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JPS62107937U - - Google Patents

Info

Publication number
JPS62107937U
JPS62107937U JP20129685U JP20129685U JPS62107937U JP S62107937 U JPS62107937 U JP S62107937U JP 20129685 U JP20129685 U JP 20129685U JP 20129685 U JP20129685 U JP 20129685U JP S62107937 U JPS62107937 U JP S62107937U
Authority
JP
Japan
Prior art keywords
steel plate
material layer
elastic material
metal fiber
composite steel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20129685U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20129685U priority Critical patent/JPS62107937U/ja
Publication of JPS62107937U publication Critical patent/JPS62107937U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の複合鋼板の断面図である。 １０……複合鋼板、１１……鋼板、１２……弾
性物質層。 FIG. 1 is a sectional view of the composite steel plate of the present invention. 10... Composite steel plate, 11... Steel plate, 12... Elastic material layer.

Claims (1)

【実用新案登録請求の範囲】 ２枚の鋼板間に弾性物質層を有してなる複合鋼
板において、 弾性物質層中に金属繊維が含有せしめられ、該
金属繊維により導電路が形成されていることを特
徴とする複合鋼板。[Scope of Claim for Utility Model Registration] In a composite steel plate having an elastic material layer between two steel plates, a metal fiber is contained in the elastic material layer, and a conductive path is formed by the metal fiber. Composite steel plate featuring:
JP20129685U 1985-12-25 1985-12-25 Pending JPS62107937U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20129685U JPS62107937U (en) 1985-12-25 1985-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20129685U JPS62107937U (en) 1985-12-25 1985-12-25

Publications (1)

Publication Number Publication Date
JPS62107937U true JPS62107937U (en) 1987-07-10

Family

ID=31164613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20129685U Pending JPS62107937U (en) 1985-12-25 1985-12-25

Country Status (1)

Country Link
JP (1) JPS62107937U (en)

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7161363B2 (en) 2002-05-23 2007-01-09 Cascade Microtech, Inc. Probe for testing a device under test
US7233160B2 (en) 2000-12-04 2007-06-19 Cascade Microtech, Inc. Wafer probe
US7271603B2 (en) 2003-05-23 2007-09-18 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7298536B2 (en) 2001-05-04 2007-11-20 Cascade Microtech, Inc. Fiber optic wafer probe
US7321233B2 (en) 1995-04-14 2008-01-22 Cascade Microtech, Inc. System for evaluating probing networks
US7330041B2 (en) 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
US7348787B2 (en) 1992-06-11 2008-03-25 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US7352168B2 (en) 2000-09-05 2008-04-01 Cascade Microtech, Inc. Chuck for holding a device under test
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
US7362115B2 (en) 2003-12-24 2008-04-22 Cascade Microtech, Inc. Chuck with integrated wafer support
US7368925B2 (en) 2002-01-25 2008-05-06 Cascade Microtech, Inc. Probe station with two platens
US7368927B2 (en) 2004-07-07 2008-05-06 Cascade Microtech, Inc. Probe head having a membrane suspended probe
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7403025B2 (en) 2000-02-25 2008-07-22 Cascade Microtech, Inc. Membrane probing system
US7417446B2 (en) 2002-11-13 2008-08-26 Cascade Microtech, Inc. Probe for combined signals
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
US7436170B2 (en) 1997-06-06 2008-10-14 Cascade Microtech, Inc. Probe station having multiple enclosures
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7492147B2 (en) 1992-06-11 2009-02-17 Cascade Microtech, Inc. Wafer probe station having a skirting component
US7498828B2 (en) 2002-11-25 2009-03-03 Cascade Microtech, Inc. Probe station with low inductance path
US7504823B2 (en) 2004-06-07 2009-03-17 Cascade Microtech, Inc. Thermal optical chuck
US7504842B2 (en) 1997-05-28 2009-03-17 Cascade Microtech, Inc. Probe holder for testing of a test device
US7533462B2 (en) 1999-06-04 2009-05-19 Cascade Microtech, Inc. Method of constructing a membrane probe
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7541821B2 (en) 1996-08-08 2009-06-02 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US7550984B2 (en) 2002-11-08 2009-06-23 Cascade Microtech, Inc. Probe station with low noise characteristics
US7554322B2 (en) 2000-09-05 2009-06-30 Cascade Microtech, Inc. Probe station
US7609077B2 (en) 2006-06-09 2009-10-27 Cascade Microtech, Inc. Differential signal probe with integral balun
US7616017B2 (en) 1999-06-30 2009-11-10 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US7619419B2 (en) 2005-06-13 2009-11-17 Cascade Microtech, Inc. Wideband active-passive differential signal probe
US7639003B2 (en) 2002-12-13 2009-12-29 Cascade Microtech, Inc. Guarded tub enclosure
JP2013515613A (en) * 2009-12-28 2013-05-09 プロダクティブ リサーチ エルエルシー． Process for welding composite materials and articles derived therefrom
JP2013519543A (en) * 2010-02-15 2013-05-30 プロダクティブ リサーチ エルエルシー． Moldable lightweight composite system and method
US9429638B2 (en) 2008-11-21 2016-08-30 Cascade Microtech, Inc. Method of replacing an existing contact of a wafer probing assembly

Cited By (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7492147B2 (en) 1992-06-11 2009-02-17 Cascade Microtech, Inc. Wafer probe station having a skirting component
US7595632B2 (en) 1992-06-11 2009-09-29 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US7348787B2 (en) 1992-06-11 2008-03-25 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US7589518B2 (en) 1992-06-11 2009-09-15 Cascade Microtech, Inc. Wafer probe station having a skirting component
US7321233B2 (en) 1995-04-14 2008-01-22 Cascade Microtech, Inc. System for evaluating probing networks
US7541821B2 (en) 1996-08-08 2009-06-02 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US7504842B2 (en) 1997-05-28 2009-03-17 Cascade Microtech, Inc. Probe holder for testing of a test device
US7626379B2 (en) 1997-06-06 2009-12-01 Cascade Microtech, Inc. Probe station having multiple enclosures
US7436170B2 (en) 1997-06-06 2008-10-14 Cascade Microtech, Inc. Probe station having multiple enclosures
US7533462B2 (en) 1999-06-04 2009-05-19 Cascade Microtech, Inc. Method of constructing a membrane probe
US7616017B2 (en) 1999-06-30 2009-11-10 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US7403025B2 (en) 2000-02-25 2008-07-22 Cascade Microtech, Inc. Membrane probing system
US7554322B2 (en) 2000-09-05 2009-06-30 Cascade Microtech, Inc. Probe station
US7518358B2 (en) 2000-09-05 2009-04-14 Cascade Microtech, Inc. Chuck for holding a device under test
US7514915B2 (en) 2000-09-05 2009-04-07 Cascade Microtech, Inc. Chuck for holding a device under test
US7352168B2 (en) 2000-09-05 2008-04-01 Cascade Microtech, Inc. Chuck for holding a device under test
US7423419B2 (en) 2000-09-05 2008-09-09 Cascade Microtech, Inc. Chuck for holding a device under test
US7501810B2 (en) 2000-09-05 2009-03-10 Cascade Microtech, Inc. Chuck for holding a device under test
US7456646B2 (en) 2000-12-04 2008-11-25 Cascade Microtech, Inc. Wafer probe
US7495461B2 (en) 2000-12-04 2009-02-24 Cascade Microtech, Inc. Wafer probe
US7233160B2 (en) 2000-12-04 2007-06-19 Cascade Microtech, Inc. Wafer probe
US7298536B2 (en) 2001-05-04 2007-11-20 Cascade Microtech, Inc. Fiber optic wafer probe
US7492175B2 (en) 2001-08-21 2009-02-17 Cascade Microtech, Inc. Membrane probing system
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
US7368925B2 (en) 2002-01-25 2008-05-06 Cascade Microtech, Inc. Probe station with two platens
US7482823B2 (en) 2002-05-23 2009-01-27 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7489149B2 (en) 2002-05-23 2009-02-10 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7161363B2 (en) 2002-05-23 2007-01-09 Cascade Microtech, Inc. Probe for testing a device under test
US7436194B2 (en) 2002-05-23 2008-10-14 Cascade Microtech, Inc. Shielded probe with low contact resistance for testing a device under test
US7518387B2 (en) 2002-05-23 2009-04-14 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7304488B2 (en) 2002-05-23 2007-12-04 Cascade Microtech, Inc. Shielded probe for high-frequency testing of a device under test
US7550984B2 (en) 2002-11-08 2009-06-23 Cascade Microtech, Inc. Probe station with low noise characteristics
US7417446B2 (en) 2002-11-13 2008-08-26 Cascade Microtech, Inc. Probe for combined signals
US7453276B2 (en) 2002-11-13 2008-11-18 Cascade Microtech, Inc. Probe for combined signals
US7498828B2 (en) 2002-11-25 2009-03-03 Cascade Microtech, Inc. Probe station with low inductance path
US7639003B2 (en) 2002-12-13 2009-12-29 Cascade Microtech, Inc. Guarded tub enclosure
US7271603B2 (en) 2003-05-23 2007-09-18 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7501842B2 (en) 2003-05-23 2009-03-10 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7498829B2 (en) 2003-05-23 2009-03-03 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7876115B2 (en) 2003-05-23 2011-01-25 Cascade Microtech, Inc. Chuck for holding a device under test
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
US7362115B2 (en) 2003-12-24 2008-04-22 Cascade Microtech, Inc. Chuck with integrated wafer support
US7504823B2 (en) 2004-06-07 2009-03-17 Cascade Microtech, Inc. Thermal optical chuck
US7330041B2 (en) 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
US7368927B2 (en) 2004-07-07 2008-05-06 Cascade Microtech, Inc. Probe head having a membrane suspended probe
US7514944B2 (en) 2004-07-07 2009-04-07 Cascade Microtech, Inc. Probe head having a membrane suspended probe
US8013623B2 (en) 2004-09-13 2011-09-06 Cascade Microtech, Inc. Double sided probing structures
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
US7619419B2 (en) 2005-06-13 2009-11-17 Cascade Microtech, Inc. Wideband active-passive differential signal probe
US7609077B2 (en) 2006-06-09 2009-10-27 Cascade Microtech, Inc. Differential signal probe with integral balun
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US9429638B2 (en) 2008-11-21 2016-08-30 Cascade Microtech, Inc. Method of replacing an existing contact of a wafer probing assembly
JP2013515613A (en) * 2009-12-28 2013-05-09 プロダクティブ リサーチ エルエルシー． Process for welding composite materials and articles derived therefrom
JP2013519543A (en) * 2010-02-15 2013-05-30 プロダクティブ リサーチ エルエルシー． Moldable lightweight composite system and method
JP2016104563A (en) * 2010-02-15 2016-06-09 プロダクティブ リサーチ エルエルシー． Formable light weight composite material systems and methods

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