JPS6145013Y2 - - Google Patents

Description

[Detailed description of the invention] This invention relates to a packaging body for a wafer storage container that prevents damage to the wafers when the case body containing silicon wafers, which will become IC substrates, is packed in a cardboard box and transported. This relates to the packaging body interposed between the case body and the cardboard outer box serving as the exterior.

Silicon wafers for IC substrates are very expensive and very thin, so they are easily damaged. Therefore, care must be taken when handling it, especially when transporting it. Therefore, for this type of transportation, a transportation method in which the device is carried by humans is usually adopted. That is, generally disc-shaped (for example, φ40 ~
In the case of wafers having a diameter of about 100 mm, the wafers are held at four points on the periphery by the supporting portion of the container and several wafers are transported at one time. For this reason, the disk-shaped wafer is relatively resistant to impact in the peripheral direction (left, right, top and bottom directions when vertically arranged), but weak in the front and back plane directions, making it difficult to use a simple and reliable shock absorbing member. development is desired.

The present invention has been made in consideration of the above-mentioned circumstances.
In other words, this device is a packaging body that reduces the impact on the front of the wafer by combining two cardboard body panels with a urethane foam band and wrapping them crisscross in the vertical and horizontal directions around the handle of the wafer storage container where the front of the wafer is located.

Hereinafter, the present invention will be described with reference to drawings of embodiments.

1 is a foamed urethane strip material 4 formed by forming corrugations 3 on each surface of four corrugated cardboard body plates 1a, 1b, 1c, and 1d connected with fold lines 2, 2', and 2''. 5 is an inner frame cushioning member made of four-sided corrugated cardboard which is connected with a plurality of pieces parallel to this fold line with adhesive a such as hot melt. Body plate parts 5a, 5b, 5
The outer side of the inner frame cushioning member 1, in which a plurality of foamed urethane strips 4' each having a corrugated shape 3' are pasted on each surface of c and 5d with adhesive a so as to be perpendicular to the fold line. The outer frame buffer member 5 and the inner frame buffer member 1 are combined to form a package 6 for a wafer storage container. 7 is a wafer container 7' in which a plurality of disk-shaped wafers A are housed in a vertical arrangement, stacked appropriately in several stages (in the figure, 12 wafer containers are arranged in vertical and front-back positions).
The wafers A in each wafer container 7' are stored so that the front surface A' of the wafer A in each wafer container 7' faces the front surface of the front tab 7a of the wafer container 7.

Next, when storing this wafer storage container 7 in a cardboard box 8 serving as an exterior, first, the body plate portion 1a, which is one side of the inner frame buffer member 1, is attached to the front tab portion 7a of the wafer storage container 7. The foamed urethane strip material 4 on the surface of the portion 1a is placed as the front side, and in this state, the remaining body plate portions 1b, 1c, 1 connected to the body plate portion 1a are attached.
d is wrapped around the folding lines 2, 2', and 2'' so as to be along the upper part 7b, rear tab 7a', and lower part 7c of the wafer storage container 7 to form a single-layer buffer (see FIG. 2A).

Next, the body plate 5a of the outer frame buffer member 5 is attached to the surface of the body plate 1a of the inner frame buffer member 1 at the front tab 7a of the wafer storage container 7.
Lay out the foamed urethane strip material 4' on the surface of a, and in this state, attach the remaining body plate parts 5b, 5c, and 5d connected to the body plate part 5a to the side part 7b and the rear face of the wafer storage container 7. Folding line 6 to tab 7a' side 7d,
It is wound with 6' and 6'' bends to form a double buffer.

In this way, if the inner and outer frame buffer members 1 and 5 are wound cross-wound around the wafer storage container 7 and stored in the cardboard box 8, the front and rear surfaces of the wafer storage container 7 can be Knob portion 7a,
Front (or back) of wafer A facing 7a'
The body plate parts 1a, 5a, 1 are provided with foamed urethane strips 4, 4' at the claw parts 7a, 7a', respectively.
Since the double buffer portion 9 is constructed in which the portions c and 5c overlap, even if external pressure is applied from the lateral direction, it is appropriately buffered and the impact is not transmitted to the wafer A surface.
In the figure, reference numeral 7'' indicates a disc-shaped wafer supporting protrusion protruding from all sides within the frame of the wafer container 7'.

As mentioned above, the present invention consists of an inner frame consisting of a body plate section with foamed urethane strips that are wound vertically around the tab section of the wafer storage container that houses the wafer container in which the wafers are arranged vertically, and the front surface of the wafers faces. By combining two pieces of a shock absorbing member and an outer frame shock absorbing member consisting of a body plate portion with a foamed urethane strip material wrapped in the left and right direction around the knob portion,
At the front and rear tabs where the front and back sides of the wafer face each other, which are vulnerable to external shocks, two body plates overlap, and each foamed urethane strip provides a buffer (double buffer). Therefore, the impact is not transmitted to the wafer surface, thereby preventing damage to the wafer.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention, and FIGS. 1A and 1B are plan views of the inner and outer frame cushioning members, and FIGS.
B is a perspective view showing the same frame state, FIG. 3 is a vertical cross-sectional side view of the main part, FIG. 4 is a perspective view of the wafer container section, and FIG. It is a diagram. 1... Inner frame buffer member, 2, 2', 2''... Broken line,
3, 3'... Waveform, 4, 4'... Foamed urethane strip material, 5... Outer frame buffer member, 7... Wafer storage container, 7a... Knob portion, 7'... Wafer container, A
...A disc-shaped wafer.

Claims (1)

[Scope of utility model registration request] The outer surface of a box-shaped wafer storage container is made up of a plurality of wafer containers arranged in stacks so that the front of the wafers face the container's tab, and the front tab of the wafer storage container, where the front of the wafers face, is centered on the outer surface of the box-shaped wafer storage container. The inner frame cushioning member is made by pasting a plurality of foamed urethane strips with corrugated surfaces parallel to the fold lines on the surface of the four-sided body plate that connects in the vertical direction, and the foamed urethane strips on the surface are The four wafer storage containers are wound around each other along the folded lines so as to form the front surface, and are arranged in a row in the left and right direction centering on the front tab of the wafer storage container.
An outer frame buffer member in which a plurality of foamed urethane strips having a corrugated surface are pasted on the surface of the face body plate part perpendicularly to the fold line is attached to the inner frame buffer member at the front tab of the wafer storage container and A package for a wafer storage container, characterized in that the wafer storage container is wound along the fold line so that the urethane foam strips on the surface face out so that they overlap at the rear tabs.