JPS6148264B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a handling device used to determine the quality of semiconductor devices.

[Conventional technology]

As shown in Figure 2A, the quality of the semiconductor device is determined by inspecting whether the bending angle of the lead 2 of the bent semiconductor device 1 is within the range of the standard value θ. Conventionally, in order to sort the semiconductor devices, an operator visually inspects the semiconductor devices one by one.

[Problems to be solved by the invention] In this way, when determining the quality of semiconductor devices and selecting them manually, the work requires a great deal of effort and time, and there are also individual differences in judgment standards. , a problem arises in which defective products are passed on to the next process or shipped as they are due to errors in judgment or the like.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and provide an apparatus that mechanically determines whether a semiconductor device is good or bad and automatically eliminates defective products.

[Means for solving problems]

The present invention rotatably disposes a tunnel gauge having a passage through which a semiconductor device of a regular shape passes between rails that form a transport path for semiconductor devices, and the tunnel gauge has a posture in the same direction as the rail. A posture change control mechanism is provided that allows the tunnel gauge to take two positions, a downwardly tilted posture, and a sensor for detecting passage of a semiconductor device transported on a rail on the entrance side and the exit side of the tunnel gauge, respectively, and a downwardly tilted tunnel gauge. A push-out mechanism is installed above the extending direction of the passage of the tunnel gauge, and a push-out mechanism is installed to forcibly push out defective semiconductor devices from inside the passage of the tunnel gauge, and a posture change control mechanism is installed when detection signals from both sensors are not obtained within a set time. This handling device is characterized by comprising a drive mechanism that operates to change the tunnel gauge from a posture in the same direction as the rail to a downward tilting direction, and also operates a push-out mechanism.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

In FIG.
A posture change in which a tunnel gauge 3 having a channel-shaped passage 3a therein is rotatably supported, and the tunnel gauge 3 changes its posture between a posture in the same direction as the rail 8 and a downwardly tilted posture. Control cylinder 9
Concatenate.

Sensors 5 and 6 are installed at the entrance and exit sides of the tunnel gauge 3, respectively, to detect the presence or absence of the semiconductor device 1 passing on the rail 8.

In the embodiment, a combination of a light-emitting element and a light-receiving element is used as a sensor, and an example is shown in which both elements are placed facing each other across a small hole made in the conveying surface of the rail 8. A cylinder 7 for extruding a defective semiconductor device is disposed so as to face an exit side opening that faces upward when the tunnel gauge 3 is tilted downward.

In FIG. 1A, 10 is the cylinder 9 for controlling the attitude change and the cylinder 7 for pushing out defective semiconductor devices.
This is a drive mechanism that controls the timing and direction of operation.

The drive mechanism 10 is controlled by semiconductor device detection signals from both sensors 5 and 6. That is, after the entrance side sensor 5 of the tunnel gauge 3 detects the passing of a semiconductor device, when a semiconductor device detection signal is not obtained at the exit side sensor 6 even after a certain period of time has elapsed, the drive mechanism 10 causes both cylinders 9, 7, sequential operation commands are issued. As shown in FIG. 2C, the passage 3a of the tunnel gauge 3 has a portion corresponding to the lead 2 with an allowance so that the semiconductor device 1 can pass therethrough if the bending angle of the lead 2 is within the permissible range. ing. In addition, by allowing the opening shape of the passage 3a on the entrance side to be wider than the allowable shape, even if the bending angle of the lead 2 is outside the allowable range, unless the bending angle is extremely incorrect, the tunnel gauge Accepted within 3 days.

Next, the operation of the present invention will be explained. In FIG. 1A, the semiconductor device 1 slides under its own weight on the rail 8 with the leads 2 facing upward.

First, the semiconductor device 1 is detected by the sensor 5 installed immediately before the tunnel gauge 3. Next, after the semiconductor device passes through the tunnel gauge 3, it is detected by the sensor 6 on the exit side, but in the present invention, the time required from being detected by one sensor 5 to being detected by the other sensor 6 is The quality of the lead 2 is determined based on whether or not the time is within a preset time. If the lead 2 is normal, that is, if the bending angle is within the allowable range, it will not obstruct passage through the tunnel gauge 3 and will be detected by the entrance sensor 5 as shown in Figure 1 (b). After a certain period of time, it is detected by the exit side sensor 6. tunnel gauge 3
The time required to pass through is determined as the set time for determining the quality of the semiconductor device.

Based on the detection signals from both sensors 5 and 6, the drive mechanism 10 determines the time taken for the semiconductor device 1 to pass through the tunnel gauge 3. In this case, the determined time will match the set time, so the attitude of the tunnel gauge 3 will not be changed and the extrusion cylinder 7 will not be operated. However, when a defective product whose bending angle of the lead 2 exceeds the specified value range is supplied along the rail 8 as shown in FIG. However, the semiconductor device 1 cannot pass through the tunnel gauge 3 because its lead 2 becomes an obstacle for the semiconductor device 1 to pass through the tunnel gauge 3, and its presence cannot be confirmed by the sensor 6 on the exit side of the tunnel gauge 3. It happens. Therefore, even after the set time has elapsed, the detection signals from both sensors 5 and 6 make it impossible for the drive mechanism 10 to determine the time it takes for the semiconductor device 1 to pass through the tunnel gauge 3. In this case, after the set time has elapsed, the cylinder 9 operates in response to a command issued by the drive mechanism 10, and the rod 9a is retracted into the downward tilting position of the tunnel gauge 3, as shown in FIG. Convert. Next, the cylinder 7 operates in response to the command, and the rod 7a is connected to the tunnel gauge 3.
The semiconductor device 1 is forcibly ejected from the tunnel gauge 3 as a defective product 4 by protruding into the passage 3a.

After ejection, the rod 7a of the cylinder 7 is removed, and the tunnel gauge 3 is again changed to a posture in the same direction as the rail 8, in preparation for the inspection of the semiconductor device 1 to be supplied next. As described above, the operations are performed automatically, and the semiconductor device 1 is sequentially tested.

〔Effect of the invention〕

As described above, the present invention allows semiconductor devices to be passed through a tunnel gauge positioned in the same direction as the rails that form the transport path for the semiconductor devices, thereby sorting out good and defective semiconductor devices.
Since the tunnel gauge is tilted downward and automatically ejected, the time spent on the work can be greatly reduced compared to the conventional work of sorting semiconductor devices one by one, and work efficiency can be improved.

[Brief explanation of the drawing]

1A, 1B, and 1C show an embodiment of the present invention, and FIG.
Figure B is a sectional view taken along line b-b of A, C is a cross-sectional view showing the situation when rejecting defective products, Figure 2 A and B are explanatory diagrams showing the deformed state of the lead of a semiconductor device, and C is a tunnel gauge. FIG. 3 is an explanatory diagram showing the relationship between the semiconductor device and the semiconductor device. 1... Semiconductor device, 3... Tunnel gauge,
5, 6...sensor, 7...extrusion cylinder, 8
...Rail, 9...Cylinder for attitude change control, 1
0... Drive mechanism.

Claims (1)

[Claims] 1 Between the rails that form the transport path for semiconductor devices,
An attitude change control mechanism that rotatably arranges a tunnel gauge provided with a passage through which a semiconductor device of a regular shape passes, and allows the tunnel gauge to take two positions: an attitude in the same direction as the rail and a downwardly inclined attitude. A sensor is installed on the entrance side and the exit side of the tunnel gauge to detect the passage of a semiconductor device transported on the rail, and a sensor is installed above the downwardly inclined tunnel gauge in the direction of the passage of the tunnel gauge. A push-out mechanism forcibly pushes out defective semiconductor devices from the rail, and a posture change control mechanism that operates when detection signals from both sensors are not obtained within a set time to tilt the tunnel gauge downward from the same direction as the rail. A handling device characterized by comprising a drive mechanism that changes direction and operates an extrusion mechanism.