JPS6161445A - Manufacture of lead frame attached with heat sink - Google Patents
Manufacture of lead frame attached with heat sinkInfo
- Publication number
- JPS6161445A JPS6161445A JP18321684A JP18321684A JPS6161445A JP S6161445 A JPS6161445 A JP S6161445A JP 18321684 A JP18321684 A JP 18321684A JP 18321684 A JP18321684 A JP 18321684A JP S6161445 A JPS6161445 A JP S6161445A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- lead frame
- cutting
- thin
- metal bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000002184 metal Substances 0.000 claims abstract description 17
- 238000005520 cutting process Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000004049 embossing Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 abstract 2
- 238000003801 milling Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明に半導体装置等に用いられる放熱板付リードフレ
ームの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a lead frame with a heat sink used in semiconductor devices and the like.
従来の技術
第２図は大電力用半導体集積回路装置の一例を示すもの
で、図においてｌは放熱板、２は放熱板ｌ上に固定した
半導体ベレット、３は一端が半導体ベレット２の近傍に
配置され、中間部乃至他端部が平行に延びた複数のリー
ド、４は半導体ベレット２上の電極（図示せず）とリー
ド３の一端部とを電気的に接続する金属細線、５は半導
体ベレット２を含む主要部を被覆した樹脂外装部を示ブ
。Conventional technology Fig. 2 shows an example of a high-power semiconductor integrated circuit device. A plurality of leads are arranged, and the middle part or the other end extends in parallel; 4 is a thin metal wire that electrically connects an electrode (not shown) on semiconductor pellet 2 and one end of lead 3; 5 is a semiconductor The resin exterior covering the main parts including the pellet 2 is shown.
放熱板ｌは断面形状が凸形に形成され、段部１ａを横切
る方向に、肉薄部１ｂ乃至肉厚部１ｃに略Ｕ字形の切欠
きｌｄ、ｌｄを設け、また切欠き１ｄによって分割され
た肉薄部ｌｂ上にエンボスｌｅ。The heat dissipation plate l has a convex cross-sectional shape, and is provided with approximately U-shaped notches ld and ld in the thin portion 1b to the thick portion 1c in the direction across the step portion 1a, and is divided by the notch 1d. Emboss le on thin part lb.
ｌｅ、・・・・・を形成している。le,... are formed.
リー１３は第３図に示すリードフレーム６を用いて形成
されたもので、両端に支持リード６ａ。The lead 13 is formed using the lead frame 6 shown in FIG. 3, and has support leads 6a at both ends.
６ｂを平行配置し、各支持リー ドロａ、６ｂの間に、
一端部を放熱板ｌ上の半導体ベレット２の近傍に位置す
るように配置ｔし中間部乃至他端部を支持リード６ａ、
６ｂに対し平野に延びる複数のリード６ｃ〜６ｇを配置
したものを一組とし、これを複数組、各リードの中間部
乃至他端部をタイバー７．８にて一体化したもので、支
持リード６ａ。6b are arranged in parallel, and between each support lead row a and 6b,
One end is arranged near the semiconductor pellet 2 on the heat sink l, and the middle part or the other end is the support lead 6a,
A set includes a plurality of leads 6c to 6g extending in a plain direction relative to 6b, and these sets are integrated with a tie bar 7.8 from the middle part to the other end of each lead. 6a.
６ｂの中間部から放熱板１のエンホ゛スｌθ、ｌｅに対
応する穴５ｈ 、 ６ｈ 、・・・・・・を穿設した舌
片６１゜６１８・・・・・・を延在式せている。このリ
ードフレーム６の穴６ ｈ 、 ６ ｈ 、・・・・・
に放熱板１のエンボスｌｅ。Tongue pieces 61.degree. 618. . . are provided extending from the middle portion of the heat sink 6b, with holes 5h, 6h, . Holes 6h, 6h,... of this lead frame 6
Embossed on heat sink 1.
１ｅを挿通してかしめ固定している。1e is inserted and fixed by caulking.
＝！た樹脂外装部５け放熱板１の突部のみを露呈した状
態で切欠き１ｄに沿う全面を被覆し、この樹脂外装後、
切欠８１ｄ部の支持リード６ ａ、 ６ ｂ及びリード
間のタイバー７．８を切断して個々の半導体装置に分離
している。=! After covering the entire surface along the notch 1d with only the protrusion of the heat dissipating plate 1 exposed,
The support leads 6 a and 6 b in the notch 81 d and the tie bar 7.8 between the leads are cut to separate the semiconductor devices into individual semiconductor devices.
発明が解決しようとする問題点
ところで、この装置に用いられる放熱板１け、従来、第
４図（ａ）に示すように断面矩形状の金属板９Ｑ側壁近
傍に貫通孔９ａ、９ａを穿設し、次に第４図（ｂ）に示
プように孔９ａ、９ａと側壁との間を打ち抜いて略Ｕ字
状の切欠き９ｂ、９ｂを形成し、さらに第４図ｔｃ）に
示すように切欠き９ｂ、９ｂを含む両側部分をプレスし
て肉薄部９ｃ 、９ｃを形成すると同時に肉薄部９ｃ
、９ｃに対応する受台に小孔を形成しておき、図示しな
いが金属板９の裏面側にエンボスを形成し、図示一点鎖
線部分より切断して放熱板を得ている。Problems to be Solved by the Invention By the way, conventionally, as shown in FIG. 4(a), in the single heat sink used in this device, through holes 9a, 9a are bored in the vicinity of the side wall of a metal plate 9Q having a rectangular cross section. Next, as shown in FIG. 4(b), punch out between the holes 9a, 9a and the side wall to form approximately U-shaped notches 9b, 9b, and then as shown in FIG. 4(tc). Press the notches 9b and both sides including the 9b to form the thin parts 9c and 9c.
, 9c are formed in the pedestal, and although not shown, an emboss is formed on the back side of the metal plate 9, and the heat dissipation plate is obtained by cutting along the dashed line shown in the figure.
しかしながら、肉薄部９Ｃを形成するときに第５図に示
すように切欠さ９ｂの内方に食み出し部分１ｏが形成さ
れるため個々の放熱板に切断する前又は切断後にこの食
み出し部分１ｏを除去して成形する作業が必要で、工数
が多くかかる問題があった。However, when forming the thin part 9C, a protruding part 1o is formed inward of the notch 9b as shown in FIG. 5, so this protruding part 1o is formed before or after cutting into individual heat sinks There was a problem that it required a lot of man-hours to remove and mold the 1o.
また肉薄部９Ｃを形成するためにプレス圧の大きな大型
の装置を必要とするという欠点があった。Another drawback is that a large-sized device with a large press pressure is required to form the thin portion 9C.
また肉薄部９Ｃを形成する時に同時艮エンボスｌｅ、ｌ
ｅを形成することも可能であるが、この場合にはプレス
圧が分散されるためエンボスの形状がばらつき、支持リ
ード６ａ、６ａのかしめ強度がばらつくことがあった。Also, when forming the thin part 9C, simultaneous embossing le, l
It is also possible to form the embossed portion 6a, but in this case, the press pressure is dispersed, so the shape of the embossing may vary, and the caulking strength of the support leads 6a, 6a may vary.
さらには、食み出し部分１０が形成されるときに、穴９
ａの周辺が盛り上り、放熱板ｌの平坦性を損う問題もあ
った。Furthermore, when the protruding portion 10 is formed, the hole 9
There was also the problem that the periphery of a was raised, impairing the flatness of the heat sink l.
問題点を解決するための手段
本発明は上記問題点を解決するために提案されたもので
、断面形状が凸形の金属棒の段部を横切り肉薄部乃至肉
厚部に略Ｕ字形の切欠きを設ける工程と、肉薄部にエン
ボスを突設させる工程と、金属棒を所定長さに切断し個
々の放熱板に分割する工程と、両端に放熱板のエンボス
と対応する穴を有する支持リードを有し、支持リード間
に複数のリードを配置して各リードをタイバーにて連結
したリードフレームを、支持リードの穴に放熱板のエン
ボスを挿通してかしめ固定する工程とを含むことを特徴
とする。Means for Solving the Problems The present invention was proposed in order to solve the above-mentioned problems, and includes a substantially U-shaped cut in the thin or thick part of the metal rod having a convex cross-sectional shape. A process of forming a notch, a process of protruding an emboss on a thin part, a process of cutting a metal rod to a predetermined length and dividing it into individual heat sinks, and a support lead having holes at both ends corresponding to the embossing of the heat sink. A lead frame in which a plurality of leads are arranged between support leads and each lead is connected with a tie bar is inserted into the hole of the support lead through the embossment of the heat sink and fixed by caulking. shall be.
作用
本発明による放熱板は断面凸形の金属棒に切欠きとエン
ボスを形成したものを用いる。Function The heat dissipation plate according to the present invention uses a metal rod having a convex cross section with notches and embossing formed therein.
実施例
以下に本発明の実施例を第１図（ａ）乃至第１図（ｅ）
から説明する。図において１１は断面形状が凸形の金属
棒で、切削又は圧延などにより予め成形されている。こ
の金属棒１１を第１図（ａ）に示すように段部１１ａを
上面に向けて配置し、肉厚部１１ｂの両端部に透孔１１
ｃ 、ｌｌｃを穿設する。そして第１図（ｂ）に示すよ
う（（肉薄部１１ｄを透孔上１ｃ。Examples Examples of the present invention are shown in FIGS. 1(a) to 1(e) below.
I will explain from. In the figure, reference numeral 11 denotes a metal rod having a convex cross-sectional shape, which is previously formed by cutting or rolling. This metal rod 11 is arranged with the stepped portion 11a facing upward as shown in FIG.
c, drill the llc. Then, as shown in FIG. 1(b), the thin portion 11d is placed above the through hole 1c.
１１ｃの直径と同じ巾で切欠いて連通させ、切欠きｌｉ
ｅを設け、肉薄部１１ｄに第１図（ｃ）に示すようにエ
ンボスｌｌｆを設け、この金属棒１１を所定長さに切断
して第１図（ｄ）に示す放熱板１２を得る。そしてこの
放熱板１２に第３図と同じ形状のリードフレーム６を、
その支持リード６ ａ、６ ａｆ） 穴６ ｈ 、 ６
ｈ 、・・・・・・に放熱板１２のエンボスｌｌｅ。Make a notch with the same width as the diameter of 11c for communication, and make a notch li
The metal rod 11 is cut into a predetermined length to obtain the heat sink 12 shown in FIG. 1(d). Then, a lead frame 6 having the same shape as that shown in FIG. 3 is attached to this heat sink 12.
Support leads 6a, 6af) Holes 6h, 6
h, embossed on the heat sink 12.
１１θ、・・・・・・を嵌合させ、かしめ固定し第１図
（ｅ） ｖｃ 。11θ, .
示す放熱板付リードフレームを得る。A lead frame with a heat sink as shown is obtained.
見！
以上のように本発明によれば断面形状が凸形の金属棒を
用いて放熱板を形成したから、従来切欠きを形成する際
に生じる食み出し部分を除去する工程が不要となり、工
数が低減でき、また切欠きを形成するプレス装置も小形
のものでよく、製造装置を小形化できる。look! As described above, according to the present invention, since the heat sink is formed using a metal rod with a convex cross-sectional shape, there is no need to remove the protruding portion that occurs when forming a conventional notch, and the number of man-hours is reduced. In addition, the press device for forming the notch may be small, and the manufacturing device can be made compact.
また肉薄部は初めから形成きれているため切欠さの形成
と同時にエンボスを形成することにより製造工数をより
低減しても、エンボスの形状を良好にでき、リードフレ
ームとのかしめ固定を良好にでき、また切欠き周辺の平
坦性を保つことができる。In addition, since the thin wall part is already formed from the beginning, by forming the emboss at the same time as forming the notch, even if the manufacturing process is further reduced, the shape of the emboss can be made good, and the caulking with the lead frame can be made well. , it is also possible to maintain flatness around the notch.
第１図Ｆ＆）乃至第１図（ｅ）は本発明による放熱板付
リードフレームの製造方法を示し、第１図（ａｔ、 （
ｂ） 。
（ｄ） 、 ｔｅ）は斜°視図、第１図ｆｃ）は断面図
を示−ｆ ｏ ＠ ２図は半導体装置の一例を示す一部
透視斜視図、第３図はリードフレームの平面図、第４図
（ａ）乃至第４図（Ｃ）は放熱板の製造方法を示す斜視
図、第５図は従来の問題点を示す平面図である。
６・・・・・・リードフレーム、
６ａ、６ｂ・・・ 支持リード。
６ｃ、６ｄ、６ｅ、６ｆ、６ｇ・・−＝リード、６ｈ・
・・・・・穴、
７．８・・・・・タイバー、
１１・・・・・・金属棒、
１１ａ・・・・・・段部、
１１ｂ・・・・・・肉厚部、
１１（Ｌ・・・・・・肉薄部、
１１ｅ・・・・・・切欠Ｓ。
１１ｆ・・・・・・エンボス、
１２・・・・・・放熱板。
第１図（ｄ・）
し
第 １ 図（ｅ）
第 ４ 図（Ｑ） 第 ４ 図（ｂ
）第５図1F&) to FIG. 1E show a method for manufacturing a lead frame with a heat sink according to the present invention, and FIGS.
b). (d), te) are perspective views, Figure 1 fc) is a cross-sectional view, -f o @ Figure 2 is a partially transparent perspective view showing an example of a semiconductor device, and Figure 3 is a plan view of a lead frame. , FIG. 4(a) to FIG. 4(C) are perspective views showing a method of manufacturing a heat sink, and FIG. 5 is a plan view showing a conventional problem. 6...Lead frame, 6a, 6b... Support leads. 6c, 6d, 6e, 6f, 6g...-=lead, 6h.
... Hole, 7.8 ... Tie bar, 11 ... Metal rod, 11a ... Step part, 11b ... Thick part, 11 ( L... Thin wall part, 11e... Notch S. 11f... Emboss, 12... Heat sink. Fig. 1 (d) and Fig. 1 (e) Figure 4 (Q) Figure 4 (b
) Figure 5
Claims (1)
厚部に略Ｕ字形の切欠きを設ける工程と、肉薄部にエン
ボスを突設させる工程と、金属棒を所定長さに切断し個
々の放熱板に分割する工程と、両端に放熱板のエンボス
と対応する穴を有する支持リードを有し、支持リード間
に複数のリードを配置して各リードをタイバーにて連結
したリードフレームを、支持リードの穴に放熱板のエン
ボスを挿通してかしめ固定する工程とを含むことを特徴
とする放熱板付リードフレームの製造方法。A process of providing a substantially U-shaped notch in a thin or thick part across the stepped part of a metal rod with a convex cross-sectional shape, a process of providing an embossing in the thin part, and cutting the metal rod to a predetermined length. A lead frame that has support leads with holes corresponding to the embossing of the heat sink at both ends, a plurality of leads arranged between the support leads, and each lead connected with a tie bar. A method for manufacturing a lead frame with a heat sink, comprising: inserting an emboss of a heat sink into a hole of a support lead and fixing it by caulking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18321684A JPS6161445A (en) | 1984-08-31 | 1984-08-31 | Manufacture of lead frame attached with heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18321684A JPS6161445A (en) | 1984-08-31 | 1984-08-31 | Manufacture of lead frame attached with heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6161445A true JPS6161445A (en) | 1986-03-29 |
Family
ID=16131811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18321684A Pending JPS6161445A (en) | 1984-08-31 | 1984-08-31 | Manufacture of lead frame attached with heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6161445A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6002173A (en) * | 1991-12-20 | 1999-12-14 | Sgs-Thomson Microelectronics S.R.L. | Semiconductor device package with metal-polymer joint of controlled roughness |
| JP2009543329A (en) * | 2006-06-30 | 2009-12-03 | ソウル セミコンダクター カンパニー リミテッド | Lead frame having heat sink support, method for manufacturing light emitting diode package using the same, and light emitting diode package manufactured thereby |
| US8241699B2 (en) | 2007-03-09 | 2012-08-14 | Panasonic Corporation | Deposition apparatus and method for manufacturing film by using deposition apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5812454U (en) * | 1981-07-20 | 1983-01-26 | 株式会社リコー | thermal recording device |
-
1984
- 1984-08-31 JP JP18321684A patent/JPS6161445A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5812454U (en) * | 1981-07-20 | 1983-01-26 | 株式会社リコー | thermal recording device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6002173A (en) * | 1991-12-20 | 1999-12-14 | Sgs-Thomson Microelectronics S.R.L. | Semiconductor device package with metal-polymer joint of controlled roughness |
| JP2009543329A (en) * | 2006-06-30 | 2009-12-03 | ソウル セミコンダクター カンパニー リミテッド | Lead frame having heat sink support, method for manufacturing light emitting diode package using the same, and light emitting diode package manufactured thereby |
| US8482023B2 (en) | 2006-06-30 | 2013-07-09 | Seoul Semiconductor Co., Ltd. | Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method |
| US8241699B2 (en) | 2007-03-09 | 2012-08-14 | Panasonic Corporation | Deposition apparatus and method for manufacturing film by using deposition apparatus |
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