JPS62113521A - Powder resin molding device - Google Patents
Powder resin molding deviceInfo
- Publication number
- JPS62113521A JPS62113521A JP60252674A JP25267485A JPS62113521A JP S62113521 A JPS62113521 A JP S62113521A JP 60252674 A JP60252674 A JP 60252674A JP 25267485 A JP25267485 A JP 25267485A JP S62113521 A JPS62113521 A JP S62113521A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- metal body
- heating
- metallic body
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/18—Slush casting, i.e. pouring moulding material into a hollow mould with excess material being poured off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
- B29C33/06—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using radiation, e.g. electro-magnetic waves, induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/34—Component parts, details or accessories; Auxiliary operations
- B29C41/46—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0811—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using induction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/16—Cooling
- B29C2035/1616—Cooling using liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/16—Cooling
- B29C2035/1658—Cooling using gas
- B29C2035/1666—Cooling using gas dried air
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Moulding By Coating Moulds (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は粉末樹脂成形に用いる装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an apparatus used for powder resin molding.
現在、自動車部品に使用しているインストルメントパネ
ルの製造方法として、粉末樹脂成形法が知られている。Powder resin molding is currently known as a method for manufacturing instrument panels used in automobile parts.
この粉末樹脂成形では、外面に熱媒配管が溶接された厚
さ3.5論−程度のニッケル類の金型が使用され。In this powder resin molding, a nickel metal mold with a thickness of approximately 3.5 mol/m is used and a heat transfer pipe is welded to the outer surface.
この熱媒配管内に高温の油を流すことにより、金型を2
20℃程度に加熱し、その内面に塩ビ系樹脂粉末(例え
ば、ポリビニールクロライド)を振りかけ、金型内面に
接触した粉末を溶融させ、その後金型を冷却することに
より樹脂を硬化させ、成形を行っている。By flowing high temperature oil into this heat transfer pipe, the mold is
The mold is heated to about 20°C, PVC resin powder (e.g. polyvinyl chloride) is sprinkled on the inner surface of the mold, the powder in contact with the inner surface of the mold is melted, and then the mold is cooled to harden the resin and molding is performed. Is going.
ここで金型材料としてニッケルが使用されているのは。Nickel is used as the mold material here.
錆びない、成形品の脱型性が良い、細かい模様が消えな
い等の利点があるためである。This is because it has advantages such as not rusting, good demoldability of molded products, and fine patterns that do not disappear.
ところが、かかる従来の金型では、金型を構成するニッ
ケルの熱伝導率が低いため、温度分布が不均一になり2
例えば熱媒配管に接触している部分は高温に加熱される
が、配管と配管との間の部分の温度が低くなり、この為
成形品の厚みむらが生じ易いという問題点があった。ま
た、金型の伝熱能力が低いため、加熱。However, in such conventional molds, the thermal conductivity of nickel that constitutes the mold is low, resulting in uneven temperature distribution.
For example, the part that is in contact with the heat medium pipes is heated to a high temperature, but the temperature of the part between the pipes is low, which causes a problem in that the thickness of the molded product is likely to be uneven. In addition, the heat transfer capacity of the mold is low, so heating is not possible.
冷却時間が長くかかり、生産性が悪く、更に、*雑な形
状の成形品を作る場合には、加熱装置の取付が困難であ
り、一層温度分布が不均一となり、製品の品質が悪くな
る等の問題点もあった。It takes a long time to cool down, poor productivity, and when making molded products with irregular shapes, it is difficult to install a heating device, resulting in even more uneven temperature distribution and poor product quality. There were also problems.
本発明はかかる従来の問題点に鑑みて為されたもので、
金型の温度むらを減少させ2且つ加熱及び冷却を敏速に
行い得る粉末樹脂成形装置を提供することを目的とする
。The present invention has been made in view of such conventional problems.
An object of the present invention is to provide a powder resin molding apparatus that can reduce temperature unevenness in a mold and quickly perform heating and cooling.
本発明は、上記問題点を解決するため、金型の内面即ち
、粉末樹脂に接触して溶融する溶融面即ち成形面を形成
するニッケル等の熱伝導率の小さい金属体に対し、その
外側に熱伝導の良い金属体1例えば銅を、溶射、メッキ
、ライニング、ロー材は等で接合して設けるという構成
を備えたものである。In order to solve the above-mentioned problems, the present invention has been developed to provide a metal body with low thermal conductivity such as nickel that forms the inner surface of the mold, that is, the melting surface that melts in contact with the powdered resin, that is, the molding surface. The metal body 1, which has good thermal conductivity, such as copper, is provided by being bonded by thermal spraying, plating, lining, brazing, etc.
本発明では、上述のように熱伝導の悪い金属に熱伝導の
良い金属を接合したので、全体としての熱伝導が向上し
、均等で安定した温度分布が得られると共に。In the present invention, as described above, since a metal with good thermal conductivity is bonded to a metal with poor thermal conductivity, the overall heat conduction is improved and an even and stable temperature distribution can be obtained.
敏速な加熱、冷却が可能となる。また、金型の形状によ
っては加熱しにくい部分が生じ2温度の不均一が生じや
すいが、加熱しにくい部分では、熱伝導の良い金属体の
厚みを増すことや材質を変化させることにより。Enables rapid heating and cooling. Also, depending on the shape of the mold, there may be areas that are difficult to heat, which can lead to uneven temperatures, but in areas that are difficult to heat, we can increase the thickness of the metal body, which has good heat conductivity, or change the material.
一層均一な加熱が可能になる。金型の加熱には、従来と
同様、熱媒を通す配管を用いることも可能であるが。More uniform heating becomes possible. For heating the mold, it is also possible to use piping through which a heat medium passes, as in the past.
この代りに燃焼ガスによる加熱、高周波誘導加熱等の高
速加熱を使用することもできる。誘導加熱を採用する場
合には、速やかかつ一様な加熱が可能であり、更に誘導
加熱コイルと金型外面との距離の調整、或いは誘導加熱
コイルの巻線間隔の調整によって一層金型の均一な加熱
が可能となる。更に、金型の加熱しにくい部分或いは大
熱量を必要とする部分には1強磁性の金属片或いは固体
を接合して2発熱量を増し2均一な加熱を図ることもで
きる。Alternatively, high-speed heating such as heating by combustion gas or high-frequency induction heating may be used. When induction heating is used, rapid and uniform heating is possible, and further uniformity of the mold can be achieved by adjusting the distance between the induction heating coil and the outside surface of the mold, or by adjusting the winding spacing of the induction heating coil. heating is possible. Furthermore, it is also possible to bond a ferromagnetic metal piece or solid to parts of the mold that are difficult to heat or require a large amount of heat to increase the amount of heat generated and to achieve uniform heating.
以下3図面に示す本発明の詳細な説明する。 The present invention will be described in detail below with reference to the three drawings.
第1図は本発明の一実施例の断面図、第2図は全体の概
略斜視図である0本発明になる粉末樹脂成形装置は、粉
末樹脂に接触して加熱溶融させる金型1と、その金型1
の反対側に設けられ、金型1を加熱する誘導加熱コイル
2とを有する。金型1は少なくとも粉末樹脂に接触して
溶融させる溶融面3Aを形成する第一金属体3と、その
外面に接合して設けられる第二金属体4とからなる。第
一金属体3は前記したように、粉末樹脂を溶融する溶融
面即ち成形面を形成するものであるので、耐食性、耐摩
耗性、成形品の脱型性等に優れていることが望ましく、
これらの点からニッケルが好適である。一方、第二金属
体4は、第一金属体3のみでは大きい温度分布が生じる
ので、これを防ぐために設けており、極力熱伝導率の大
きい金属1例えば銅が好適である。第二金属体4の形成
は、メンキ、溶射。FIG. 1 is a cross-sectional view of an embodiment of the present invention, and FIG. 2 is a schematic perspective view of the whole. The powder resin molding apparatus of the present invention includes a mold 1 that contacts and heats powder resin to melt it; The mold 1
It has an induction heating coil 2 that is provided on the opposite side of the mold 1 and heats the mold 1. The mold 1 includes at least a first metal body 3 forming a melting surface 3A that contacts and melts powdered resin, and a second metal body 4 bonded to the outer surface of the first metal body 3. As mentioned above, the first metal body 3 forms the melting surface for melting the powdered resin, that is, the molding surface, so it is desirable that it has excellent corrosion resistance, abrasion resistance, demoldability of molded products, etc.
From these points of view, nickel is preferred. On the other hand, the second metal body 4 is provided to prevent a large temperature distribution from occurring if only the first metal body 3 is used, and is preferably made of a metal having as high thermal conductivity as possible, such as copper. The second metal body 4 is formed by coating or thermal spraying.
ライニング、ロー材は等で可能であるが、この他にも。Lining, raw material, etc. are possible, but there are other options as well.
あらかじめ第二金属体4を別型として作っておき、これ
を第一金属体3に接合させる方法でもよい。この場合、
第一金属体3と第二金属体4との間に、ロー材を注入し
2両者間の確実な伝熱を図ることが好ましい。Alternatively, the second metal body 4 may be made as a separate mold in advance and then joined to the first metal body 3. in this case,
It is preferable to inject brazing material between the first metal body 3 and the second metal body 4 to ensure reliable heat transfer between the two.
第二金属体4の厚みは、金型全体に渡って一定にする必
要はなく、加熱しにくい部分或いは大熱量を必要とする
部分(例えば、突出部3a)では、他の部分よりも厚く
してもよい。このようにすると、伝熱量を増加できるの
で、加熱温度の均一化が可能となる。また。The thickness of the second metal body 4 does not need to be constant over the entire mold; it may be thicker in areas that are difficult to heat or require a large amount of heat (for example, the protrusion 3a) than in other areas. It's okay. In this way, the amount of heat transfer can be increased, so that the heating temperature can be made uniform. Also.
厚みを増す代りに、熱伝導率の更に良い材質を部分的に
使用しても同様な効果が得られる。A similar effect can be obtained by partially using a material with better thermal conductivity instead of increasing the thickness.
金型1の外面側に配置される誘導加熱コイル2は。The induction heating coil 2 is placed on the outer surface of the mold 1.
金型lの所望の位置を誘導加熱するように配置される。It is arranged to inductively heat a desired position of the mold l.
このコイル2は金型とのクリアランスにより、或いは。This coil 2 is determined by the clearance with the mold or.
巻線相互の間隔により1発生熱量が変化するので、この
クリアランス及び巻線間隔は、金型1に生じる温度差が
許容範囲内になるように、設定される。即ち、必要とさ
れる加熱熱量が大きい場所では、クリアランスを小さく
、或いは巻線間隔を小さくシ、その他の場所ではその逆
にすることにより、温度の均一化が図れる。Since the amount of heat generated changes depending on the distance between the windings, the clearance and the distance between the windings are set so that the temperature difference generated in the mold 1 is within an allowable range. That is, in places where a large amount of heating heat is required, the clearance or the winding spacing can be made small, and in other places the temperature can be made uniform.
なお、金型外面の必要部分に強磁性の金属片又は固体を
接合して設けることにより、誘導電流による発熱量を増
加させて、温度の均一化を図ることも可能である。Note that by bonding and providing a ferromagnetic metal piece or solid to a necessary portion of the outer surface of the mold, it is also possible to increase the amount of heat generated by the induced current and to equalize the temperature.
誘導加熱コイル2は電源5に接続されている。The induction heating coil 2 is connected to a power source 5.
上記構造の粉末樹脂成形装置では、誘導加熱コイJし2
により金型1が誘導加熱され、所定温度に上昇すると、
その内面3Aに樹脂粉末が振りかけられ、その粉末樹脂
は内面3Aで溶融される。その後、金型lを水スプレー
による水冷或いは空気吹付けによる空冷等により冷却す
ると、溶融樹脂が硬化し、その後脱型することにより、
成形品が製造される。In the powder resin molding apparatus with the above structure, the induction heating coil J2
When the mold 1 is induction heated and the temperature rises to a predetermined temperature,
Resin powder is sprinkled on the inner surface 3A, and the powdered resin is melted on the inner surface 3A. After that, when the mold l is cooled by water cooling by water spray or air cooling by air blowing, the molten resin hardens, and then the mold is demolded.
A molded article is manufactured.
ところで、誘導加熱により金型加熱を行う場合、金型の
熱伝導率が小さいと、均一な加熱が困難であり。By the way, when heating a mold by induction heating, if the thermal conductivity of the mold is low, uniform heating is difficult.
均一に加熱するための、誘導加熱コイルの設計(金型に
対するクリアランス、巻線相互の間隔等)が困難である
。第3図は本発明者が金型1の材質と誘導加熱コイル2
の配置とによる金型の温度分布を測定した結果を示す図
である。第3図において、金型lは第1図のものと同一
形状をしており、材質として(alステンレス。It is difficult to design an induction heating coil (clearance to the mold, spacing between windings, etc.) to ensure uniform heating. Figure 3 shows the material of the mold 1 and the induction heating coil 2.
It is a figure which shows the result of measuring the temperature distribution of a metal mold|die by arrangement|positioning. In Fig. 3, the mold l has the same shape as that in Fig. 1, and is made of aluminum stainless steel.
+bl銅、(C)ステンレスと銅の複合材のものを用意
し、誘導加熱コイル2は図に示すように上になるに従い
金型からのクリアランス及び巻線間隔を大きくしている
。+bl copper and (C) a composite material of stainless steel and copper are prepared, and the clearance from the mold and the winding interval are increased as the induction heating coil 2 goes up as shown in the figure.
この金型及びコイルによる昇温テストを行ったところ。We conducted a temperature rise test using this mold and coil.
第3図にfat、 (bl、 (C1で示す温度曲線を
得た0曲線(alはステンレスの金型1曲線fblは銅
の金型1曲線(C1はステンレスと銅の複合材の金型を
示している。この実験結果から明らかなように、ステン
レスのように金型の熱伝導率が小さいと、金型温度が不
均一になり、従ってこれを均一にするには、誘導加熱コ
イルを正確に設計しなければならないが、熱伝導率の小
さいステンレスに対して熱伝導の良い材質を接合するこ
とにより、金型温度の不均一さが改良されている。この
ため、誘導加熱コイルの設計が容易となり、比較的簡単
な構造の誘導加熱コイルで均一な加熱が可能となる。Figure 3 shows fat, (bl, (0 curve obtained from the temperature curve shown as C1) (al is the stainless steel mold 1 curve fbl is the copper mold 1 curve (C1 is the stainless steel and copper composite mold) As is clear from this experimental result, if the thermal conductivity of the mold is low, such as stainless steel, the mold temperature will be uneven. However, by joining a material with good thermal conductivity to stainless steel, which has a low thermal conductivity, the unevenness of the mold temperature has been improved.For this reason, the design of the induction heating coil has been improved. This makes it possible to achieve uniform heating using an induction heating coil with a relatively simple structure.
なお、上記実施例では金型の加熱に誘導加熱を利用して
いるが、これに限らず、他の任意の加熱方法を用いても
差し支えない、しかし1図示実施例の誘導加熱を用いる
と1通常の熱媒による加熱に比べ、昇温、冷却時間を短
縮できる利点が得られる。即ち、熱媒加熱による場合に
は、熱媒の加熱温度に限界が有るため。In addition, although induction heating is used to heat the mold in the above embodiment, it is not limited to this, and any other heating method may be used. However, if the induction heating of the illustrated embodiment is used, Compared to heating using a normal heating medium, this method has the advantage of shortening the temperature raising and cooling times. That is, when using heat medium heating, there is a limit to the heating temperature of the heat medium.
昇温時間を十分には短縮できないが、誘導加熱では出力
調整により急速な昇温が可能であり、また冷却の場合に
も、熱媒使用の場合には油入替に時間を要するきらいが
あるが9誘導加熱の場合には単に水をスプレーすること
により敏速に冷却でき、冷却速度を短縮できる。Although the heating time cannot be shortened sufficiently, induction heating allows for rapid temperature rise by adjusting the output, and in the case of cooling, when using a heat medium, it tends to take time to replace the oil. 9 In the case of induction heating, cooling can be done quickly by simply spraying water, and the cooling rate can be shortened.
以上のように5本発明は粉末樹脂の成形に用いる金型を
、樹脂成形に必要な特性の成形面を提供する第一金属体
と、その外面に設けられる熱伝導の良い第二金属体とで
構成したので、金型に必要な脱型性、耐食性。As described above, the present invention provides a mold used for molding powdered resin, which includes a first metal body that provides a molding surface with characteristics necessary for resin molding, and a second metal body that is provided on the outer surface and has good heat conduction. It has the demoldability and corrosion resistance required for molds.
耐摩耗性等を犠牲にすることなく、全体としての熱伝導
率を大きくすることができ、均一な加熱が可能となり品
質が向上するばかりでなく、加熱、冷却に必要な時間を
短縮でき生産性を向上させることができるという効果を
有している。更に1本発明の装置は、単に粉末樹脂の溶
融成形のみならず、他の金属、非金属材料等の加熱成形
にも応用できるものである。The overall thermal conductivity can be increased without sacrificing wear resistance etc., which not only enables uniform heating and improves quality, but also reduces the time required for heating and cooling, increasing productivity. It has the effect of being able to improve the Furthermore, the apparatus of the present invention can be applied not only to melt molding of powdered resin, but also to heat molding of other metals, nonmetallic materials, and the like.
第1図は本発明の一実施例の断面図、第2図はその実施
例の全体を概略的に示す斜視図、第3図は種々な材質の
金型による昇温テスト結果を示す図である。
!−金型 2−誘導加熱コイル
3−第一金属体 3A−書容融面
4−第二金属体
特許出願人 第一高周波工業株式会社
代理人 弁理士 乗 松 恭 三
少1 図
温泉
第3図
手続補正書
昭和61年 7月12日
特許庁長官 宇 賀 道 部 殿
16事件の表示
昭和60年特許願第252674号
2、発明の名称
粉末樹脂成形装置
3、補正をする者
事件との関係 特許出願人
住 所 東京都中央区築地1丁目13番10号名称
第一高周波工業株式会社
(代表者)平田厚生
4、代理人 ■1)6
6、補正により増加する発明の数 0+1) 特許
請求の範囲を別紙の通り補正する。
(2) 明細書第4頁第20行目の「厘体の厚み−−
−−−−−を変化させる」を「厘体の厚みや材質を変化
させる」に補正する。
(3) 明細書第6頁第14行目から第20行目の「
第二金属体−・−・−・得為れる。」を次のように補正
する。
「なお、第二金属体4の厚みは、金型全体に渡って一定
とする必要はなく、かつ加熱しにくい部分或いは大熱量
を必要とする部分(例えば、突出部3a)には。
強磁性体を貼りつけてもよい。また、熱伝導率の更に良
い材質を部分的に使用する場合もある。」「2、特許請
求の範囲
(1) 粉末樹脂に接触して加熱溶融させる金型と、
該金型を加熱する装置とからなり、前記金型が少なくと
も粉末樹脂に接触して溶融させる溶融面を形成する第一
金属体と、その外面に接合して設けられた。前記第一金
属体よりも熱伝導率の良い第二金属体とを有しているこ
とを特徴とする粉末樹脂成形装置。
(2)前記第一金属体と第二金属体とが2両者の間にロ
ー材を注入して接合されていることを特徴とする特許請
求の範囲第1項記載の粉末樹脂成形装置。
(3)前記第一金属体の加熱温度の調節のため、前記第
二金属体の厚み及び材質を場所的に異ならせていること
を特徴とする特許請求の範囲第1項又は第2項記載の粉
末樹脂成形装置。
(4)前記金型を加熱する装置が、該金型の外面に設け
られた誘導加熱コイルよりなることを特徴とする特許請
求の範囲第1項から第3項のいずれか1項に記載の粉末
樹脂成形装置。
(5)前記第一金属体の加熱温度の調節のため、前記誘
導加熱コイルと金型との間隔を場所的に異ならせている
ことを特徴とする特許請求の範囲第4項に記載の粉末樹
脂成形装置。
(6) 前記第一金属体の加熱温度の調節のため、前
記誘導加熱コイルの巻線間隔を場所的に異ならせている
ことを特徴とする特許請求の範囲第4項又は第5項に記
載の粉末樹脂成形装置。
(7) 前記第一金属体の加熱温度の調節のため、金
型外面の所要部分の加熱誘導コイル付近に9強磁性の金
属片又は固体を接合していることを特徴とする特許請求
の範囲第4項から第6項のいずれが1項に記載の粉末間
服成形装置。」Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is a perspective view schematically showing the entire embodiment, and Fig. 3 is a diagram showing the results of temperature rise tests using molds made of various materials. be. ! -Mold 2-Induction heating coil 3-First metal body 3A-Book melting surface 4-Second metal body Patent applicant Daiichi Koshuha Kogyo Co., Ltd. Agent Patent attorney Kyo Matsu Sansho 1 Figure Onsen Figure 3 Procedural amendment July 12, 1988 Michibu Uga, Commissioner of the Patent Office 16 Indication of the case 1985 Patent Application No. 252674 2 Name of the invention Powder resin molding device 3 Person making the amendment Relationship to the case Patent Applicant address: 1-13-10 Tsukiji, Chuo-ku, Tokyo Name
Daiichi Koshuha Kogyo Co., Ltd. (Representative) Kosei Hirata 4, Agent ■1) 6 6. Number of inventions increased by amendment 0+1) The scope of claims will be amended as shown in the attached sheet. (2) “Thickness of the body” on page 4, line 20 of the specification
----" is corrected to "change the thickness and material of the body." (3) `` from line 14 to line 20 on page 6 of the specification.
A second metal body can be obtained. ” is corrected as follows. ``The thickness of the second metal body 4 does not need to be constant over the entire mold, and may be applied to areas that are difficult to heat or areas that require a large amount of heat (for example, the protrusion 3a).Ferromagnetic Alternatively, a material with better thermal conductivity may be partially used.'' 2. Claims (1) A mold that heats and melts powdered resin by contacting it. ,
The first metal body forms a melting surface that contacts and melts at least the powdered resin, and the first metal body is connected to the outer surface of the first metal body. A powder resin molding apparatus comprising: a second metal body having a higher thermal conductivity than the first metal body. (2) The powder resin molding apparatus according to claim 1, wherein the first metal body and the second metal body are joined by injecting a brazing material between the two. (3) In order to adjust the heating temperature of the first metal body, the thickness and material of the second metal body are made to vary depending on the location, according to claim 1 or 2. powder resin molding equipment. (4) The device for heating the mold comprises an induction heating coil provided on the outer surface of the mold. Powder resin molding equipment. (5) The powder according to claim 4, wherein the distance between the induction heating coil and the mold is varied depending on the location in order to adjust the heating temperature of the first metal body. Resin molding equipment. (6) In order to adjust the heating temperature of the first metal body, the distance between the windings of the induction heating coil is varied depending on the location, according to claim 4 or 5. powder resin molding equipment. (7) In order to adjust the heating temperature of the first metal body, a ferromagnetic metal piece or solid is bonded to a required portion of the outer surface of the mold near the heating induction coil. The powder dressing molding apparatus according to any one of Items 4 to 6 as described in Item 1. ”
Claims (7)
型を加熱する装置とからなり、前記金型が少なくとも粉
末樹脂に接触して溶融させる溶融面を形成する第一金属
体と、その外面に接合して設けられた、前記第一金属体
よりも熱伝導率の良い第二金属体とを有していることを
特徴とする粉末樹脂成形装置。(1) A first metal body comprising a mold that contacts powdered resin and heats it to melt it, and a device that heats the mold, the mold forming at least a melting surface that contacts and melts the powdered resin; , and a second metal body having a higher thermal conductivity than the first metal body, the second metal body being bonded to the outer surface of the powder resin molding apparatus.
ー材を注入して接合されていることを特徴とする特許請
求の範囲第1項記載の粉末樹脂成形装置。(2) The powder resin molding apparatus according to claim 1, wherein the first metal body and the second metal body are joined by injecting a brazing material between them.
二金属体の厚み及び材質を場所的に異ならせていること
を特徴とする特許請求の範囲第1項又は第2項記載の粉
末樹脂成形装置。(3) In order to adjust the heating temperature of the first metal body, the thickness and material of the second metal body are made to vary depending on the location, according to claim 1 or 2. powder resin molding equipment.
られた誘導加熱コイルよりなることを特徴とする特許請
求の範囲第1項から第3項のいずれか1項に記載の粉末
樹脂成形装置。(4) The device for heating the mold comprises an induction heating coil provided on the outer surface of the mold. Powder resin molding equipment.
導加熱コイルと金型との間隔を場所的に異ならせている
ことを特徴とする特許請求の範囲第4項に記載の粉末樹
脂成形装置。(5) The powder according to claim 4, wherein the distance between the induction heating coil and the mold is varied depending on the location in order to adjust the heating temperature of the first metal body. Resin molding equipment.
導加熱コイルの巻線間隔を場所的に異ならせていること
を特徴とする特許請求の範囲第4項又は第5項に記載の
粉末樹脂成形装置。(6) In order to adjust the heating temperature of the first metal body, the distance between the windings of the induction heating coil is varied depending on the location, according to claim 4 or 5. powder resin molding equipment.
面の所要部分の加熱誘導コイル付近に、強磁性の金属片
又は固体を接合していることを特徴とする特許請求の範
囲第4項から第6項のいずれか1項に記載の粉末術成形
装置。(7) In order to adjust the heating temperature of the first metal body, a ferromagnetic metal piece or solid is bonded to a required portion of the outer surface of the mold near the heating induction coil. The powder molding device according to any one of items 4 to 6.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60252674A JPS62113521A (en) | 1985-11-13 | 1985-11-13 | Powder resin molding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60252674A JPS62113521A (en) | 1985-11-13 | 1985-11-13 | Powder resin molding device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62113521A true JPS62113521A (en) | 1987-05-25 |
JPH0523169B2 JPH0523169B2 (en) | 1993-03-31 |
Family
ID=17240658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60252674A Granted JPS62113521A (en) | 1985-11-13 | 1985-11-13 | Powder resin molding device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62113521A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04101813A (en) * | 1990-08-21 | 1992-04-03 | Asahi Chem Ind Co Ltd | plastic molding mold |
JP2011110719A (en) * | 2009-11-24 | 2011-06-09 | Sun Tectro:Kk | Apparatus and method for molding laminated composite material body |
JP2013520335A (en) * | 2010-02-23 | 2013-06-06 | アペラム | Mold, method for manufacturing a mold, and method for manufacturing a plastic or composite material product using the mold |
EP2726263A4 (en) * | 2011-06-28 | 2016-01-27 | Tctech Sweden Ab | Device and method for heating a mould or tool |
EP4302959A1 (en) * | 2022-07-07 | 2024-01-10 | Corebon AB | Molding tool, method of manufacturing the same and method of producing a composite part in said tool |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58164712U (en) * | 1982-04-27 | 1983-11-02 | 井上エムテ−ピ−株式会社 | Mold for molding synthetic resin products |
-
1985
- 1985-11-13 JP JP60252674A patent/JPS62113521A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58164712U (en) * | 1982-04-27 | 1983-11-02 | 井上エムテ−ピ−株式会社 | Mold for molding synthetic resin products |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04101813A (en) * | 1990-08-21 | 1992-04-03 | Asahi Chem Ind Co Ltd | plastic molding mold |
JP2011110719A (en) * | 2009-11-24 | 2011-06-09 | Sun Tectro:Kk | Apparatus and method for molding laminated composite material body |
JP2013520335A (en) * | 2010-02-23 | 2013-06-06 | アペラム | Mold, method for manufacturing a mold, and method for manufacturing a plastic or composite material product using the mold |
EP2726263A4 (en) * | 2011-06-28 | 2016-01-27 | Tctech Sweden Ab | Device and method for heating a mould or tool |
CN105818363A (en) * | 2011-06-28 | 2016-08-03 | 泰克瑞典公司 | Device and method for heating mould or tool |
US9962861B2 (en) | 2011-06-28 | 2018-05-08 | Tctech Sweden Ab | Device and method for heating a mould or tool |
EP3326772A1 (en) * | 2011-06-28 | 2018-05-30 | TCTECH Sweden AB (publ) | Device and method for heating a tool |
CN105818363B (en) * | 2011-06-28 | 2019-08-09 | 泰克瑞典公司 | Device and method for being heated to mold or tool |
EP4302959A1 (en) * | 2022-07-07 | 2024-01-10 | Corebon AB | Molding tool, method of manufacturing the same and method of producing a composite part in said tool |
WO2024008748A1 (en) * | 2022-07-07 | 2024-01-11 | Corebon Ab | Molding tool, method of manufacturing the same and method of producing a composite part in said tool |
Also Published As
Publication number | Publication date |
---|---|
JPH0523169B2 (en) | 1993-03-31 |
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