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JPS6166947U - - Google Patents

Info

Publication number
JPS6166947U
JPS6166947U JP15150984U JP15150984U JPS6166947U JP S6166947 U JPS6166947 U JP S6166947U JP 15150984 U JP15150984 U JP 15150984U JP 15150984 U JP15150984 U JP 15150984U JP S6166947 U JPS6166947 U JP S6166947U
Authority
JP
Japan
Prior art keywords
package
semiconductor device
lead legs
conductive seal
adhered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15150984U
Other languages
Japanese (ja)
Other versions
JPH0351975Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984151509U priority Critical patent/JPH0351975Y2/ja
Publication of JPS6166947U publication Critical patent/JPS6166947U/ja
Application granted granted Critical
Publication of JPH0351975Y2 publication Critical patent/JPH0351975Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例による半導体装置の
斜視図、第2図は本考案の別の実施例の斜視図、
第3図は第2図の導電シールを切り取り線部より
はがした時の斜視図、第4図、第5図及び第6図
はそれぞれ従来例の説明図である。 1…半導体装置、11…パツケージ、12…リ
ード足、6…導電シール、61…取手部、62…
切り取り線部、63…残留部分。
FIG. 1 is a perspective view of a semiconductor device according to one embodiment of the present invention, FIG. 2 is a perspective view of another embodiment of the present invention,
FIG. 3 is a perspective view of the conductive seal shown in FIG. 2 removed from the cutout line, and FIGS. 4, 5, and 6 are explanatory views of conventional examples, respectively. DESCRIPTION OF SYMBOLS 1...Semiconductor device, 11...Package, 12...Lead foot, 6...Conductive seal, 61...Handle part, 62...
Cutout line part, 63...Remaining part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パツケージからリード足が突出された半導体装
置において、前記パツケージに、該パツケージの
上面より前記リード足のすべての表面に電気的に
接触して接着されるサージ破壊防止用の導電シー
ルを着脱自在に装着したことを特徴とする半導体
装置。
In a semiconductor device in which lead legs protrude from a package, a conductive seal for preventing surge damage is detachably attached to the package and is electrically contacted and adhered to all surfaces of the lead legs from the top surface of the package. A semiconductor device characterized by:
JP1984151509U 1984-10-05 1984-10-05 Expired JPH0351975Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984151509U JPH0351975Y2 (en) 1984-10-05 1984-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984151509U JPH0351975Y2 (en) 1984-10-05 1984-10-05

Publications (2)

Publication Number Publication Date
JPS6166947U true JPS6166947U (en) 1986-05-08
JPH0351975Y2 JPH0351975Y2 (en) 1991-11-08

Family

ID=30709619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984151509U Expired JPH0351975Y2 (en) 1984-10-05 1984-10-05

Country Status (1)

Country Link
JP (1) JPH0351975Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7061595B2 (en) 2000-08-02 2006-06-13 Honeywell International Inc. Miniaturized flow controller with closed loop regulation
US7420659B1 (en) 2000-06-02 2008-09-02 Honeywell Interantional Inc. Flow control system of a cartridge
US7553453B2 (en) 2000-06-02 2009-06-30 Honeywell International Inc. Assay implementation in a microfluidic format

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4863657U (en) * 1971-11-22 1973-08-13
JPS5098782A (en) * 1973-12-27 1975-08-06

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4863657U (en) * 1971-11-22 1973-08-13
JPS5098782A (en) * 1973-12-27 1975-08-06

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7420659B1 (en) 2000-06-02 2008-09-02 Honeywell Interantional Inc. Flow control system of a cartridge
US7553453B2 (en) 2000-06-02 2009-06-30 Honeywell International Inc. Assay implementation in a microfluidic format
US7061595B2 (en) 2000-08-02 2006-06-13 Honeywell International Inc. Miniaturized flow controller with closed loop regulation

Also Published As

Publication number Publication date
JPH0351975Y2 (en) 1991-11-08

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