JPS6139555Y2 - - Google Patents
Info
- Publication number
- JPS6139555Y2 JPS6139555Y2 JP15559980U JP15559980U JPS6139555Y2 JP S6139555 Y2 JPS6139555 Y2 JP S6139555Y2 JP 15559980 U JP15559980 U JP 15559980U JP 15559980 U JP15559980 U JP 15559980U JP S6139555 Y2 JPS6139555 Y2 JP S6139555Y2
- Authority
- JP
- Japan
- Prior art keywords
- pulp
- flame
- layers
- sound
- retardant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 6
- 239000003063 flame retardant Substances 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 239000004566 building material Substances 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
Landscapes
- Building Environments (AREA)
- Laminated Bodies (AREA)
- Paper (AREA)
Description
【考案の詳細な説明】
この考案は主として建築用の難燃性の吸音板の
考案に係るもので、その目的は吸音効果が良く耐
衝撃性に強く軽くて膨潤性のある若干軟質で加工
し易い板材を提供しようとするものである。[Detailed explanation of the invention] This invention is mainly concerned with the invention of a flame-retardant sound-absorbing board for construction.The purpose of the invention is to create a sound-absorbing board that has good sound-absorbing effect, strong impact resistance, is light, and is slightly soft and swellable. The purpose is to provide a plate material that is easy to use.
即ちその要旨とするところはリン酸エステル化
パルプ又は難燃処埋を施したパルプより成る薄板
層Ａ，Ｂを設け、その両板ＡとＢの間に水バルク
セラミツク繊維より成る厚板層Ｃを挟入し適宜の
手段で三層の板を１体に固着形成して成る難燃性
建築用吸音板の考案に係るものである。 That is, the gist is that thin plate layers A and B made of phosphoric acid esterified pulp or pulp treated with flame retardant treatment are provided, and between both plates A and B, a thick plate layer C made of water bulk ceramic fiber is provided. This invention relates to the invention of a flame-retardant sound-absorbing board for buildings, which is made by sandwiching three layers of boards and fixing them into one body using appropriate means.
この考案は上記のような資材の構成によりなる
ものであるから、上下薄板層Ａ，Ｂは共に難燃処
理をした準不燃性の資材であるパルプより成るも
ので、耐火性に富み且つ軟質の板材であるから吸
音板として防音効果が良好であり、建造物の天井
板や側壁板に利用して頗る有用な吸音板の役目を
果す効果がある。 Since this invention is based on the above-mentioned material structure, both the upper and lower thin plate layers A and B are made of pulp, which is a quasi-incombustible material that has undergone flame retardant treatment, and is highly fire resistant and soft. Since it is a board material, it has a good soundproofing effect as a sound absorbing board, and can be used as a very useful sound absorbing board for ceiling boards and side wall boards of buildings.
次に水バルクセラミツク繊維より成る中間の厚
板層Ｃは水には分散し易いが軽くて膨潤性があ
り、衝撃にも強いため前記のリン酸エステル化パ
ルプのような難燃処理したパルプの薄板層Ａ，Ｂ
と１体に抄紙して使用すれば、板材全体が軟質で
若干の弾力性もあり耐衝撃性に富み防音を目的と
した建築用に使用して至極好適な板材である。 Next, the middle thick plate layer C, which is made of water bulk ceramic fibers, is easily dispersed in water, but is light, swellable, and resistant to impact. Thin layer A, B
When used as a single piece of paper, the entire board is soft, has some elasticity, and is highly impact resistant, making it extremely suitable for use in construction for soundproofing purposes.
尚、製作費も廉価で材質が軽量のため運搬取扱
いにも至便である等近代の騒音による公害防止を
目的とする建築資材として有用な考案である。 In addition, the production cost is low and the material is lightweight, making it easy to transport and handle, making it a useful device as a building material for the purpose of preventing pollution caused by modern noise.
図面はこの考案の実施例図を示すもので、第１
図は板材の拡大断面図、第２図は要部を切欠した
拡大斜面図である。
Ａ，Ｂ……パルプより成る薄板層、Ｃ……セラ
ミツク繊維より成る厚板層。
The drawing shows an embodiment of this invention.
The figure is an enlarged cross-sectional view of the plate material, and FIG. 2 is an enlarged perspective view with important parts cut away. A, B... thin plate layer made of pulp, C... thick plate layer made of ceramic fiber.
Claims (1)
プより成る上下の薄板層Ａ，Ｂ間に水バルクセラ
ミツク繊維より成る厚板層Ｃを挟入し、上記三層
の板を適宜の手段で１体に固着形成して成る難燃
性建築用吸音板。 A thick plate layer C made of water bulk ceramic fiber is inserted between the upper and lower thin plate layers A and B made of phosphoric acid esterified pulp or flame-retardant pulp, and the above three layers are combined into one body by an appropriate means. A flame-retardant sound-absorbing board for construction that is formed by bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15559980U JPS6139555Y2 (en) | 1980-10-30 | 1980-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15559980U JPS6139555Y2 (en) | 1980-10-30 | 1980-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5777511U JPS5777511U (en) | 1982-05-13 |
| JPS6139555Y2 true JPS6139555Y2 (en) | 1986-11-13 |
Family
ID=29514781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15559980U Expired JPS6139555Y2 (en) | 1980-10-30 | 1980-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6139555Y2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7102208B1 (en) | 1999-10-15 | 2006-09-05 | Amkor Technology, Inc. | Leadframe and semiconductor package with improved solder joint strength |
| US8691632B1 (en) | 2002-11-08 | 2014-04-08 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
| US9159672B1 (en) | 2010-08-02 | 2015-10-13 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US9324614B1 (en) | 2010-04-06 | 2016-04-26 | Amkor Technology, Inc. | Through via nub reveal method and structure |
| US9431323B1 (en) | 2011-11-29 | 2016-08-30 | Amkor Technology, Inc. | Conductive pad on protruding through electrode |
-
1980
- 1980-10-30 JP JP15559980U patent/JPS6139555Y2/ja not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7102208B1 (en) | 1999-10-15 | 2006-09-05 | Amkor Technology, Inc. | Leadframe and semiconductor package with improved solder joint strength |
| US8691632B1 (en) | 2002-11-08 | 2014-04-08 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
| US9324614B1 (en) | 2010-04-06 | 2016-04-26 | Amkor Technology, Inc. | Through via nub reveal method and structure |
| US9159672B1 (en) | 2010-08-02 | 2015-10-13 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US9431323B1 (en) | 2011-11-29 | 2016-08-30 | Amkor Technology, Inc. | Conductive pad on protruding through electrode |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5777511U (en) | 1982-05-13 |
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