JPS62104065A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To readily recombine connecting points divided in case of trimming a plurality of resistors for forming a closed circuit by forming a gap at a terminal for connecting the plurality of resistors, and placing solder thereon to connect divided terminals. CONSTITUTION:When forming conductors 2 by screen printing on a ceramic substrate 1, terminals 3 electrically divided by gaps 4 are simultaneously formed as for regulating resistance values of the resistors for forming a closing circuit, resistors 5 are formed by screen printing between the conductors 2, and a surface protecting glass 6 is formed by screen printing on the substrate 1 except the terminals 3. The resistance value of the resistor 5 to be regulated at the resistance value can be detected without influence of the resistors 5, and the resistance values of the entire resistors 5 are regulated by emitting laser light. Solder 7 is placed on the terminals 3, which are electrically connected by the solder 7 to form a closed circuit.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit forming a resistor.

[Related technology and its problems]

In general, hybrid integrated circuits are constructed by forming conductors or resistors on an insulating substrate such as ceramic by printing or vapor deposition, and attaching semiconductor chips such as transistors and diodes or capacitor chips by methods such as soldering or hard bonding. It consists of

Since the resistance can be adjusted depending on the resistor formed between the conductors on the insulating substrate, the resistance ink is usually 100Ω/Ω, IKΩ/Ω, and 0Ω/Ω/Ω.

Using standardized values such as Ω/mouth for 50,
Japanese Patent Publication No. 57-41103 discloses a method in which the resistance values before and after the resistor are adjusted by the width and length of the resistor.

However, in order to more accurately measure the resistance value of a resistor to the desired value, the measurement terminals of a tester are usually connected directly to both ends of the resistor formed on the board, and the resistor is irradiated with laser light. Trimming is performed to change the resistance value by scratching the resistor.

This kind of trimming is effective for resistors connected in series, but the resistance value of resistors connected in parallel or resistor R1 forming a closed circuit as shown in Figure 4 may be When detecting, even if the measurement terminals of the tester are connected to both ends of the resistor R1, the detected resistance value is the same as that of the resistors R2 and R.
The resistance value becomes a composite resistance value including 3 and 3, and the accurate resistance value of the resistor R1 cannot be detected. Therefore, as shown in FIG. 5, in order to avoid forming a closed circuit, the terminal T, which is the connection point between the resistors R2 and R3, is divided and a gap S is inserted between the resistors R and R3.
2 and R3 are separated.

After trimming, when another semiconductor chip, such as a capacitor chip, is soldered, the divided terminals T are electrically connected by solder H via the terminals of the capacitor chip C.

However, melted solder H has surface tension like a liquid, and due to this property, if the terminal T is large, even if soldering is performed, the solder H will only be on one side of the divided terminal T. The terminals T may not be connected to each other, resulting in a circuit failure. When a component such as another capacitor chip C is attached to the connection point between the resistors R2 and R3, both the divided terminals T are connected to the terminals of the capacitor chip C, so one terminal There is no problem in the circuit even if T and capacitor chip C are connected by solder H, but if there are no components other than the resistor, if the closed circuit is cut in this way, the solder H will be disconnected when reconnecting. There was a problem in that recombination was difficult due to surface tension, resulting in defective products.

[Purpose of the invention]

The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a hybrid integrated circuit in which connection points that are separated when trimming a resistor forming a closed circuit can be easily recombined by soldering. It is something to do.

[Structure of the invention]

The structure of the present invention to achieve the above object is that in a hybrid integrated circuit in which a conductor and a resistor are formed on an insulating substrate, a gap is provided at a terminal connecting a plurality of resistors to electrically separate the connection of each resistor. The present invention is characterized in that the divided terminals are connected by providing a solder and placing solder corresponding to the size of the terminal on the terminal.

〔Example〕

Hereinafter, one embodiment of the present invention will be described in detail based on the drawings.

1 and 2, a conductor 2 having a desired pattern is formed on a ceramic laminated substrate 1 by screen printing. At this time, the terminals 3 are also separately formed at the same time for adjusting the resistance values of the respective resistors constituting the closed circuit shown in FIGS. 4 and 5. The terminals 3 are electrically separated by a gap 4 approximately in the middle, and the gap 4 is set to an extent of, for example, 0.1 m to 0.0 m to prevent a short circuit between the separated terminals 3 when printing the terminals 3. Set to 2 fins, terminal 3 is set to gap 4
For example, the size including the diameter is about 1.0 mm.

Next, a resistor 5 is formed by screen printing between predetermined conductors 2 on the substrate l.

Next, as shown in FIG. 3A, a glass 6 for protecting the surface of the substrate 1 is formed by screen printing on the substrate 1 excluding at least the terminals 3.

In the present invention configured as described above, the measurement terminals of a tester are directly connected to both ends of the resistor 5, and the resistance value is adjusted by irradiating the resistor 5 with a laser beam as described above. At this time, since the terminal 3 is separated, a closed circuit is not yet configured, and the resistance value of the predetermined resistor 5 whose resistance value is to be adjusted can be detected without being influenced by other resistors 5. and
In this way, the resistance values of all the resistors 5 are adjusted.

After such adjustment, solder 7 is placed on the terminals 3, and the separated terminals 3 are electrically connected by the solder 7 to form a closed circuit.゛)/1 n - In this case, the terminal 3 is hardened into a spherical shape, substantially covering the terminal 3 and bonding the terminals 3 separated by the gap 4 well. If this terminal 3 is large, the solder 7 may shrink only on one terminal due to surface tension and may not connect the gap 4.
If the distance including the gap 4 is about 11 m'', the gap 4 can be bonded with the minimum amount of solder 7, and connection failure can be almost completely prevented.

Therefore, it is possible to trim the resistor 5 even if there is no other chip component C (see FIG. 5) in this type of terminal 3.

Although one embodiment of the present invention has been described in detail above, various modifications can be made within the scope of the gist of the present invention.
In this case, the shape of the terminal 3 is approximately square including the gap 4, but it may also be approximately circular including the gap 4 as shown in FIG. Any shape is sufficient as long as it connects the terminals 3 that are connected to each other. The units of dimensions shown in FIGS. 3A and 3B are cranes. Further, even if the size of the terminal 3 is increased, the separated terminals 3 can be joined together in the same manner as described above by increasing the amount of solder 7.

〔Effect of the invention〕

As detailed above, according to the present invention, in a hybrid integrated circuit in which a conductor and a resistor are formed on an insulating substrate, a gap electrically separates the connection between each resistor at a terminal connecting a plurality of resistors. In addition, the separated terminals are connected by placing solder corresponding to the size of the terminal on the terminal, thereby trimming the resistance value constituting the closed circuit. It is possible to reliably connect gaps between separated terminals that connect multiple resistors by soldering, and it is possible to provide a hybrid integrated circuit that suppresses connection failures caused by soldering and improves the yield of circuit boards. .

[Brief explanation of drawings]

Fig. 1 is a plan view showing one embodiment of the present invention, Fig. 2 is a sectional view thereof, Fig. 3 A is an enlarged plan view of the main part, and Fig. 3 B is an enlarged plan view of the main part showing another embodiment. 4 are circuit diagrams showing a conventional example, and FIG. 5 is a plan view thereof. 1 - Ceramic substrate 2 - Conductor pattern - Terminal 4 - Gap 5 - Resistor 7 - Solder patent Applicant: Agent for Nippon Seiki Co., Ltd.
Patent attorney Mamoru Iki! Figure 3, 1゜ (A)! Figure 4 g Figure 5

Claims (1)

[Claims] In a hybrid integrated circuit in which a conductor and a resistor are formed on an insulating substrate, a gap is provided at a terminal connecting a plurality of resistors to electrically separate the connection of each resistor, and a gap corresponding to the size of the terminal is provided. A hybrid integrated circuit characterized in that the separated terminals are connected by placing solder on the terminals.