸させ、加熱、乾燥させたプリプ
レグの状態で使用される。The carbon fiber is graphitic carbon fiber fired at 2000°C or higher. The resin is, for example, a liquid resin such as an epoxy resin or an unsaturated polyester resin. The FRP layer 2 is used, for example, in the form of a prepreg prepared by impregnating a woven or knitted fabric of these metal fibers or carbon fibers with a resin, heating and drying the impregnated fabric.
ＦＲＰ層２の外側には、熱可塑性樹脂からなる外層１が
積層゛されている。熱可塑性樹脂としては、例えば、塩
化ビニル樹脂、ＡＢＳ樹脂、ポリスチレン、ポリアミド
、ポリカーボネート、ポリエチレンテレフタレート、ポ
リブチレンテレフタレート、ポリフェニレンオキシド、
ポリエチレン、ポリプロピレン等の射出成形可能な樹脂
が用いられる。On the outside of the FRP layer 2, an outer layer 1 made of thermoplastic resin is laminated. Examples of thermoplastic resins include vinyl chloride resin, ABS resin, polystyrene, polyamide, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyphenylene oxide,
Injection moldable resins such as polyethylene and polypropylene are used.
ＦＲＰ層２の内側には、炭素繊維不織布からなる内層３
が積層されている。炭素繊維不織布は、例えば、２００
０℃以上で焼成した黒鉛質の不織布マットもしくはフェ
ルトである。Inside the FRP layer 2, there is an inner layer 3 made of carbon fiber nonwoven fabric.
are layered. The carbon fiber nonwoven fabric is, for example, 200
It is a graphite nonwoven mat or felt fired at 0°C or higher.
本発明の電磁波シールド成形品は、ＦＲＰ層２の外側に
外層ｌを、内側に内層３を積層した積層体からなるもの
である。これらの層を積層させるには、例えば、適当な
接着剤を介して行なえばよい。The electromagnetic shielding molded product of the present invention consists of a laminate in which an outer layer 1 is laminated on the outside of an FRP layer 2, and an inner layer 3 is laminated on the inside. These layers may be laminated, for example, using a suitable adhesive.
以上説明したように本発明の電磁波シールド成形品は、
ＦＲＰ層の外側に熱可塑性樹脂からなる外層を配すると
共にＦＲＰ層の内側に炭素繊維不織布からなる内層を配
した積層体からなるので、ＦＲＰ層中の金属繊維もしく
は炭素繊維が高導電性のため電磁波を有効にシールドで
き、さらに、ＦＲＰ層の内側に設けた炭素繊維不織布に
より耐熱性と吸音性とを兼ね備えることが可能となる。As explained above, the electromagnetic shielding molded product of the present invention is
It is a laminate consisting of an outer layer made of thermoplastic resin on the outside of the FRP layer and an inner layer made of carbon fiber nonwoven fabric on the inside of the FRP layer, because the metal fibers or carbon fibers in the FRP layer are highly conductive. Electromagnetic waves can be effectively shielded, and the carbon fiber nonwoven fabric provided inside the FRP layer can provide both heat resistance and sound absorption.
第１図は本発明の電磁波シールド成形品の一例のプラス
チック製ハウジングの断面図である。
１・・・熱可塑性樹脂からなる外層、２・・・ＦＲＰ層
、３・・・炭素繊維不織布からなる内層。FIG. 1 is a sectional view of a plastic housing that is an example of the electromagnetic shielding molded product of the present invention. 1... Outer layer made of thermoplastic resin, 2... FRP layer, 3... Inner layer made of carbon fiber nonwoven fabric.
Claims (1)
とも１層の繊維補強プラスチック層の外側に熱可塑性樹
脂からなる外層を、前記繊維補強プラスチック層の内側
に炭素繊維不織布からなる内層を積層した積層体からな
ることを特徴とする電磁波シールド成形品。A laminate comprising at least one fiber-reinforced plastic layer formed by impregnating a conductive fiber material with a resin, an outer layer made of a thermoplastic resin on the outside, and an inner layer made of a carbon fiber nonwoven fabric on the inside of the fiber-reinforced plastic layer. An electromagnetic shielding molded product characterized by consisting of a body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60261461A JPS62122300A (en) | 1985-11-22 | 1985-11-22 | Electromagnetic shielding molded product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60261461A JPS62122300A (en) | 1985-11-22 | 1985-11-22 | Electromagnetic shielding molded product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62122300A true JPS62122300A (en) | 1987-06-03 |
Family
ID=17362215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60261461A Pending JPS62122300A (en) | 1985-11-22 | 1985-11-22 | Electromagnetic shielding molded product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62122300A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5165985A (en) * | 1991-06-28 | 1992-11-24 | Minnesota Mining And Manufacturing Company | Method of making a flexible, transparent film for electrostatic shielding |
-
1985
- 1985-11-22 JP JP60261461A patent/JPS62122300A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5165985A (en) * | 1991-06-28 | 1992-11-24 | Minnesota Mining And Manufacturing Company | Method of making a flexible, transparent film for electrostatic shielding |
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