JPS62105403A - Resistor - Google Patents
ResistorInfo
- Publication number
- JPS62105403A JPS62105403A JP60245873A JP24587385A JPS62105403A JP S62105403 A JPS62105403 A JP S62105403A JP 60245873 A JP60245873 A JP 60245873A JP 24587385 A JP24587385 A JP 24587385A JP S62105403 A JPS62105403 A JP S62105403A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- palladium
- connection area
- silver
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 24
- 229910052763 palladium Inorganic materials 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 description 5
- 244000062175 Fittonia argyroneura Species 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 2
- 101001094880 Arabidopsis thaliana Pectinesterase 4 Proteins 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 206010010071 Coma Diseases 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
- Details Of Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 東策上p刀用分野 この発明はチップ抵抗器などの抵抗器に関する。[Detailed description of the invention] Field for Tosaku Jop Sword The present invention relates to resistors such as chip resistors.
1L」(の」支j付−
この種の抵抗器の導体としての電極には銀が多く用いら
れているが、電極と抵抗層間の境界でエレクトロマイグ
レーションと呼ばれる抵抗層への銀の拡散現象が発生ず
ることが知られている。これが発生ずると抵抗値の変り
Jや接続不良などを生じるが、この拡散現象はパラジウ
ムの含有により抑制できるので、銀にパラジウムを適当
量加えたパラジウム銀糸の電極材料を使用するようにな
ってきている。Silver is often used in the conductor electrodes of this type of resistor, but at the boundary between the electrode and the resistance layer, a phenomenon called electromigration, where silver diffuses into the resistance layer, occurs. If this occurs, it will cause a change in resistance value or poor connection, but this diffusion phenomenon can be suppressed by containing palladium. materials are being used more and more.
発1打d躍央↓jにYとす(」旧四r、、jしかしなが
ら、電極全体にパラジウムを含有させると、パラジウム
原料が比較的高価であるため、抵抗器のコストアンプを
招くといった問題点を生じていた。However, if the entire electrode contains palladium, the palladium raw material is relatively expensive, so there are problems such as increasing the cost of the resistor. It was causing a point.
この発明はこのような問題点を鑑み、抵抗器性能を低下
させることなくパラジウム含有量を減少でき価格低減を
実現することのできる抵抗器を提供することを目的とし
ている。In view of these problems, it is an object of the present invention to provide a resistor in which the palladium content can be reduced without deteriorating the resistor performance and the price can be reduced.
皿l立羞IすJ」ν超4悲l匪
この発明は、前記の目的を達成するために、導体を、主
成分が銀でパラジウムを含有した抵抗体接続領域と、主
成分が銀でパラジウムを含有しない外部接続領域とで構
成したことを特徴とする。In order to achieve the above-mentioned object, this invention includes a conductor having a resistor connection region whose main component is silver and which contains palladium, and a resistor connection region whose main component is silver. It is characterized by comprising an external connection area that does not contain palladium.
皿
抵抗体接続領域は直接抵抗体と接続し、抵抗体との境界
でのエレクトロマイグレーションの発生を防く。導体全
体はパラジクノムを爲有し2ない外部接続領域を含むの
ご、パラジウム銀糸の電極+A料のゐのjlj −領域
で構成される場合よ1ツバラジウムの使用量が少なくな
る。The plate resistor connection region connects directly to the resistor to prevent electromigration from occurring at the interface with the resistor. Since the entire conductor contains palladium and does not include an external connection area, the amount of palladium used is less than when it is composed of an electrode of palladium silver thread + a region of A material.
一火−施例
第1図し1本発明の一実施例であるチップ抵抗器の概1
1f)断面図であイ)。1 - Example 1 Figure 1 Schematic diagram of a chip resistor which is an embodiment of the present invention 1
1f) Cross-sectional view).
図において、符月10はアルミナ等の絶縁竹材料からな
る長方形状基板であり、表面の対向する縁部に一則の導
体とシ2−(の内部電極40か形成されている。内部電
極40 i:l、パラジウム銀糸の電極材料で厚欣形成
した抵抗体接続領域41と、銀厚股で形成された外部接
続領域42とで構成されている。抵抗体接続領域41と
外部接続領域42間に跨るように、抵抗体20が酸化ル
シニウム系厚股で形成されている。基板10の端面部に
は配線基板への半1.’fl (−、J’ iJのため
の外部電極43が形成されている。抵抗体20は黒色ガ
ラスlidからなる保護膜30が被覆されている。In the figure, the book moon 10 is a rectangular substrate made of an insulating bamboo material such as alumina, and a uniform conductor and internal electrodes 40 of the wire 2-(i) are formed on opposite edges of the surface. :l, It is composed of a resistor connection area 41 made of a thick electrode material of palladium silver thread, and an external connection area 42 made of a thick silver thread. Between the resistor connection area 41 and the external connection area 42, A resistor 20 is formed of a thick rucinium oxide material so as to straddle the resistor 20.An external electrode 43 for half 1.'fl (-, J' iJ) to the wiring board is formed on the end surface of the substrate 10. The resistor 20 is covered with a protective film 30 made of black glass lid.
上記構成のチップ抵抗器の製造1稈を第2図によって説
明する。One process for manufacturing a chip resistor having the above structure will be explained with reference to FIG.
0)符;HI L、lツー1状l゛ハ基扱であ2つ、λ
;面Zこはフ゛L、−−キンカ゛の人−めのスリ・・1
2が4’l a% ’S t’lていル、、 PE−4
”、こノ、I、t[ilの1面にバー7パジウム銀糸の
電極ヰ(料を厚+1>印刷し、乾燥さ1!−(抵抗体接
続領域旧を形成する(第2図(・岨と114+) 、、
■ スリ2,1シ)ター介して・に1向・(、に1 ・
^Ill O) till: h”11体接続領域41
1!’l i:ゴヘ、に+ 4、)に、鉢;の電極+A
’ +1 i厚119印刷し2、乾燥、焼成4−jし1
〔渥?1部接続領ト・’y、 4 i’! 4形成する
(第2図01)ネ(照)。0) Sign; HI L, l to 1 form l゛ha base treatment, two, λ
;The face Z is a file L, a pickpocket for a Kinka person...1
2 is 4'l a% 'St'ltail,, PE-4
”, Print an electrode material of bar 7 palladium silver thread on one side of I, t[il, thickness +1>, dryness 1!-(form resistor connection area (Fig. 2)岨と114+) 、、
■ Pickpocketing 2,1
^Ill O) till: h”11 body connection area 41
1! 'l i: gohe, ni + 4,), pot;'s electrode +A
'+1 i thickness 119 printed 2, drying, baking 4-j 1
[Atsushi? 1 part connection territory t・'y, 4 i'! 4. Form (Fig. 2 01) Ne (see).
■ 列部接続R11代、12の形成さl’1.7いない
I、(楔面に、−・組の抵抗体接続領b・11間に跨る
。1、パ)酸化ルテニウム系lit抗材料を厚膜印刷(
7、乾燥、焼I+!、+’、を行って11(抗体20’
r1[づ成−・1i1(第2ν1((朦ミI1..j
’)。■ Formation of row part connection R11 and 12 l'1.7 not I (on the wedge surface, spanning between resistor connection areas b and 11 of -. group. 1, pa) Ruthenium oxide based lit resistance material. Thick film printing (
7. Dry and bake I+! , +', and perform 11 (antibody 20')
r1 [Zusei-・1i1 (2nd ν1
').
■ 次に抵抗体201乙こ111色!ノ′−tス1−で
かr)なる保護膜3B被覆し、その後スリ・1・2で−
!゛L・ −Yングする。zとQコま?)帯状ζ1コ分
i’i’l ”l’ Z+ (第21WI (d)伶j
jjj)。さく:)に、−トップ11111 i°’l
it 1m l::外部電極43をj[成し5た後、各
チップ部品に♀!11<う) ;’I’l・する。■ Next, resistor 201 Otsuko 111 colors! Cover the protective film 3B with No'-ts 1-, and then apply the protective film 3B with Slip 1 and 2.
!゛L・-Ying. Z and Q coma? ) 1 band ζ i'i'l ``l' Z+ (21st WI (d) 伶j
jjj). Saku:), -Top 11111 i°'l
it 1ml l:: After forming the external electrode 43, attach it to each chip component! 11<U);'I'l.
なお、本発明は、TI(板実装用の外部電極43G (
&iえないものや、抵抗子〕1−リ //などにも適用
−・することができる。Note that the present invention is applicable to TI (external electrode 43G for board mounting) (
It can also be applied to things that cannot be used, such as resistors.
発1Lq効−果
本発明によれば、パラジウム含有の抵抗体接続領域が抵
抗体と直接接続し、抵抗体との境界でのエレクI・ロマ
イグレーションの発生を防くので、性能を低下さ−けず
にパラジウムの使用量を少なくして価格4+ζ減を実現
することができる。According to the present invention, the palladium-containing resistor connection region is directly connected to the resistor, preventing electromigration from occurring at the boundary with the resistor, thereby reducing performance. It is possible to reduce the price by 4+ζ by reducing the amount of palladium used without causing any damage.
第1図は本発明の−・実施例であるチップ抵抗器の概略
断面図、第2図t8)〜fd+は同チップ抵抗器の製造
丁稈を説明するための図である。
10・・・基板、20・・・抵抗体、41・・・抵抗体
接続領域、42・・・外部接続領域。
特許出願人 ローム株式会社
代理人 弁理士 大 西 孝 治
(、−)FIG. 1 is a schematic sectional view of a chip resistor according to an embodiment of the present invention, and FIG. DESCRIPTION OF SYMBOLS 10... Substrate, 20... Resistor, 41... Resistor connection area, 42... External connection area. Patent Applicant: ROHM Co., Ltd. Agent, Patent Attorney: Takaharu Ohnishi (,-)
Claims (1)
抗器において、 導体を、主成分が銀でパラジウムを含有した抵抗体接続
領域と、主成分が銀でパラジウムを含有しない外部接続
領域とで構成してなる抵抗器。(1) In a resistor in which a resistor is formed across a pair of conductors on a substrate, the conductor is connected to a resistor connection area whose main component is silver and contains palladium, and an external connection whose main component is silver and does not contain palladium. A resistor consisting of a region.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60245873A JPS62105403A (en) | 1985-10-31 | 1985-10-31 | Resistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60245873A JPS62105403A (en) | 1985-10-31 | 1985-10-31 | Resistor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62105403A true JPS62105403A (en) | 1987-05-15 |
Family
ID=17140074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60245873A Pending JPS62105403A (en) | 1985-10-31 | 1985-10-31 | Resistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62105403A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6290997A (en) * | 1985-10-17 | 1987-04-25 | 松下電器産業株式会社 | Thick film printed circuit device |
-
1985
- 1985-10-31 JP JP60245873A patent/JPS62105403A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6290997A (en) * | 1985-10-17 | 1987-04-25 | 松下電器産業株式会社 | Thick film printed circuit device |
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