JPS6195486A - IC card - Google Patents
IC cardInfo
- Publication number
- JPS6195486A JPS6195486A JP59216136A JP21613684A JPS6195486A JP S6195486 A JPS6195486 A JP S6195486A JP 59216136 A JP59216136 A JP 59216136A JP 21613684 A JP21613684 A JP 21613684A JP S6195486 A JPS6195486 A JP S6195486A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- card
- stress
- resin
- external force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 230000035882 stress Effects 0.000 description 13
- 230000003014 reinforcing effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
不発明は、ＩＣカードに係シ、外部より力がガロわった
場合に受ける応力からＩＣチップを保護することに関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to IC cards, and relates to protecting the IC chip from stress experienced when external forces are applied.
（発明の背景）
従来のＩＣカードは、特開昭５８−２２１４７８号公＠
１ｒｃ ｓｒ：：載のように、外部端末のデータ交信用
接触子からの押圧刃よりＩＣチップを保護するようＶＣ
なっていた。しかし、人間の携帯時等に力を加えられた
時に受ける応力からＩＣチップを保護する点につ−ては
配慮されていなかった。(Background of the invention) The conventional IC card is disclosed in Japanese Patent Application Laid-open No. 58-221478@
1rc sr:: As shown in
It had become. However, no consideration was given to protecting the IC chip from the stress that is applied when it is carried by a person.
本発明は、外部よυカを受け、その応力によシエＣチッ
プに悪影響を及ぼさないＩＣカードを提供することを目
的とするものである。SUMMARY OF THE INVENTION An object of the present invention is to provide an IC card which is subjected to external stress and whose C chip is not adversely affected by the stress.
現在のＩＣカードは、カードが変形するような力を加え
られると、その応力がＩＣチップに直接つたわる構造と
なっている。ＩＣチップは弾性能力が小さい為、ＩＣカ
ードを構成している基板、カード本体樹脂が許容できる
応力が加わった場合でも、ＩＣチップが間単に破壊され
ることがある。Current IC cards have a structure in which when a force that deforms the card is applied, the stress is directly transmitted to the IC chip. Since the IC chip has a small elasticity, even if a stress that can be tolerated by the substrate and the resin of the card body constituting the IC card is applied, the IC chip may be easily destroyed.
ＩＣカードが外部より力を受けた場合、そこで発生する
応力をＩＣチップから離れた位置に設けた硬度の低い部
分に集中させ、ＩＣチップに直接応力が加わらない構造
として、前記目的を達成するものである。When an IC card is subjected to external force, the stress generated therein is concentrated on a less hard part located away from the IC chip, and the structure achieves the above object so that stress is not directly applied to the IC chip. It is.
以下の実施例について、第１図、第２図にその構造を示
す。第１図は実施例の平面図、第２図は新面図を示す。The structures of the following embodiments are shown in FIGS. 1 and 2. FIG. 1 is a plan view of the embodiment, and FIG. 2 is a new view.
ここで１ｒｔ力−ド本体樹脂２は補強用の板、３はＩＣ
チップ、４はＩＣチッグ搭械用基板、５Ｆｉ微点端子、
６はリード線７はモールド材である。補強用の＆２は、
チップ搭載用基板４のＩＣチップ６がＭ−献された直下
に設置される。Here, the 1rt force card main body resin 2 is a reinforcing plate, and 3 is an IC.
Chip, 4 is IC chip mounting board, 5Fi fine point terminal,
6 is a lead wire 7 is a molded material. &2 for reinforcement is
The IC chip 6 of the chip mounting board 4 is installed directly under the M-dedicated area.
従って袖頒用板が設置されて−る部分は他の部分に比べ
て大きな曲げ応力抵抗’ｔ−Ｗする。カードを折シ曲げ
ようとする外力が加わった場合補強用の板２０入ってい
ない部分が折り曲げられるために、ＩＣチップ３１Ｃ応
力が加えられることなく、ＩＣチップ３の破損を防止す
ることができる。なお、補強用の板が設置されていない
部分に曲げが集中しチップ搭載用基板の配線が＃線する
ｔＪｌｒＣ関しては、基板材′ＸにＥＰＣ基板号十分な
曲げ応力をもつ基板を使用することにより容易に回避で
きる。Therefore, the part where the sleeve distribution plate is installed has a larger bending stress resistance than other parts. When an external force is applied to bend the card, the portion where the reinforcing plate 20 is not included is bent, so that stress on the IC chip 31C is not applied and damage to the IC chip 3 can be prevented. In addition, for tJlrC where the bending is concentrated in the part where the reinforcing plate is not installed and the wiring of the chip mounting board becomes a # line, use a board with sufficient bending stress for the EPC board as the board material 'X. This can be easily avoided.
第２の爽施例九つい【、その構造を第３図に示す。第５
図において、８は硬度の低いカード本体樹脂、１０は硬
度の向いカード本体偏脂である。カードをｆｔシ曲げよ
うとする外力が加わった場合、硬度の低めカード本体樹
脂が折９曲けられるために、ＩＣチップ３に応力が加え
られることなく、ＩＣチップ３の破損を防止することが
できる。The structure of the second example is shown in FIG. Fifth
In the figure, 8 is a card body resin with a low hardness, and 10 is a card body biased fat with a hardness. When an external force is applied to bend the card, the card body resin, which has a low hardness, is bent, so no stress is applied to the IC chip 3, and damage to the IC chip 3 can be prevented. can.
ｍｓの実施例について、第４因にその構造を示す。カー
ドを折シ曲げようとする外力が加わりｆｔ−場合、ＩＣ
チップ３のある部分以外のカード本体樹脂１の薄い部分
が折れ曲げられるためにＩＣチップ３の破損を防止する
ことができる。Regarding the example of ms, its structure is shown in the fourth factor. If an external force is applied to bend the card, the IC
Since the thin portion of the card body resin 1 other than the portion where the chip 3 is located is bent, damage to the IC chip 3 can be prevented.
、１４４の実施例について、ＷＪ５図にその得遺を示す
。カードを折夛曲げようとする外力が加わった場合、Ｉ
Ｃチップ５のない部分のカード本体樹脂１の溝の部分が
折れ曲げられるために、ＩＣチップ６の破損を防止する
ことができる。, 144, the results are shown in Figure WJ5. If an external force is applied to bend the card, I
Since the groove portion of the card body resin 1 where the C chip 5 is not located is bent, the IC chip 6 can be prevented from being damaged.
第５の実施例について、第６図及び第７図にその構造を
示す。第６図は実施例の平面図、第７図は断面図を示す
。ここで９は穴でちる。カードを折り曲げようとする外
力が加わった場合ＩＣチップ５のまわりに設けられた小
さな穴９０部分が折り曲げられるために、ＩＣチツＩＳ
に応力が加えられることがなく、ＩＣチップの破損を防
止することができる。The structure of the fifth embodiment is shown in FIGS. 6 and 7. FIG. 6 shows a plan view of the embodiment, and FIG. 7 shows a sectional view. Here, 9 is a hole. When an external force is applied to bend the card, the small hole 90 provided around the IC chip 5 is bent.
Since stress is not applied to the IC chip, damage to the IC chip can be prevented.
本発明により、人間の携帯時等に、外部から力が加わシ
、応力が発生してもＩＣチップには関係なく、ＩＣチッ
プの破損を生ずることがないＩＣカードを提供すること
ができ、実用上極めて人ぎな効果がある。According to the present invention, it is possible to provide an IC card that does not cause damage to the IC chip even if stress is applied from the outside when carried by a person, regardless of the IC chip. It has a very human effect.
ｇ４１図及び第２図は、本発明によるＩＣカードの一実
施例を示す平面図及び横断囲図である。
第６図乃至犀７図は、それぞｎ本発明によるＩＣカード
の池の実施例を説明するための図である。
１・・・カード不休樹脂 ２・・・補強用の板３・
・・ＩＣチップ
４・・・ＩＣチップ搭載用基板
５・・・接点端子 ６・・・リード線７・・
・モールド材
８・・・硬度の低いカード本体樹脂
９・・・穴
１０・・・硬度の高いカード本体樹脂。Figure g41 and Figure 2 are a plan view and a cross-sectional view showing one embodiment of the IC card according to the present invention. 6 to 7 are diagrams for explaining embodiments of the IC card pond according to the present invention, respectively. 1...Card-free resin 2...Reinforcement plate 3.
...IC chip 4...IC chip mounting board 5...contact terminal 6...lead wire 7...
- Mold material 8... Card body resin with low hardness 9... Hole 10... Card body resin with high hardness.
Claims (1)
取り装置に接続するための接点端子と、前記ＩＣチップ
と接点端子間を接続するリード線とから構成されるＩＣ
カードにおいて、ＩＣチップ実装部分と、それ以外の部
分の折り曲げに対する強度を変えたことを特徴とするＩ
Ｃカード。An IC consisting of an IC chip, a resin that is a card base material, a contact terminal for connecting to a reading/writing device, and a lead wire that connects the IC chip and the contact terminal.
An I card characterized in that the IC chip mounting part and other parts have different bending strength.
C card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59216136A JPS6195486A (en) | 1984-10-17 | 1984-10-17 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59216136A JPS6195486A (en) | 1984-10-17 | 1984-10-17 | IC card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6195486A true JPS6195486A (en) | 1986-05-14 |
Family
ID=16683828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59216136A Pending JPS6195486A (en) | 1984-10-17 | 1984-10-17 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6195486A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990008365A1 (en) * | 1989-01-19 | 1990-07-26 | W. & T. Avery Limited | Portable electronic token |
| FR2749687A1 (en) * | 1996-06-07 | 1997-12-12 | Solaic Sa | MEMORY CARD AND METHOD FOR MANUFACTURING SUCH A CARD |
| JP2003044816A (en) * | 2001-07-31 | 2003-02-14 | Toppan Forms Co Ltd | Ic card |
| US8973834B2 (en) * | 2004-06-16 | 2015-03-10 | Gemalto Sa | Secured identification document |
-
1984
- 1984-10-17 JP JP59216136A patent/JPS6195486A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990008365A1 (en) * | 1989-01-19 | 1990-07-26 | W. & T. Avery Limited | Portable electronic token |
| FR2749687A1 (en) * | 1996-06-07 | 1997-12-12 | Solaic Sa | MEMORY CARD AND METHOD FOR MANUFACTURING SUCH A CARD |
| WO1997048074A1 (en) * | 1996-06-07 | 1997-12-18 | Solaic | Memory card and method for producing same |
| JP2003044816A (en) * | 2001-07-31 | 2003-02-14 | Toppan Forms Co Ltd | Ic card |
| US8973834B2 (en) * | 2004-06-16 | 2015-03-10 | Gemalto Sa | Secured identification document |
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