JPS6146049B2 - - Google Patents
Info
- Publication number
- JPS6146049B2 JPS6146049B2 JP1546081A JP1546081A JPS6146049B2 JP S6146049 B2 JPS6146049 B2 JP S6146049B2 JP 1546081 A JP1546081 A JP 1546081A JP 1546081 A JP1546081 A JP 1546081A JP S6146049 B2 JPS6146049 B2 JP S6146049B2
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- resin
- printed circuit
- circuit board
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 41
- 239000011347 resin Substances 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
本発明は、電子部品等を樹脂封止する方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of resin-sealing electronic components and the like.
従来、プリント基板に実装された電子部品を保
護する事を目的とする樹脂封止方法としては、ト
ランスフアーモールドが一般的に行なわれてい
る。 Conventionally, transfer molding has been commonly used as a resin sealing method for the purpose of protecting electronic components mounted on a printed circuit board.
このトランスフアーモールド方法において、封
止金型は上下に２分割されるが、下型に封止樹脂
を充填するキヤビテイを有している。 In this transfer molding method, the sealing mold is divided into upper and lower halves, and the lower mold has a cavity in which the sealing resin is filled.
封止樹脂をこのキヤビテイに充填させる方法と
しては、上下金型の間に電子部品を実装したプリ
ント基板やリードフレームを下型に固定されたゲ
ージピンで位置決めして装着した後、モールドプ
レスにてクランプし、ポツトに挿入した封止樹脂
をプランジヤヘツドの下降と共に加熱・溶融させ
ランナー、ゲートを通じてキヤビテイに充填させ
ていた。 The method of filling this cavity with sealing resin is to position and mount a printed circuit board or lead frame with electronic components mounted between the upper and lower molds using gauge pins fixed to the lower mold, and then clamp it with a mold press. The sealing resin inserted into the pot was then heated and melted as the plunger head descended, filling the cavity through the runner and gate.
プリント基板やリードフレームに実装された電
子部品を封止樹脂にて保護する目的の封止樹脂は
耐湿性や剥離性を向上させた接着性能の良好な樹
脂である。従来の方法においては、プリント基板
やリードフレームの所定の位置に封止樹脂を誘導
するランナーが、プリント基板上に印刷やエツチ
ングで構成されている回路部を横切る場合は、樹
脂封止後、カルとプリント基板を分離する作業の
際に、封止樹脂の接着性が高い為に回路部分もい
つしよに剥離してしまい、回路を切断してしま
う。又、回路部を横切る事を避ける為にランナー
を迂回させると、ランナー形状が複雑となり封止
金型を製作するのに時間と費用が多く必要とな
る。又ポツトから封止位置までの距離が遠くな
り、封止部に未充填やボイド等の外観不良を発生
させてしまう欠点があつた。 The sealing resin used to protect electronic components mounted on printed circuit boards and lead frames is a resin with good adhesive performance and improved moisture resistance and peelability. In the conventional method, when the runner that guides the sealing resin to a predetermined position on the printed circuit board or lead frame crosses a circuit section that is printed or etched on the printed circuit board, the runner is used to guide the sealing resin to a predetermined position on the printed circuit board or lead frame. During the process of separating the printed circuit board and the printed circuit board, the highly adhesive nature of the sealing resin causes the circuit parts to peel off inadvertently, resulting in the circuit being severed. Furthermore, if the runner is detoured to avoid crossing the circuit section, the shape of the runner becomes complicated and it takes a lot of time and money to manufacture the sealing mold. Moreover, the distance from the pot to the sealing position is long, resulting in defects in appearance such as unfilling and voids in the sealing part.
本発明は、プリント基板やリードフレームの樹
脂封止範囲以外には封止樹脂を接触させる事がな
く、回路損傷や外観不良の生じない樹脂封止方法
を提供するものである。 The present invention provides a resin sealing method that does not bring the sealing resin into contact with areas other than the resin-sealed area of a printed circuit board or lead frame, and does not cause circuit damage or appearance defects.
本発明によれば、プリント基板やリードフレー
ムに実装された電子部品を保護する事を目的とす
る樹脂封止の方法において、封止金型とは別個に
板材を抜き加工して製作したキヤビテイプレート
を使用してトランスフアーモールドする事により
プリント基板やリードフレームの所定の封止範囲
以外には封止樹脂を接触させないで樹脂封止する
事を特徴とする樹脂封止方法を得る。 According to the present invention, in a resin sealing method for the purpose of protecting electronic components mounted on a printed circuit board or lead frame, a cavity manufactured by punching a plate material separately from a sealing mold is used. To obtain a resin sealing method characterized in that resin sealing is carried out by using a plate to perform transfer molding without bringing the sealing resin into contact with areas other than a predetermined sealing range of a printed circuit board or lead frame.
次に、図面を参照して本発明をより詳細に説明
する。 Next, the present invention will be explained in more detail with reference to the drawings.
本発明の一実施例によれば、第１図に示すよう
なキヤビテイープレート１が用いられる。このキ
ヤビテイープレート１はプリント基板やリードフ
レームのパイロツト穴位置に同じ大きさのパイロ
ツト穴２を設け、電子部品を樹脂封止する位置に
も所定の形状のキヤビテイー３を抜き加工して形
成される。 According to one embodiment of the invention, a cavity plate 1 as shown in FIG. 1 is used. This cavity plate 1 is formed by providing a pilot hole 2 of the same size as the pilot hole position of the printed circuit board or lead frame, and punching a cavity 3 of a predetermined shape at the position where the electronic component is sealed with resin. Ru.
かかるキヤビテイープレート１を用いた樹脂封
止方法は第２図の封止金型の断面図を用いて説明
する。上型１１には、電子部品１３の実装された
プリント基板１４やリードフレームの電子部品１
３を有しない面が取り付けられる凹部２４とプラ
ンジヤーヘツド１８が挿入される貫通孔２５とが
設けられており、凹部２４には更にプリント基板
１４のパイロツト穴と位置を同じくしてプリント
基板１４の位置決めをするためのパイロツト孔２
３を有している。下型には封止樹脂２２の通るラ
ンナー１９が設けられており、さらに上型１１の
パイロツト孔２３に対応する位置にゲージピン１
６が設けられている。 A resin sealing method using such a cavity plate 1 will be explained using a cross-sectional view of a sealing mold shown in FIG. The upper mold 11 includes a printed circuit board 14 on which electronic components 13 are mounted and electronic components 1 such as lead frames.
3 and a through hole 25 into which the plunger head 18 is inserted. Pilot hole 2 for positioning
It has 3. The lower mold is provided with a runner 19 through which the sealing resin 22 passes, and a gauge pin 1 is further provided at a position corresponding to the pilot hole 23 of the upper mold 11.
6 is provided.
まず下型１２のゲージピン１６にキヤビテイー
プレート１のパイロツト穴２を通すようにキヤビ
テイープレート１が取り付けられ、更にその上に
やはりゲージピン１６にパイロツト穴が通るよう
にプリント基板１４等を取り付け、その後、上型
１１をパイロツト孔２３にゲージピンが入るよう
に取り付けられる。このゲージピン１６とキヤビ
テイプレート１のパイロツト穴２とプリント基板
１４等のパイロツト穴と上型１１のパイロツト孔
２３とでこれら全体の位置合せがなされる。 First, the cavity plate 1 is attached so that the pilot hole 2 of the cavity plate 1 passes through the gauge pin 16 of the lower mold 12, and then the printed circuit board 14 etc. is attached on top of it so that the pilot hole passes through the gauge pin 16. Thereafter, the upper mold 11 is attached so that the gauge pin can be inserted into the pilot hole 23. These gauge pins 16, the pilot holes 2 of the cavity plate 1, the pilot holes of the printed circuit board 14, etc., and the pilot holes 23 of the upper die 11 are aligned as a whole.
その後、モールドプレスでクランプし、ポツト
１７に封止樹脂２２を挿入し、挿入した封止樹脂
２２をプランジヤヘツド１８の下降に共ない加
熱・溶融させ、ランナー１９に流し込み、ゲート
２０を通じてキヤビテイプレート１に設けられた
キヤビテイ３に充填させる。 Thereafter, it is clamped with a mold press, the sealing resin 22 is inserted into the pot 17, the inserted sealing resin 22 is heated and melted as the plunger head 18 descends, and is poured into the runner 19, passing through the gate 20 into the cavity plate. Fill the cavity 3 provided in 1.
この方法によれば、封止樹脂はキヤビテイプレ
ート１の下面に接触しながら、キヤビテイ３に到
達するので、プリント基板１４を部分的に樹脂封
止する際には封止樹脂が接触するのは樹脂封止範
囲のみであり、プリント基板１４上の樹脂封止の
必要のない回路が構成されている部分には全く接
触することは無い。このためプリント基板１４の
樹脂封止部以外が損傷を受けることがない。 According to this method, the sealing resin reaches the cavity 3 while contacting the lower surface of the cavity plate 1, so when partially sealing the printed circuit board 14 with the resin, the sealing resin only comes in contact with the lower surface of the cavity plate 1. It is only the resin-sealed area, and does not come into contact with any part of the printed circuit board 14 where a circuit that does not require resin-sealing is configured. Therefore, parts other than the resin-sealed portion of the printed circuit board 14 are not damaged.
なお、キヤビテイプレート１とランナー１９と
の分離を容易にするには、キヤビテイプレート１
の下面に離型剤を塗付すれば良く、プリント基板
１４に離型剤が付着して外観不良の悪影響を及ぼ
すことは無い。かかる効果はプリント基板１４の
代わりに電子部品の塔載されたリードフレームを
樹脂封止する際にも同様である。 Note that in order to facilitate separation of the cavity plate 1 and the runner 19, the cavity plate 1
It is sufficient to apply a mold release agent to the lower surface of the printed circuit board 14, and the mold release agent will not adhere to the printed circuit board 14 and cause a bad appearance. This effect is the same when a lead frame on which electronic components are mounted is sealed with resin instead of the printed circuit board 14.
キヤビテイプレート１は、市販の板材を適当に
選ぶことにより材質や板厚を任意に選択できるし
キヤビテイ３の抜き加工も切断金型や機械加工、
及びエツチング等により容易に製作することがで
きる。又、キヤビテイプレート１の摩耗対策とし
て焼入れや窒化、さらに硬質クロムメツキ等の処
理を施こす事もできる。 The material and thickness of the cavity plate 1 can be arbitrarily selected by selecting an appropriate commercially available plate material, and the punching of the cavity 3 can be performed using a cutting die, machining, or cutting.
It can be easily manufactured by etching or the like. Further, as a countermeasure against wear of the cavity plate 1, treatments such as hardening, nitriding, and hard chrome plating can be applied.
本発明の効果としては、下記項目が挙げられ
る。 The effects of the present invention include the following items.
板材を板き加工して製作したキヤビテイプレ
ート１を使用するので、従来型のように複雑な
部品の組合せによるキヤビテイの構成が不要と
なり、封止金型を製作する時間が短縮され安価
にできる。 Since the cavity plate 1 manufactured by carving plate material is used, there is no need to construct the cavity by combining complicated parts as in the conventional type, and the time and cost of manufacturing the sealing mold can be reduced. .
ランナー１９をポツト１７からキヤビテイ３
まで任意に走らす事ができるので、未充填やボ
イド等の外観不良に対して封止条件の巾を広く
とる事ができる。 Runner 19 from pot 17 to cavity 3
Since it is possible to run the sealing process arbitrarily up to a certain point, it is possible to have a wide range of sealing conditions for defects in appearance such as unfilling and voids.
キヤビテイプレート１を２枚とし、封止樹脂
の通れる穴を設けたプリント基板１４を上下か
ら挾み込んで樹脂封止すれば、プリント基板１
４の両面に樹脂封止する事ができる。 If two cavity plates 1 are used, and the printed circuit board 14 with holes through which the sealing resin can pass is inserted from above and below and sealed with resin, the printed circuit board 1
4 can be sealed with resin on both sides.
プリント基板１４における封止位置の変更や
封止範囲の変更は、キヤビテイプレート１を交
換すれば容易に可能である。 The sealing position and sealing range on the printed circuit board 14 can be easily changed by replacing the cavity plate 1.
第１図は、本発明の一実施例に使用するキヤビ
テイプレートの斜視図、第２図は、第１図のキヤ
ビテイプレートを使用した本発明の一実施例によ
る封止方法を説明する為の断面図である。
１……キヤビテイプレート、２……パイロツト
穴、３……キヤビテイ、１１……上型、１２……
下型、１３……電子部品、１４……プリント基
板、１６……ゲージピン、１７……ポツト、１８
……プランジヤヘツド、１９……ランナー、２０
……ゲート、２２……封止樹脂、２３……パイロ
ツト孔、２４……凹部、２５……貫通孔。
Fig. 1 is a perspective view of a cavity plate used in an embodiment of the present invention, and Fig. 2 is for explaining a sealing method according to an embodiment of the present invention using the cavity plate of Fig. 1. FIG. 1... Cavity plate, 2... Pilot hole, 3... Cavity, 11... Upper mold, 12...
Lower mold, 13...Electronic component, 14...Printed circuit board, 16...Gauge pin, 17...Pot, 18
... Plunger head, 19 ... Runner, 20
... Gate, 22 ... Sealing resin, 23 ... Pilot hole, 24 ... Recess, 25 ... Through hole.
Claims (1)
とともに、樹脂封止位置や形状を決めるキヤビテ
イーが設けられたキヤビテイプレートを介在させ
て樹脂を前記キヤビテイー内に充填することを特
徴とする樹脂封止方法。1. A cavity plate provided with a cavity that determines the resin sealing position and shape is interposed between the upper mold and the lower mold together with the substrate to which resin sealing is applied, and resin is filled into the cavity. Characteristic resin sealing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1546081A JPS57128930A (en) | 1981-02-04 | 1981-02-04 | Resin sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1546081A JPS57128930A (en) | 1981-02-04 | 1981-02-04 | Resin sealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57128930A JPS57128930A (en) | 1982-08-10 |
| JPS6146049B2 true JPS6146049B2 (en) | 1986-10-11 |
Family
ID=11889405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1546081A Granted JPS57128930A (en) | 1981-02-04 | 1981-02-04 | Resin sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57128930A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01172445U (en) * | 1988-05-17 | 1989-12-06 | ||
| US7153116B2 (en) | 2002-11-29 | 2006-12-26 | Apic Yamada Corporation | Resin molding machine |
| US7622067B2 (en) * | 2005-05-30 | 2009-11-24 | Spansion Llc | Apparatus and method for manufacturing a semiconductor device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4954308A (en) * | 1988-03-04 | 1990-09-04 | Citizen Watch Co., Ltd. | Resin encapsulating method |
| NL9401682A (en) * | 1994-10-12 | 1996-05-01 | Fico Bv | Method for encapsulating a chip, and separation strip and mould half to be used with said method |
| NL1012488C2 (en) * | 1999-07-01 | 2001-01-03 | Fico Bv | Apparatus and method for encapsulating electronic components mounted on a support. |
| NL1022323C2 (en) * | 2003-01-08 | 2004-07-09 | Fico Bv | Device and method for encapsulating an electronic component mounted on a carrier with encapsulating material. |
-
1981
- 1981-02-04 JP JP1546081A patent/JPS57128930A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01172445U (en) * | 1988-05-17 | 1989-12-06 | ||
| US7153116B2 (en) | 2002-11-29 | 2006-12-26 | Apic Yamada Corporation | Resin molding machine |
| US7622067B2 (en) * | 2005-05-30 | 2009-11-24 | Spansion Llc | Apparatus and method for manufacturing a semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57128930A (en) | 1982-08-10 |
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