JPS6181460A - Heat-sensitive resistive conductive composition - Google Patents
Heat-sensitive resistive conductive compositionInfo
- Publication number
- JPS6181460A JPS6181460A JP20145284A JP20145284A JPS6181460A JP S6181460 A JPS6181460 A JP S6181460A JP 20145284 A JP20145284 A JP 20145284A JP 20145284 A JP20145284 A JP 20145284A JP S6181460 A JPS6181460 A JP S6181460A
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- metal
- carbonaceous particles
- attached
- volume
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- Thermistors And Varistors (AREA)
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Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、電気抵抗の正温度係数特性(P ’FC)の
顕著な感熱抵抗性導電性組成物に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to heat-sensitive resistive conductive compositions with significant positive temperature coefficient characteristics (P'FC) of electrical resistance.
従来から正温度係数特性を有する材料、特に一定の温度
領域に達すると急激に電気抵抗値が増大する特性を有す
る材料は、様々なものが知られている(特公昭36−1
6338号公軸、同50−33707号公報。A variety of materials have been known that have positive temperature coefficient characteristics, particularly materials that have the property of rapidly increasing electrical resistance when reaching a certain temperature range (Japanese Patent Publication No. 36-1
No. 6338 Public Axis, Publication No. 50-33707.
同56−10352号公報など)。Publication No. 56-10352, etc.).
しかしながら、これら従来の材料では、一定の温度領域
に達した際の抵抗増大倍率を大きくすると、室温での電
気抵抗も大きくなり実用上問題があった。However, with these conventional materials, if the resistance increase factor is increased when a certain temperature range is reached, the electrical resistance at room temperature also increases, which poses a practical problem.
そこで本発明者は、上記従来の材料の問題点を解消し、
常温での電気抵抗が小さく、しかも一定温度領域に達し
た際の電気抵抗値の増大倍率が著しく大きい材料を開発
すべく鋭意研究を重ねた。その結果、結晶性樹脂をベー
スとし、これに導電性充填材として金属を付着した炭素
質粒子を配合するとともに、結晶性樹脂の架橋化を行な
うことによって、目的とする物性を有する組成物が得ら
れることを見出した。Therefore, the present inventor solved the problems of the above-mentioned conventional materials,
We have conducted intensive research to develop a material that has low electrical resistance at room temperature and a significantly large increase in electrical resistance when it reaches a certain temperature range. As a result, by blending carbonaceous particles with a metal attached as a conductive filler to a crystalline resin base and crosslinking the crystalline resin, a composition having the desired physical properties was obtained. I found out that it can be done.
本発明はかかる知見に基いて完成したものである。The present invention was completed based on this knowledge.
すなわち本発明は、結晶性樹脂と金属を付着した炭素質
粒子よりなる架橋化組成物であって、前記結晶性樹脂1
00容量部に、前記金属を付着した炭素質粒子を20〜
70容量部配合してなる感熱抵抗性導電性組成物を提供
するものである。That is, the present invention provides a crosslinked composition comprising a crystalline resin and carbonaceous particles to which a metal is attached, wherein the crystalline resin 1
20 to 00 volume parts of carbonaceous particles to which the metal is attached
A heat-sensitive resistive conductive composition containing 70 parts by volume is provided.
本発明に用いる結晶性樹脂は様々なものを挙げることが
できるが、通常は高密度ポリエチレン、低密度ポリエチ
レン、ポリプロピレン、エチレン−プロピレンコポリマ
ーなどのポリオレフィン、オレフィン系共重合体、各種
のポリアミド、ポリエステルあるいはフッ素系重合体さ
らにはこれらの変性物などである。Various types of crystalline resins can be used in the present invention, but usually polyolefins such as high-density polyethylene, low-density polyethylene, polypropylene, ethylene-propylene copolymers, olefin copolymers, various polyamides, polyesters, or These include fluoropolymers and modified products thereof.
次に、本発明では導電性の充填材として金属を付着した
炭素質粒子を用いるが、ここで付着すべき金属としては
銅、ニッケル、スズ、金、銀、白金などの導電性の良好
な金属が好ましく、一方、炭素質粒子としては粒径10
mμ〜1μ程度、特に15mμ〜100 mμのオイル
ファーネスブラック、サーマルプ、ランク、アセチレン
ブラック等のカーボンブラックやグラファイトを好適な
ものとしてあげることができる。Next, in the present invention, carbonaceous particles to which a metal is attached are used as a conductive filler, and the metal to be attached here is a metal with good conductivity such as copper, nickel, tin, gold, silver, or platinum. is preferable, and on the other hand, the carbonaceous particles have a particle size of 10
Suitable examples include carbon black such as oil furnace black, thermalp, rank, acetylene black, and graphite having a particle diameter of about mμ to 1μ, particularly 15 mμ to 100 mμ.
また、この金属を付着した炭素質粒子における金属付着
量は、特に制限はなく各種の条件に応じて適宜選定すれ
ばよいが、通常は炭素質粒子に対して5〜30重量%が
好ましい。Further, the amount of metal attached to the carbonaceous particles to which the metal is attached is not particularly limited and may be appropriately selected depending on various conditions, but it is usually preferably 5 to 30% by weight based on the carbonaceous particles.
なお、この金属を付着した炭素質粒子を製造するには、
様々な方法があるが、一般的には化学メッキにより炭素
質粒子表面に所定の金属を付着せしめればよい。ここで
、化学メッキは通常は炭素質粒子にスズやパラジウムの
イオンを吸着させて活性化した後、これを付着させるべ
き所定の金属のイオンを含むメッキ液に浸漬して、金属
を析出させることにより行なう。In addition, in order to manufacture carbonaceous particles to which this metal is attached,
Although there are various methods, generally a predetermined metal may be attached to the surface of the carbonaceous particles by chemical plating. Here, chemical plating usually involves adsorbing and activating tin or palladium ions onto carbonaceous particles, and then immersing them in a plating solution containing ions of the specified metal to be deposited to deposit the metal. This is done by
本発明の組成物は、前述の結晶性樹脂と金属を付着した
炭素質粒子よりなるものであるが、その配合割合は、結
晶性樹脂100容量部に対して、金属を付着した炭素質
粒子20〜70容量部、好ましくは30〜65容量部の
範囲とすべきである。この金属を付着した炭素質粒子の
配合割合が20容量部未満では、室温での電気抵抗が大
きくなり、また、70容量部を超えると、一定温度に達
した際の電気抵抗の増大倍率が小さくなり、実用上問題
がある。The composition of the present invention is composed of the above-mentioned crystalline resin and carbonaceous particles to which metal is attached, and the mixing ratio is 20 parts by volume of carbonaceous particles to which metal is attached to 100 parts by volume of crystalline resin. It should range from 30 to 65 parts by volume, preferably from 30 to 65 parts by volume. If the blending ratio of carbonaceous particles to which metal is attached is less than 20 parts by volume, the electrical resistance at room temperature will increase, and if it exceeds 70 parts by volume, the increase in electrical resistance will be small when a certain temperature is reached. This poses a practical problem.
本発明の組成物は、結晶性樹脂と金属を付着した炭素質
粒子を一定割合で配合すると同時に、これを混練し、さ
らに架橋化させることによって製造される。この際の混
練は、種々の条件にて行なうことができるが、通常は1
30〜250℃の温度にて5分間以上行なえばよく、ま
た用いる混練機としては、バンバリーミキサ−、ミキシ
ングロールなどがあげられる。The composition of the present invention is produced by blending a crystalline resin and metal-attached carbonaceous particles in a fixed ratio, kneading the mixture, and crosslinking the mixture. The kneading at this time can be carried out under various conditions, but usually 1
The kneading may be carried out at a temperature of 30 to 250° C. for 5 minutes or more, and examples of the kneading machine used include a Banbury mixer and a mixing roll.
混練後に行なう架橋化処理にあたっては、様々な手段に
より行なうことができ、例えば有機パーオキサイドなど
の架橋剤を加えて行なう方法、オゾンを用いる方法、電
子線等の活性エネルギー線を照射する方法などを挙げる
ことができる。ここで有機パーオキサイドとしては、ヘ
ンシイルバーオキサイド。The crosslinking treatment carried out after kneading can be carried out by various means, such as a method of adding a crosslinking agent such as an organic peroxide, a method of using ozone, a method of irradiating with active energy rays such as electron beams, etc. can be mentioned. Here, the organic peroxide is Hensil peroxide.
t〜ブチルパーオキシベンゾエート、ジクミルパーオキ
サイド、t−ブチルクミルパーオキサイド、t−ブチル
パーオキサイド、2.5−ジメチル−2゜5〜ジ(t−
ブチルパーオキシ)ヘキシン−3などを例示することが
できる。t-butyl peroxybenzoate, dicumyl peroxide, t-butylcumyl peroxide, t-butyl peroxide, 2.5-dimethyl-2゜5-di(t-
butylperoxy)hexyne-3 and the like.
上述の架橋の程度は、特に制限はなくそれぞれの状況に
応じて適宜定めればよいが、−最には用いる結晶性樹脂
に対してゲル分率が15〜60重星%程度となるように
調節すべきである。The degree of crosslinking mentioned above is not particularly limited and may be determined as appropriate depending on each situation; It should be adjusted.
このようにして得られる本発明の感熱抵抗性導電性組成
物は、常温における電気抵抗が小さく、しかも昇温時の
抵抗増大倍率が大きく、感熱抵抗材料としてきわめて有
利な特性を示す。The heat-sensitive resistive conductive composition of the present invention thus obtained has a low electrical resistance at room temperature and a large resistance increase ratio when the temperature rises, and exhibits extremely advantageous properties as a heat-sensitive resistive material.
特に、炭素質粒子含量の少ない組成物は、昇温時の電気
抵抗の増大倍率が著しく大きく、また炭素質粒子含量の
多い組成物は常温での電気抵抗が非常に小さいという特
性を有する。In particular, a composition with a small content of carbonaceous particles has a significantly large increase in electrical resistance when the temperature is increased, and a composition with a large content of carbonaceous particles has a property that the electrical resistance at room temperature is extremely small.
材料として有効に利用することができる。It can be effectively used as a material.
次に本発明を実施例によりさらに詳しく説明す′る。Next, the present invention will be explained in more detail with reference to Examples.
実施例1
平均粒径43mμのカーボンブラック(三菱化成工業側
製:ダイアブラノクE)50gを、塩化パラジウムと塩
化第一錫を含量するキャタリスト液(奥野製薬工業■製
:コンディショナーEPC)10mJと塩酸30mj!
および水160m (lからなる液に5分間浸漬し、濾
過した後水洗した。次いで、このカーボンブラックを濃
度10vo1%の希硫酸に浸漬した後、水洗してカーボ
ンブランクを活性化し、さらに、水300m !!に分
散し、これに硫酸銅とホルムアルデヒド、酒石酸塩など
を含む無電解銅メッキ液460m 7!を滴下して銅メ
ツキを施し、水洗して乾燥した。得られた銅メッキカー
ボンブラックは、銅の含有量が12.5wt%であり、
比重が2.07であった。Example 1 50 g of carbon black with an average particle size of 43 mμ (manufactured by Mitsubishi Chemical Industries: Diabranok E) was mixed with 10 mJ of a catalyst solution containing palladium chloride and stannous chloride (manufactured by Okuno Pharmaceutical Co., Ltd.: Conditioner EPC) and 30 mJ of hydrochloric acid. !
and 160 mL of water for 5 minutes, filtered, and washed with water. Next, this carbon black was immersed in dilute sulfuric acid with a concentration of 10 vol. 1%, and washed with water to activate the carbon blank. !!, and 460 m of electroless copper plating solution containing copper sulfate, formaldehyde, tartrate, etc. was added dropwise to this, copper plating was applied, and the resulting copper-plated carbon black was washed with water and dried. The copper content is 12.5 wt%,
The specific gravity was 2.07.
このようにして得られた銅メッキカーボンブラ・7り3
1.9gと、高密度ポリエチレン(出光石油化学■製:
出光ポリエチレン550 B) 38.1gとをラボプ
ラストミルにより170℃において20分間混練し、架
橋剤として2.5−ジメチル−2,5−ジ(t−ブチル
パーオキシ)ヘキシン−3を0.21 g添加して2分
間混練して架橋化した。Copper plated carbon bra 7ri 3 obtained in this way
1.9g and high-density polyethylene (manufactured by Idemitsu Petrochemical):
38.1 g of Idemitsu polyethylene 550 B) were kneaded for 20 minutes at 170°C using a laboplasto mill, and 0.21 g of 2.5-dimethyl-2,5-di(t-butylperoxy)hexyne-3 was added as a crosslinking agent. g was added and kneaded for 2 minutes to effect crosslinking.
次にこのようにして得られた架橋化組成物(これ 。Next, the crosslinked composition obtained in this way (this).
は、高密度ポリエチレン100容量部に対して銅メツキ
カーボンブラック38.9容量部からなる。)を肉厚1
mmのシートに成形し、次いでシート両面に電解銅箔を
圧着した。得られたシートから一辺1 cmの正方形の
切片を取出し、25℃における比抵抗を測定したところ
、4.7Ω・印であった。また、このものを150℃に
昇温した際の抵抗値は、25℃における抵抗値の10”
・3倍であった。The composition consisted of 38.9 parts by volume of copper-plated carbon black per 100 parts by volume of high-density polyethylene. ) to wall thickness 1
It was formed into a sheet with a thickness of 1 mm, and electrolytic copper foil was then pressure-bonded to both sides of the sheet. A square section of 1 cm on a side was taken out from the obtained sheet, and its specific resistance at 25° C. was measured, and it was found to be 4.7 Ω·. Also, the resistance value when this product is heated to 150°C is 10" of the resistance value at 25°C.
・It was three times as large.
比較例1
実施例1において、銅メッキカーボンブラックの代わり
に平均粒径43mμのカーボンブラック(ダイアブラン
クE)31.9gをそのまま用いたこと以外は実施例1
と同様に高密度ポリエチレンと混練し、架橋して組成物
を得た。このものの25℃における比抵抗は4.7Ω・
備であり、150℃に昇温した際の抵抗値は、25℃に
おける抵抗値の104・9倍であった。Comparative Example 1 Example 1 except that 31.9 g of carbon black (dia blank E) with an average particle size of 43 mμ was used as it was in place of the copper-plated carbon black.
Similarly, the mixture was kneaded with high-density polyethylene and crosslinked to obtain a composition. The specific resistance of this product at 25℃ is 4.7Ω・
The resistance value when the temperature was raised to 150°C was 104.9 times the resistance value at 25°C.
実施例2
実施例1において、高密度ポリエチレン100容量部に
対して銅メッキカーボンブラフ内子。0容量部となるよ
うに配合したこと以外は、実施例Iと同様の操作を行な
った。得られた架橋化組成物の25℃における比抵抗は
1.8Ω・印であり、150℃に昇温した際の抵抗値は
、25℃における抵抗値のtoh−”倍であった。Example 2 In Example 1, copper-plated carbon bluff inner core was used for 100 parts by volume of high-density polyethylene. The same operation as in Example I was performed except that the mixture was blended so that the amount was 0 parts by volume. The specific resistance of the obtained crosslinked composition at 25°C was 1.8 Ω·mark, and the resistance value when the temperature was raised to 150°C was toh-'' times the resistance value at 25°C.
実施例3
実施例1において、高密度ポリエチレン100容量なる
ように配合したこと以外は、実施例1と同様の操作を行
なった。得られた架橋化組成物の25℃における比抵抗
は0.82Ω・印であり、150℃に昇温した際の抵抗
値は、25℃における抵抗値の104倍であった。Example 3 The same operation as in Example 1 was carried out except that high-density polyethylene was blended so as to have a volume of 100. The specific resistance of the obtained crosslinked composition at 25°C was 0.82 Ω·mark, and the resistance value when the temperature was raised to 150°C was 104 times the resistance value at 25°C.
Claims (3)
架橋化組成物であって、前記結晶性樹脂100容量部に
、前記金属を付着した炭素質粒子を20〜70容量部配
合してなる感熱抵抗性導電性組成物。(1) A crosslinked composition comprising a crystalline resin and carbonaceous particles to which a metal is attached, wherein 20 to 70 parts by volume of the carbonaceous particles to which the metal is attached are blended to 100 parts by volume of the crystalline resin. A heat-sensitive resistive conductive composition.
ブラックである特許請求の範囲第1項記載の組成物。(2) The composition according to claim 1, wherein the carbonaceous particles to which metal is attached are copper-plated carbon black.
質粒子に対して5〜30重量%である特許請求の範囲第
1項記載の組成物。(3) The composition according to claim 1, wherein the amount of metal attached to the carbonaceous particles to which the metal is attached is 5 to 30% by weight based on the carbonaceous particles.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20145284A JPS6181460A (en) | 1984-09-28 | 1984-09-28 | Heat-sensitive resistive conductive composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20145284A JPS6181460A (en) | 1984-09-28 | 1984-09-28 | Heat-sensitive resistive conductive composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6181460A true JPS6181460A (en) | 1986-04-25 |
JPH0453904B2 JPH0453904B2 (en) | 1992-08-27 |
Family
ID=16441320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20145284A Granted JPS6181460A (en) | 1984-09-28 | 1984-09-28 | Heat-sensitive resistive conductive composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6181460A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63278303A (en) * | 1987-05-11 | 1988-11-16 | Nippon Mektron Ltd | Ptc element |
JPH08172001A (en) * | 1994-12-16 | 1996-07-02 | Sony Chem Corp | Ptc element, protective circuit using it, and circuit board |
CN100381493C (en) * | 2006-05-19 | 2008-04-16 | 浙江大学 | Method for preparing conductive polymer composite material by metal particle modified carbon black |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4982736A (en) * | 1972-12-13 | 1974-08-09 | ||
JPS5190338A (en) * | 1975-02-06 | 1976-08-07 | ||
JPS56161464A (en) * | 1980-04-21 | 1981-12-11 | Raychem Corp | Filler-containing ptc electroconductive polymer composition |
JPS5978248A (en) * | 1982-10-28 | 1984-05-07 | Agency Of Ind Science & Technol | Filler having metallic film |
-
1984
- 1984-09-28 JP JP20145284A patent/JPS6181460A/en active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4982736A (en) * | 1972-12-13 | 1974-08-09 | ||
JPS5190338A (en) * | 1975-02-06 | 1976-08-07 | ||
JPS56161464A (en) * | 1980-04-21 | 1981-12-11 | Raychem Corp | Filler-containing ptc electroconductive polymer composition |
JPS5978248A (en) * | 1982-10-28 | 1984-05-07 | Agency Of Ind Science & Technol | Filler having metallic film |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63278303A (en) * | 1987-05-11 | 1988-11-16 | Nippon Mektron Ltd | Ptc element |
JPH08172001A (en) * | 1994-12-16 | 1996-07-02 | Sony Chem Corp | Ptc element, protective circuit using it, and circuit board |
CN100381493C (en) * | 2006-05-19 | 2008-04-16 | 浙江大学 | Method for preparing conductive polymer composite material by metal particle modified carbon black |
Also Published As
Publication number | Publication date |
---|---|
JPH0453904B2 (en) | 1992-08-27 |
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