JPS6171949A - Grinding device for difficult-cutting material and the like - Google Patents
Grinding device for difficult-cutting material and the likeInfo
- Publication number
- JPS6171949A JPS6171949A JP18937084A JP18937084A JPS6171949A JP S6171949 A JPS6171949 A JP S6171949A JP 18937084 A JP18937084 A JP 18937084A JP 18937084 A JP18937084 A JP 18937084A JP S6171949 A JPS6171949 A JP S6171949A
- Authority
- JP
- Japan
- Prior art keywords
- linear
- linear grinding
- ground
- grinding
- grinding body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 38
- 239000006061 abrasive grain Substances 0.000 claims abstract description 9
- 238000003466 welding Methods 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 abstract description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 abstract description 2
- 229910003460 diamond Inorganic materials 0.000 abstract description 2
- 239000010432 diamond Substances 0.000 abstract description 2
- 229920003002 synthetic resin Polymers 0.000 abstract description 2
- 239000000057 synthetic resin Substances 0.000 abstract description 2
- -1 cermets Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はセラミックス、サーメット、シリコン等の高価
な難削材料等を効率良く切断又は研磨するだめの研削装
置に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a grinding device for efficiently cutting or polishing expensive and difficult-to-cut materials such as ceramics, cermets, and silicon.
（従来の技術及びその問題点）
例えば前記材質の棒材等を研削切断するに際して、従来
は薄刃のレジノイド、メタルボンド砥石又は電着砥石等
が用いられている。ところが砥石は所定の強度を保つた
めに所定の厚みが必要であり、従って切断に際しては、
この厚みに相当する材料が無駄になると同時に、それと
同一体積の材料を研削するのに必要なエネルギを消費し
、また砥石自体もそれだけ磨耗してし才う。更に砥石に
よる切断では、砥石径によって被研削材料の外径が制限
されてしまう。(Prior Art and its Problems) For example, when grinding and cutting bars made of the above-mentioned materials, thin-bladed resinoid, metal bond grindstones, electroplated grindstones, and the like have conventionally been used. However, grindstones need a certain thickness in order to maintain a certain strength, so when cutting,
Not only is this thickness of material wasted, but the energy required to grind the same volume of material is also consumed, and the grindstone itself is also worn out. Furthermore, when cutting with a grindstone, the outer diameter of the material to be ground is limited by the diameter of the grindstone.
本発明は砥石を用いた従来の研削装置の前述した欠点を
解消］〜、被研削材料の研削巾を薄くし得るようにする
ことにより、材料損失、研削体磨耗量並びに消費エネル
ギーを減少させると共に、被研削材料の外径制限も緩和
させることを目的とするものである。以下本発明を実施
例を示す図面に基づいて詳述すると次の通りである。The present invention eliminates the above-mentioned drawbacks of the conventional grinding device using a grinding wheel. By making it possible to reduce the width of the grinding material to be ground, it reduces material loss, the amount of wear on the grinding body, and energy consumption. , the purpose of this is to alleviate restrictions on the outer diameter of the material to be ground. The present invention will be described in detail below based on drawings showing embodiments.
符号１は線状研削体であり、これは芯線２の周囲に砥粒
３を接着又は溶着して構成する。芯線２としては例えば
直径数ミクロンから数十ミクロンのピアノ線や合成樹脂
等のフィラメントヲ用い、寸た砥粒３としては例えば窒
化ボロンやダイヤモンド等を用いる。しかして本発明は
かかる線状研削体１を一方側から他方側に連続的に走ら
せる構成とすると共に、被研削材料４または前記線状研
削体１を他方に対して移動自在に構成し、前記線状研削
体１″ｆｆニ一方側から他方側に走らせつつ該線状研削
体１１だけ被研削材料４を該線状研削体１の横断力向に
移動させて研削を行なうように構成したことを特徴とす
るものである。ここで線状研削体１を一方側から他方側
に連続的に走らせる構成としては、例えば図示例のよう
に夫々の側にボビン５，６を設け、線状研削体１を一方
のボビン５から他方のボビン６に巻き取ることによって
走らせる構成とする他、線状研削体１を無端に構成して
循環式に走らせる構成とする等適宜である。Reference numeral 1 denotes a linear grinding body, which is constructed by adhering or welding abrasive grains 3 around a core wire 2. As the core wire 2, for example, a piano wire or a synthetic resin filament having a diameter of several microns to several tens of microns is used, and as the small abrasive grains 3, for example, boron nitride, diamond, or the like is used. Therefore, the present invention has a configuration in which such a linear grinding body 1 runs continuously from one side to the other side, and a configuration in which the material to be ground 4 or the linear grinding body 1 is movable relative to the other side, Grinding is performed by moving the material 4 to be ground by the linear grinding body 11 in the transverse force direction of the linear grinding body 1 while running the linear grinding body 1″ff from one side to the other side. Here, as a configuration in which the linear grinding body 1 is continuously run from one side to the other, for example, bobbins 5 and 6 are provided on each side as shown in the illustrated example, and the wire In addition to having a configuration in which the linear grinding body 1 is wound up from one bobbin 5 to the other bobbin 6 and running, it is also possible to configure the linear grinding body 1 to be endless and running it in a circulating manner, as appropriate.
また被研削材料４捷たけ線状研削体１を他方に対して移
動自在とする構成として、図示例の構成は、前記ボビン
５，６間に前記線状研削体１の一側、即ち図示例に於い
ては線状研削体１の下側に対応して、前記夫々のボビン
５，６側に案内車７，８を設け、そしてそれらの案内車
７，８間には前記線状研削体１の他側、即ち図示例に於
いて上側に対応して、夫々の案内車７，８側に作動案内
車９゜１０を設けると共に、該作動案内車９．１０に前
記線状研削体１の横断方向、即ち図示例に於いて上下方
向に移動自在に構成し、そして前記線状研削体１の一側
で前記作動案内車９，１０間に前記被研削材料４を固定
的に支持する構成である。この実施例のように線状研削
体１側だけを他方に対して移動させる構成としても良い
し、これとは逆に被研削材料４側を移動させる構成とし
ても良いし、また両者を移動させる構成としても良い。Further, as a configuration in which the material to be ground 4 is separated and the linear grinding body 1 is movable relative to the other, the illustrated example has one side of the linear grinding body 1 between the bobbins 5 and 6, that is, the illustrated example. In this case, guide wheels 7 and 8 are provided on the respective bobbin 5 and 6 sides corresponding to the lower side of the linear grinding body 1, and the linear grinding body is disposed between the guide wheels 7 and 8. 1, corresponding to the upper side in the illustrated example, an operating guide wheel 9.10 is provided on each of the guide wheels 7 and 8, and the linear grinding body 1 The material to be ground 4 is fixedly supported between the operation guide wheels 9 and 10 on one side of the linear grinding body 1. It is the composition. As in this embodiment, only the linear grinding body 1 side may be moved relative to the other, or conversely, the material to be ground 4 side may be moved, or both may be moved. It may also be used as a configuration.
尚、図示例に於いて符号１１は綾振り装置である。In the illustrated example, reference numeral 11 is a traversing device.
（作用）
以上の構成に於いて難削材料を研削するには、まず被研
削材料４を適宜の支持装置（図示せず）によって支持し
、前記線状研削体１を一方側から他方側に走らせる。こ
れと共に該線状研削体１または被研削材料４を該線状研
削体１の横断方向に移動させると、被研削材料４はかか
る移動に従って芯線２の周囲の砥粒３によって研削され
、所定の切断または研磨を行なうことができる。尚、前
記線状研削体１０走行速度や、この時の張力並びに線状
研削体１捷だけ被研削材料４の移動速度は、被研削材料
４の材質等に応じて適宜に設定して良い。本発明はこの
ように線状研削体１によって研削するものであって、研
削に際しての所要強度は芯線２の張力で保持するもので
あるから、引張強度の大きいピアノ線等の芯線２を用い
ることによす、小径でも十分な所要強度をもたせること
ができる。従って本発明は線状研削体１の研削巾を従来
の砥石よりも大巾に狭くすることができる。また本発明
は線状研削体１によって研削するものであるから、研削
部の長さを適宜に調節することができ、従って被研削材
料４の外径制限を緩和することができると共に、場合に
よっては複数の被研削材料を同時に研削するようにする
こともできる。(Function) In order to grind a difficult-to-cut material with the above configuration, the material to be ground 4 is first supported by an appropriate support device (not shown), and the linear grinding body 1 is moved from one side to the other. make them run. At the same time, when the linear grinding body 1 or the material to be ground 4 is moved in the transverse direction of the linear grinding body 1, the material to be ground 4 is ground by the abrasive grains 3 around the core wire 2 according to this movement, and is ground to a predetermined level. Can be cut or polished. Incidentally, the running speed of the linear grinding body 10, the tension at this time, and the moving speed of the material to be ground 4 by one stroke of the linear grinding body may be appropriately set according to the material of the material to be ground 4, etc. In the present invention, grinding is performed using the linear grinding body 1 as described above, and the required strength during grinding is maintained by the tension of the core wire 2. Therefore, the core wire 2 such as piano wire with high tensile strength is used. Therefore, it is possible to provide sufficient strength even with a small diameter. Therefore, according to the present invention, the grinding width of the linear grinding body 1 can be made much narrower than that of conventional grindstones. Furthermore, since the present invention performs grinding using the linear grinding body 1, the length of the grinding part can be adjusted as appropriate, and therefore the outer diameter restriction of the material to be ground 4 can be relaxed, and in some cases, It is also possible to simultaneously grind a plurality of materials to be ground.
（発明の効果）
本発明は以上の通り、芯線の周囲に砥粒を接着または溶
着して線状研削体を構成し、この線状研削体を一方側か
ら他方側に走らせて被研削材料を研削するようにしだの
で、従来の砥石″による研削と比較して、被研削材料の
研削ｌ〕ヲ薄くすることができ、従って材料損失や研削
体磨耗量並びに消費エネルギを大幅に減少させることが
できるという効果がある。また本発明は研削部の長さを
適宜に調節できるので被研削材料の外径制限を緩和した
り、同時に複数の被研削材料を研削したりすることもで
きるという効果がある。(Effects of the Invention) As described above, the present invention configures a linear grinding body by adhering or welding abrasive grains around a core wire, and runs this linear grinding body from one side to the other to grind the material to be ground. Compared to grinding with a conventional grinding wheel, the material to be ground can be ground thinner, and material loss, wear of the grinding body, and energy consumption can be significantly reduced. Furthermore, since the length of the grinding part can be adjusted as appropriate, the present invention has the effect of easing restrictions on the outer diameter of the material to be ground and allowing the grinding of multiple materials to be ground at the same time. be.
第１図は線状研削体の一実施例の横断面図、第２図は本
発明装置の一実施例の全体説明図である。
符号１・・・線状研削体、２・・・芯線、３・・・砥粒
、４・・・被研削材料、５，６・・・ボビン、７，８・
・・案内車、９．１０・・・作動案内車、１１・・・綾
振り装置。FIG. 1 is a cross-sectional view of one embodiment of the linear grinding body, and FIG. 2 is an overall explanatory diagram of one embodiment of the apparatus of the present invention. Code 1... Linear grinding body, 2... Core wire, 3... Abrasive grain, 4... Material to be ground, 5, 6... Bobbin, 7, 8...
...Guide car, 9.10...Operation guide car, 11...Trailing device.
Claims (2)
体を構成し、該線状研削体を一方側から他方側に連続的
に走らせる構成とすると共に、被研削材料または前記線
状研削体を他方に対して移動自在に構成し、前記線状研
削体を一方側から他方側に走らせつつ該線状研削体また
は被研削材料を該線状研削体の横断方向に移動させて研
削を行なうように構成したことを特徴とする難削材料等
の研削装置。(1) A linear grinding body is constructed by adhering or welding abrasive grains around the core wire, and the linear grinding body is configured to run continuously from one side to the other, and the material to be ground or The linear grinding body is configured to be movable relative to the other, and the linear grinding body or the material to be ground is moved in a transverse direction of the linear grinding body while running the linear grinding body from one side to the other side. 1. A grinding device for grinding difficult-to-cut materials, etc., characterized in that the grinding device is configured to perform grinding by grinding.
に走らせる構成とし、それらのリール間には前記線状研
削体の一側に対応して、夫々のリール側に案内車を設け
、そしてそれらの案内車間には前記線状研削体の他側に
対応して、夫々の案内車側に作動案内車を設けると共に
、該作動案内車を前記線状研削体の横断方向に移動自在
に構成し、前記線状研削体の一側で、前記作動案内車間
に被研削材料を支持する構成としたことを特徴とする特
許請求の範囲第１項記載の難削材料等の研削装置。(2) A linear grinding body is configured to run between a reel on one side and a reel on the other side, and between those reels, a guide wheel is provided on each reel side corresponding to one side of the linear grinding body. and an operating guide wheel is provided between the guide wheels on each guide wheel side corresponding to the other side of the linear grinding body, and the operation guide wheel is provided in a transverse direction of the linear grinding body. Grinding of difficult-to-cut materials, etc. according to claim 1, characterized in that the grinding material is configured to be movable and the material to be ground is supported between the operation guide wheels on one side of the linear grinding body. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18937084A JPS6171949A (en) | 1984-09-10 | 1984-09-10 | Grinding device for difficult-cutting material and the like |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18937084A JPS6171949A (en) | 1984-09-10 | 1984-09-10 | Grinding device for difficult-cutting material and the like |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6171949A true JPS6171949A (en) | 1986-04-12 |
Family
ID=16240180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18937084A Pending JPS6171949A (en) | 1984-09-10 | 1984-09-10 | Grinding device for difficult-cutting material and the like |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6171949A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04348734A (en) * | 1991-05-27 | 1992-12-03 | Niigata Eng Co Ltd | Cleaning method of top plate |
| US9028948B2 (en) | 2009-08-14 | 2015-05-12 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof |
| CN104640676A (en) * | 2012-06-29 | 2015-05-20 | 圣戈班磨料磨具有限公司 | Abrasive article and method of forming |
| US9067268B2 (en) | 2009-08-14 | 2015-06-30 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
| US9186816B2 (en) | 2010-12-30 | 2015-11-17 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9533397B2 (en) | 2012-06-29 | 2017-01-03 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9878382B2 (en) | 2015-06-29 | 2018-01-30 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9902044B2 (en) | 2012-06-29 | 2018-02-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49112287A (en) * | 1973-02-28 | 1974-10-25 | ||
| JPS5135189A (en) * | 1974-09-13 | 1976-03-25 | Lumalampan Ab | NOKOBIKYOKINZOKUWAIYA |
| JPS5183297A (en) * | 1975-01-17 | 1976-07-21 | Inoue Japax Res | KENMASOCHI |
| JPS52136494A (en) * | 1976-05-12 | 1977-11-15 | Hitachi Ltd | Process for grooving brittle material |
-
1984
- 1984-09-10 JP JP18937084A patent/JPS6171949A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49112287A (en) * | 1973-02-28 | 1974-10-25 | ||
| JPS5135189A (en) * | 1974-09-13 | 1976-03-25 | Lumalampan Ab | NOKOBIKYOKINZOKUWAIYA |
| JPS5183297A (en) * | 1975-01-17 | 1976-07-21 | Inoue Japax Res | KENMASOCHI |
| JPS52136494A (en) * | 1976-05-12 | 1977-11-15 | Hitachi Ltd | Process for grooving brittle material |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04348734A (en) * | 1991-05-27 | 1992-12-03 | Niigata Eng Co Ltd | Cleaning method of top plate |
| US9028948B2 (en) | 2009-08-14 | 2015-05-12 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof |
| US9862041B2 (en) | 2009-08-14 | 2018-01-09 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
| US9067268B2 (en) | 2009-08-14 | 2015-06-30 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
| US9186816B2 (en) | 2010-12-30 | 2015-11-17 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9687962B2 (en) | 2012-06-29 | 2017-06-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9533397B2 (en) | 2012-06-29 | 2017-01-03 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| CN104640676A (en) * | 2012-06-29 | 2015-05-20 | 圣戈班磨料磨具有限公司 | Abrasive article and method of forming |
| US9902044B2 (en) | 2012-06-29 | 2018-02-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US10596681B2 (en) | 2012-06-29 | 2020-03-24 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9878382B2 (en) | 2015-06-29 | 2018-01-30 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US10137514B2 (en) | 2015-06-29 | 2018-11-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US10583506B2 (en) | 2015-06-29 | 2020-03-10 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
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