JPS6146098A - Heat sink structure of electronic device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a heat dissipation structure for electronic equipment that uses a harness to dissipate heat.

(b) Conventional technology The circuit boards of automotive electronic devices are equipped with heat-generating components such as power transistors for driving power loads, but they are susceptible to heat from integrated circuits, capacitors, etc. placed on the same circuit board. When components are exposed to heat for a long time, their characteristics change and reliability is lost, so various heat dissipation measures have been taken in the past. As a heat dissipation measure, for example, Utility Model Application No. 56-162
As shown in Japanese Patent No. 692, a method is known in which a metal case housing a circuit board is used as a heat dissipation means or a heat sink 2 dedicated to a heat generating component is provided.

Problems to be Solved by the Invention This heat dissipation method takes advantage of the convection heat around electronic devices, but electronic devices are installed in places such as the inside of narrow dash sides and other places. In many cases, sufficient heat dissipation effect cannot be expected because the instrument panel is located inside the instrument panel.Recently, resin material 8CI is used for the cases of electronic devices with the aim of making vehicles lighter and lowering costs in order to improve fuel efficiency.
In such cases, there is a problem in that heat dissipation using the case is not possible.

B) Purpose and Structure of the Invention The present invention has been made in view of the above points, and focuses on the fact that the external harness connected to electronic equipment is a good conductor of heat, and does not require the purchase of a special heat radiator. In order to achieve this purpose, the heat generating components of electronic equipment and the electrical connection means to the external harness are connected in a heat transferable manner, and the heat dissipation from the heat generating components is conducted via the harness. It was designed to dissipate heat.

(e) Examples The present invention will be explained below based on the drawings.

@1 Figure is a side view showing the implementation row of the heat dissipation structure according to the present invention,
FIG. 2 is a plan view of the same. In the figure, 1 is a printed circuit board, 2 is a heat generating component such as a power transistor mounted on this printed circuit board 1, 3 is a connector housing, and 4 is a printed circuit board.
A connector pin extends from the connector housing 3 and is inserted into a predetermined position on the printed circuit board 1. A heat transfer member 5 has excellent thermal conductivity and conducts heat from the heat generating component 2 to the connector pin 4. In order to dissipate as much heat from the heat-generating component 2 as possible to the harness, it is preferable that the heat transfer member 5 is connected to all of the connector bins 4. However, does the connector bin 4 originally receive electrical signals? Since the connector bin 4 and the heat transfer member 5 have a transmission function, it is necessary to electrically insulate the contact portion between the connector bin 4 and the heat transfer member 5 through an insulator layer 6 made of, for example, mica, which has good thermal conductivity and is an electrical insulator. be.

With this configuration, the heat generated by the heat generating component 2 is transferred to the connector pin 4 via the conductive part 5, and further transferred to the 71-nes (not shown) via the connector pin 4, where the heat is radiated. Ru.

3 and 4 show other embodiments of the heat dissipation structure according to the invention, in which the same reference numerals as in FIGS. 1 and 2 indicate the same components.

In this embodiment, a connector bin serves as the heat transfer member in the embodiments shown in FIGS. 1 and 2. That is, a flat portion 4'a is provided on the protruding portion of the connector bin 4' on the board side, and the heat generating component 22 is fixed by this flat portion 4'a. In this embodiment, a structure is adopted in which one heat generating component is attached to one connector bin, so the heat from the heat generating component 2 is radiated through one harness connected to the connector bin 4'. By improving the internal structure of the connector housing 3, can other connector bins also be heated? Transmitted and released through multiple harnesses 3? It is also possible to make it possible to use 1A.

FIGS. 5 and 6 show other embodiments of the heat dissipation structure according to the present invention, in which the same components are designated by the same reference numerals.

In this embodiment, the heat transfer member itself has a relatively simple structure, and instead, a flat part 5' is provided on the side of the connector pin 4 to improve thermal coupling with the connector pin 4.
A is provided. In this way, the heat generated by the heat generating component 2 is transferred to the heat transfer member 5', especially its plane m5'a
The heat can be transmitted to the connector bin 4 through the harness, and the heat can be radiated through the harness.

(f) As described in detail, in the present invention, the heat generating component of an electronic device is thermally coupled to an electrical connection means such as a connector bin for electrically connecting an external harness to generate heat generated from the heat generating component. Since the heat dissipates through a harness with sufficient heat capacity, it can be used even for electronic equipment installed in narrow places such as inside the dash side or inside the instrument panel. Good heat dissipation is possible regardless of poor surrounding convection conditions. Further, there is no need to provide a heat sink for heat radiation to the electronic device, and even electronic devices using a resin case can radiate heat without providing any special heat radiation means.

If heat is dissipated using a harness as in the present invention, heat dissipation can be performed with extremely high flexibility and at low cost, and the reliability of electronic equipment having heat generating components can be improved.

[Brief explanation of the drawing]

1 and 2 show one embodiment of the heat dissipation structure according to the present invention, FIG. 1 is a cross-sectional view, FIG. 2 is a plan view, and the third factor and FIG. 4 are other embodiments of the heat dissipation structure according to the present invention. FIG. 3 is a sectional view, FIG. 4 is a plan view, and FIGS. 5 and 6 are further embodiments of the heat dissipation structure according to the present invention. The figure is a plan view. 1...Printed circuit board, 2...Heating components, 3...
・Connector housing, 4 - Connector housing, 5
... Heat transfer member Fig. 1 Fig. 3 Fig. M4

Claims (1)

[Claims] 1. A heat dissipation structure for an electronic device, the electronic device having a heat generating component and an electrical connection means to an external harness, wherein the heat generating component and the electrical connection means are connected in a heat transferable manner.